ADS1115

ADS111x Ultra-Small, Low-Power, I<sup>2</sup>C-Compatible, 860SPS, 16-Bit ADCs with Internal Reference, Oscillator, and Programmable Comparator

Manufacturer

Texas Instruments

Overview

Part: ADS111x Type: 16-Bit Analog-to-Digital Converter (ADC)

Key Specs:

  • Supply Range: 2.0V to 5.5V
  • Current Consumption: 150µA (continuous-conversion mode)
  • Programmable Data Rate: 8SPS to 860SPS
  • Resolution: 16-Bit
  • Operating Temperature Range: -40°C to +125°C
  • PGA Input Ranges: ±256mV to ±6.144V (for ADS1114 and ADS1115)

Features:

  • Ultra-small packages
  • Single-cycle settling
  • Internal low-drift voltage reference
  • Internal oscillator
  • I²C interface: four pin-selectable addresses
  • Programmable Gain Amplifier (PGA) (ADS1114, ADS1115)
  • Digital comparator (ADS1114, ADS1115)
  • Input multiplexer (MUX) (ADS1115)
  • Family of devices with varying input channels and features

Applications:

  • Portable instrumentation
  • Battery voltage and current monitoring
  • Temperature measurement systems
  • Consumer electronics
  • Factory automation and process control

Package:

  • X2QFN (RUG, 10): 1.50mm × 2.00mm × 0.4mm
  • SOT (DYN, 10): 2.90mm ×

Features

  • Ultra-small packages:
    • X2QFN: 2mm × 1.5mm × 0.4mm
    • SOT: 2.9mm × 2.8mm × 0.6mm
  • Wide supply range: 2.0V to 5.5V
  • Low current consumption: 150µA (continuous-conversion mode)
  • Programmable data rate: 8SPS to 860SPS
  • Single-cycle settling
  • Internal low-drift voltage reference
  • Internal oscillator
  • I2C interface: four pin-selectable addresses
  • Operating temperature range: -40°C to +125°C
  • Family of devices:
    • ADS1113: one single-ended (SE) or differential
    • ADS1114: one single-ended or differential input with comparator and PGA
    • ADS1115: four single-ended or two differential inputs with comparator and PGA

Applications

  • Portable instrumentation
  • Battery voltage and current monitoring
  • Temperature measurement systems
  • Consumer electronics
  • Factory automation and process control

Pin Configuration

Figure 4-1. RUG Package, 10-Pin (Top View)

Figure 4-2. DYN and DGS Packages, 10-Pin (Top View)

Table 4-1. Pin Functions: RUG, DYN, and DGS Packages

| | PIN | |-----------|---------|---------|---------|----------------|---------------------------------------------------------------------------------------------------------------------------------| | NAME | ADS1113 | ADS1114 | ADS1115 | TYPE | DESCRIPTION(1) | | ADDR | 1 | 1 | 1 | Digital input | 2C target address select
I | | AIN0 | 4 | 4 | 4 | Analog input | Analog input 0 | | AIN1 | 5 | 5 | 5 | Analog input | Analog input 1 | | AIN2 | — | — | 6 | Analog input | Analog input 2 (ADS1115 only) | | AIN3 | — | — | 7 | Analog input | Analog input 3 (ADS1115 only) | | ALERT/RDY | — | 2 | 2 | Digital output | Comparator output or conversion ready (ADS1114 and ADS1115 only).
Open-drain output. Connect to VDD using a pullup resistor. | | GND | 3 | 3 | 3 | Analog | Ground | | NC | 2, 6, 7 | 6, 7 | — | — | No connect. Leave the pin floating or connect to GND. | | SCL | 10 | 10 | 10 | Digital input | Serial clock input. Connect to VDD using a pullup resistor. | | SDA | 9 | 9 | 9 | Digital I/O | Serial data input and output. Connect to VDD using a pullup resistor. | | VDD | 8 | 8 | 8 | Analog | Power supply. Connect a 0.1μF, power-supply decoupling capacitor to GND. |

(1) See the Unused Inputs and Outputs section for unused pin connections.

Electrical Characteristics

at VDD = 3.3V, data rate = 8SPS, and full-scale input voltage range (FSR) = ±2.048V (unless otherwise noted); maximum and minimum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C

