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20N06D

Power MOSFET

The 20N06D is a power mosfet from ON Semiconductor. View the full 20N06D datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

ON Semiconductor

Category

MOSFETs

Package

DPAK, DPAK Straight Lead

Key Specifications

ParameterValue
Gate Threshold Voltage1.0V to 2.0V
Drain-To-Source Voltage60 V
Drain Current (Continuous @ 25°C)20 Adc
Total Power Dissipation (TA=25°C)60 W
Operating And Storage Temperature Range-55°C to 150°C
Static Drain-To-Source On-Resistance (VGS=5.0V, ID=10A)39 mΩ

Overview

Part: NTD20N06L — ON Semiconductor

Type: N-Channel Logic Level Power MOSFET

Description: 60 V, 20 A N-Channel logic level power MOSFET with 39 mΩ typical R_DS(on) designed for low voltage, high speed switching applications.

Operating Conditions:

  • Drain-to-Source Voltage: up to 60 V
  • Gate-to-Source Voltage: ±15 V continuous
  • Operating temperature: -55 to +150 °C

Absolute Maximum Ratings:

  • Max Drain-to-Source Voltage: 60 Vdc
  • Max continuous Drain Current: 20 Adc (@ T_A = 25 °C)
  • Max Junction/Storage Temperature: 150 °C

Key Specs:

  • Drain-to-Source Breakdown Voltage (V_BR)DSS: 60 V (min) @ V_GS = 0 Vdc, I_D = 250 mAdc
  • Gate Threshold Voltage (V_GS(th)): 1.0 V (min), 1.6 V (typ), 2.0 V (max) @ V_DS = V_GS, I_D = 250 mAdc
  • Static Drain-to-Source On-Resistance (R_DS(on)): 39 mΩ (typ), 48 mΩ (max) @ V_GS = 5.0 Vdc, I_D = 10 Adc
  • Zero Gate Voltage Drain Current (I_DSS): 1.0 mA (max) @ V_DS = 60 Vdc, V_GS = 0 Vdc
  • Input Capacitance (C_iss): 707 pF (typ), 990 pF (max) @ V_DS = 25 Vdc, V_GS = 0 Vdc, f = 1.0 MHz
  • Total Gate Charge (Q_T): 16.6 nC (typ), 32 nC (max) @ V_DS = 48 Vdc, I_D = 20 Adc, V_GS = 5.0 Vdc
  • Turn-On Delay Time (t_d(on)): 9.6 ns (typ), 20 ns (max) @ V_DD = 30 Vdc, I_D = 20 Adc, V_GS = 5.0 Vdc, R_G = 9.1 Ω
  • Reverse Recovery Time (t_rr): 42 ns (typ) @ I_S = 20 Adc, V_GS = 0 Vdc, dI_S/dt = 100 A/μs

Features:

  • Logic Level Gate Drive
  • Low R_DS(on)
  • High-speed switching
  • Designed for low voltage applications

Applications:

  • Converters
  • Power Supplies
  • Power Motor Controls
  • Bridge Circuits

Package:

  • DPAK (CASE 369C Style 2)
  • DPAK Straight Lead

Applications

  • Converters
  • Power Supplies
  • Power Motor Controls
  • Bridge Circuits

Pin Configuration

NTD20N06L — DPAK Package Pinout

Pin NumberPin NameTypeDescription
1GIGate
2DODrain
3SOSource
4DODrain (Tab)

Notes

  • DPAK Case 369C/369D: This is a 3-pin logic-level N-channel power MOSFET in DPAK surface-mount package with an exposed drain tab (pin 4).
  • Pin 2 and Pin 4 are internally connected: Both are drain connections; pin 4 is the large exposed metal tab for enhanced thermal dissipation.
  • Part number clarification: The datasheet covers the NTD20N06L family. The requested part "20N06D" appears to be a shorthand reference; the full part number is NTD20N06L (standard DPAK) or variants like NTD20N06L-1 (straight lead) or NTD20N06LT4 (tape & reel). All variants use the same 3-pin DPAK pinout shown above.

Electrical Characteristics

CharacteristicCharacteristicSymbolMinTypMaxUnit
OFF CHARACTERISTICSOFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage (Note 3.) (V GS = 0 Vdc, I D = 250 m Adc) Temperature Coefficient (Positive)Drain-to-Source Breakdown Voltage (Note 3.) (V GS = 0 Vdc, I D = 250 m Adc) Temperature Coefficient (Positive)V (BR)DSS60 -71.3 71.2- -Vdc mV/ ° C
Zero Gate Voltage Drain Current (V DS = 60 Vdc, V GS = 0 Vdc) (V DS = 60 Vdc, V GS = 0 Vdc, T J = 150 ° C)Zero Gate Voltage Drain Current (V DS = 60 Vdc, V GS = 0 Vdc) (V DS = 60 Vdc, V GS = 0 Vdc, T J = 150 ° C)I DSS- -- -1.0 10m Adc
Gate-Body Leakage Current (V GS = ± 15 Vdc, V DS = 0 Vdc)Gate-Body Leakage Current (V GS = ± 15 Vdc, V DS = 0 Vdc)I GSS--± 100nAdc
ON CHARACTERISTICS (Note 3.)ON CHARACTERISTICS (Note 3.)
Gate Threshold Voltage (Note 3.) (V DS = V GS , I D = 250 m Adc) Threshold Temperature Coefficient (Negative)Gate Threshold Voltage (Note 3.) (V DS = V GS , I D = 250 m Adc) Threshold Temperature Coefficient (Negative)V GS(th)1.0 -1.6 4.62.0 -Vdc mV/ ° C
Static Drain-to-Source On-Resistance (Note 3.) (V GS = 5.0 Vdc, I D = 10 Adc)Static Drain-to-Source On-Resistance (Note 3.) (V GS = 5.0 Vdc, I D = 10 Adc)R DS(on)-3948m W
Static Drain-to-Source On-Resistance (Note 3.) (V GS = 5.0 Vdc, I D = 20 Adc) (V GS = 5.0 Vdc, I D = 10 Adc, T J = 150 ° C)Static Drain-to-Source On-Resistance (Note 3.) (V GS = 5.0 Vdc, I D = 20 Adc) (V GS = 5.0 Vdc, I D = 10 Adc, T J = 150 ° C)V DS(on)- -0.81 0.721.66 -Vdc
Forward Transconductance (Note 3.) (V DS = 4.0 Vdc, I D = 10 Adc)Forward Transconductance (Note 3.) (V DS = 4.0 Vdc, I D = 10 Adc)g FS-17.5-mhos
DYNAMIC CHARACTERISTICSDYNAMIC CHARACTERISTICS
Input Capacitance(V 25 Vd V 0 Vd (V DS = 25 Vdc, V GS = 0 Vdc, f = 1.0 MHz) f = 1.0 MHz)C iss-707990pF
Output Capacitance(V 25 Vd V 0 Vd (V DS = 25 Vdc, V GS = 0 Vdc, f = 1.0 MHz) f = 1.0 MHz)C oss-224320pF
Transfer CapacitanceTransfer CapacitanceC rss-72105pF
SWITCHING CHARACTERISTICS (Note 4.)SWITCHING CHARACTERISTICS (Note 4.)
Turn-On Delay Time(V DD = 30 Vdc, I D = 20 Adc, V GS = 5 0 Vdc V GS = 5.0 Vdc, R G = 9.1 W ) (Note 3.) R G 9.1 W ) (Note 3.)t d(on)-9.620ns
Rise Time(V DD = 30 Vdc, I D = 20 Adc, V GS = 5 0 Vdc V GS = 5.0 Vdc, R G = 9.1 W ) (Note 3.) R G 9.1 W ) (Note 3.)t r-98200ns
Turn-Off Delay Time(V DD = 30 Vdc, I D = 20 Adc, V GS = 5 0 Vdc V GS = 5.0 Vdc, R G = 9.1 W ) (Note 3.) R G 9.1 W ) (Note 3.)t d(off)-2550ns
Fall Time(V DD = 30 Vdc, I D = 20 Adc, V GS = 5 0 Vdc V GS = 5.0 Vdc, R G = 9.1 W ) (Note 3.) R G 9.1 W ) (Note 3.)t f-62120ns
Gate Charge(V 48 Vd I 20 Ad (V DS = 48 Vdc, I D = 20 Adc, V GS = 5.0 Vdc) (Note 3.) V GS = 5.0 Vdc) (Note 3.)Q T-16.632nC
(V 48 Vd I 20 Ad (V DS = 48 Vdc, I D = 20 Adc, V GS = 5.0 Vdc) (Note 3.) V GS = 5.0 Vdc) (Note 3.)Q 1-5.5-nC
(V 48 Vd I 20 Ad (V DS = 48 Vdc, I D = 20 Adc, V GS = 5.0 Vdc) (Note 3.) V GS = 5.0 Vdc) (Note 3.)Q 2-8.5-nC
SOURCE-DRAIN DIODE CHARACTERISTICSSOURCE-DRAIN DIODE CHARACTERISTICS
Forward On-Voltage(I S = 20 Adc, V GS = 0 Vdc) (Note 3.) (I S = 20 Adc, V GS = 0 Vdc, T J = 150 ° C)V SD- -0.97 0.851.2 -Vdc
Reverse Recovery Time(I 20 Ad V 0 Vd (I S = 20 Adc, V GS = 0 Vdc, dI S /dt = 100 A/ m s) (Note 3.) dI S /dt = 100 A/ m s) (Note 3.)t rr-42-ns
Reverse Recovery Time(I 20 Ad V 0 Vd (I S = 20 Adc, V GS = 0 Vdc, dI S /dt = 100 A/ m s) (Note 3.) dI S /dt = 100 A/ m s) (Note 3.)t a-30-ns
Reverse Recovery Time(I 20 Ad V 0 Vd (I S = 20 Adc, V GS = 0 Vdc, dI S /dt = 100 A/ m s) (Note 3.) dI S /dt = 100 A/ m s) (Note 3.)t b-12-ns
Reverse Recovery Stored ChargeReverse Recovery Stored ChargeQ RR-0.066-m C
  1. Pulse Test: Pulse Width ≤ 300 m s, Duty Cycle ≤ 2%.