| | PARAMETER | and minimum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C
TEST CONDITIONS | MIN | TYP | MAX | UNIT | |--------------|--------------------------------|------------------------------------------------------------------------------------------------------------------------|-----------------------------------|--------|---------|--------|--| | ANALOG INPUT | | | | FSR = ±6.144V(1) | | 10 | | | Common-mode input | FSR = ±4.096V(1), FSR = ±2.048V | | 6 | | | impedance | FSR = ±1.024V | | 3 | | MΩ | | | | FSR = ±0.512V, FSR = ±0.256V | | 100 | | | | FSR = ±6.144V(1) | | 22 | | | | FSR = ±4.096V(1) | | 15 | | | Differential input impedance | FSR = ±2.048V | | 4.9 | | MΩ | | | | FSR = ±1.024V | | 2.4 | | | | FSR = ±0.512V, ±0.256V | | 710 | | kΩ | | | SYSTEM PERFORMANCE | | | Resolution (no missing codes) | | 16 | | | Bits | | DR | Data rate | | 8, 16, 32, 64, 128, 250, 475, 860 | | | SPS | | | Data rate variation | All data rates | –10% | | 10% | | | Output noise | | See Noise Performance section | | INL | Integral nonlinearity | DR = 8SPS, FSR = ±2.048V(2) | | | 1 | LSB | | | | FSR = ±2.048V, differential inputs | –3 | ±1 | 3 | | | Offset error | FSR = ±2.048V, single-ended inputs | | ±3 | | LSB | | | Offset drift over temperature | FSR = ±2.048V | | 0.005 | | LSB/°C | | | Long-term Offset drift | FSR = ±2.048V, TA = 125°C,
1000 hours | | ±1 | | LSB | | | Offset power-supply rejection | FSR = ±2.048V, DC supply variation | | 1 | | LSB/V | | | Offset channel match | Match between any two inputs | | 3 | | LSB | | | Gain error(3) | FSR = ±2.048V, TA = 25°C | | 0.01% | 0.15% | | | | FSR = ±0.256V | | 7 | | | Gain drift over temperature(3) | FSR = ±2.048V | | 5 | 40 | ppm/°C | | | | FSR = ±6.144V(1) | | 5 | | | Long-term gain drift(3) | FSR = ±2.048V, TA = 125°C,
1000 hours | | ±0.05% | | | Gain power-supply rejection | | | 80 | | ppm/V | | | Gain match(3) | Match between any two gains | | 0.02% | 0.1% | | | Gain channel match | Match between any two inputs | | 0.05% | 0.1% | | | | At DC, FSR = ±0.256V | | 105 | | | | At DC, FSR = ±2.048V | | 100 | | CMRR | Common-mode rejection ratio | At DC, FSR = ±6.144V(1) | | 90 | | dB | | | | fCM = 60Hz, DR = 8SPS | | 105 | | | | fCM = 50Hz, DR = 8SPS | | 105 | | | DIGITAL INPUT/OUTPUT | | VIH | High-level input voltage | | 0.7 VDD | | 5.5 | V | | VIL | Low-level input voltage | | GND | | 0.3 VDD | V | | VOL | Low-level output voltage | IOL = 3mA | GND | 0.15 | 0.4 | V | | | Input leakage current | GND < VDIG < VDD | –10 | | 10 | µA |

Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)

MINMAXUNIT
Power-supply voltageVDD to GND–0.37V
Analog input voltageAIN0, AIN1, AIN2, AIN3GND – 0.3VDD + 0.3V
Digital input voltageSDA, SCL, ADDR, ALERT/RDYGND – 0.35.5V
Input current, continuousAny pin except power supply pins–1010mA
Operating ambient, TA–40125
TemperatureJunction, TJ–40150°C
Storage, Tstg–60150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Recommended Operating Conditions

MINNOM
MAX
UNIT
POWER SUPPLY
Power supply (VDD to GND)25.5V
ANALOG INPUTS(1)
FSRFull-scale input voltage range(2) (VIN = V(AINP) – V(AINN))±0.256±6.144V
V(AINx)Absolute input voltageGNDVDDV
DIGITAL INPUTS
VDIGDigital input voltageGND5.5V
TEMPERATURE
TAOperating ambient temperature–40125°C
  • (1) AINP and AINN denote the selected positive and negative inputs. AINx denotes one of the four available analog inputs.
  • (2) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3V must be applied to the analog inputs of the device. See Table 7-1 for more information.

5.4 Thermal Information

| | | RUG (X2QFN) | DYN (SOT) | DGS (VSSOP) | |-----------|----------------------------------------------|-------------|-----------|-------------|------| | | THERMAL METRIC(1) | 10 PINS | 10 PINS | 10 PINS | UNIT | | RθJA | Junction-to-ambient thermal resistance | 245.2 | 147.1 | 182.7 | °C/W | | RθJC(top) | Junction-to-case (top) thermal resistance | 69.3 | 59.3 | 67.2 | °C/W | | RθJB | Junction-to-board thermal resistance | 172.0 | 71.3 | 103.8 | °C/W | | ψJT | Junction-to-top characterization parameter | 8.2 | 2.8 | 10.2 | °C/W | | ψJB | Junction-to-board characterization parameter | 170.8 | 70.4 | 102.1 | °C/W | | RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

Thermal Information

| | | RUG (X2QFN) | DYN (SOT) | DGS (VSSOP) | |-----------|----------------------------------------------|-------------|-----------|-------------|------| | | THERMAL METRIC(1) | 10 PINS | 10 PINS | 10 PINS | UNIT | | RθJA | Junction-to-ambient thermal resistance | 245.2 | 147.1 | 182.7 | °C/W | | RθJC(top) | Junction-to-case (top) thermal resistance | 69.3 | 59.3 | 67.2 | °C/W | | RθJB | Junction-to-board thermal resistance | 172.0 | 71.3 | 103.8 | °C/W | | ψJT | Junction-to-top characterization parameter | 8.2 | 2.8 | 10.2 | °C/W | | ψJB | Junction-to-board characterization parameter | 170.8 | 70.4 | 102.1 | °C/W | | RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | °C/W |

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

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