  2. Switching characteristics are independent of operating junction temperatures.

Absolute Maximum Ratings

RatingSymbolValueUnit
Drain-to-Source VoltageV DSS60Vdc
Drain-to-Gate Voltage (R GS = 10M W )V DGR60Vdc
Gate-to-Source VoltageVdc
- ContinuousV GS15
- Non-repetitive (t p 10 ms)V GS20
Drain Current
Continuous@T A = 25 ° CI D20Adc
- - Continuous@T A = 100 ° CI D10
- Single Pulse (t p 10 m s)I DM60Apk
Total Power Dissipation@T A = 25 ° CP D60W
Derate above 25 ° C0.40 1.88W/ ° C W
Total Power Dissipation@T A = 25 ° C (Note 1.) Total Power Dissipation@T = 25 C (Note 2.)1.36W
A °
Operating and Storage Temperature RangeT J , T stg-55 to° C
Single Pulse Drain-to-Source AvalancheE AS128mJ
Energy - Starting T J = 25 ° C (V DD = 25 Vdc, V GS = 5.0 Vdc, = 60
L = 1.0 mH, I L (pk) = 16 A, V DS Vdc)° C/W
Thermal Resistance - Junction-to-CaseR q JC2.5
- Junction-to-Ambient (Note 1.)R q JA80
- Junction-to-Ambient (Note 2.)R q JA110
Maximum Lead Temperature for Soldering Purposes, 1/8 ″ from case for 10 secondsT L260° C

Typical Application

  • Converters
  • Power Supplies
  • Power Motor Controls
  • Bridge Circuits

Package Information

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
20N06LON Semiconductor
NTD20N06LON Semiconductor
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