W25Q64JV-IM/JM
The W25Q64JV-IM/JM is an electronic component from Winbond. View the full W25Q64JV-IM/JM datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Winbond
Overview
Part: Not specified in the provided text.
Type: Serial Flash Memory
Description: 64M-bit serial flash memory with 3V nominal operation, supporting Standard, Dual, and Quad SPI interfaces.
Operating Conditions:
- Supply voltage: 3V nominal
- Interface: Standard SPI, Dual SPI, Quad SPI
Absolute Maximum Ratings:
Key Specs:
- Memory Size: 64M-bit
- Interface Modes: Standard SPI, Dual SPI, Quad SPI
- Operating Voltage: 3V
- Erase/Program Suspend and Resume functionality
- Multiple Write Protection features (Block Protect, Top/Bottom Protect, Sector/Block Protect, Complement Protect, Status Register Protect)
- Security Register Lock Bits (Volatile/Non-Volatile OTP Writable)
- Output Driver Strength control (DRV1, DRV0)
- Quad Enable (QE) bit for Quad SPI operation
Features:
Applications:
Package:
- SOIC 208-mil
- WSON 6x5-mm
- WSON 8x6-mm
- XSON 4x4-mm
- SOIC 300-mil
- TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
- WLCSP
Features
- New Family of SpiFlash Memories Advanced Security Features
- W25Q64JV: 64M-bit / 8M-byte
- Standard SPI: CLK, /CS, DI, DO
- Dual SPI: CLK, /CS, IO0, IO1
- Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3
- Software & Hardware Reset (1)
- Highest Performance Serial Flash
- 133MHz Single, Dual/Quad SPI clocks
- 266/532MHz equivalent Dual/Quad SPI
- Min. 100K Program-Erase cycles per sector
- More than 20-year data retention
- Low Power, Wide Temperature Range
- Single 2.7 to 3.6V supply
- <1μA Power-down (typ.)
- -40°C to +85°C operating range
- -40°C to +105°C operating range
- Flexible Architecture with 4KB sectors
- Uniform Sector/Block Erase (4K/32K/64K-Byte)
- Program 1 to 256 byte per programmable page
- Erase/Program Suspend & Resume
Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages
- Software and Hardware Write-Protect
- Special OTP protection
- Top/Bottom, Complement array protection
- Individual Block/Sector array protection
- 64-Bit Unique ID for each device
- Discoverable Parameters (SFDP) Register
- 3X256-Bytes Security Registers
- Volatile & Non-volatile Status Register Bits
- Space Efficient Packaging
- 8-pin SOIC 208-mil
- 8-pad WSON 6x5-mm/8x6-mm
- 16-pin SOIC 300-mil
- 8-pad XSON 4x4-mm
- 24-ball TFBGA 8x6-mm (6x4 ball array)
- 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
- 12-ball WLCSP
- Contact Winbond for KGD and other options
Pin Configuration
Figure 1a. W25Q64JV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
Electrical Characteristics
| PARAMETER | SYMBOL | CONDITIONS | SPEC | SPEC | SPEC | UNIT |
|---|---|---|---|---|---|---|
| PARAMETER | SYMBOL | CONDITIONS | MIN | TYP | MAX | UNIT |
| Input Capacitance | CIN (1) | VIN = 0V (1) | 6 | pF | ||
| Output Capacitance | Cout (1) | VOUT = 0V (1) | 8 | pF | ||
| Input Leakage | I LI | ±2 | μA | |||
| I/O Leakage | ILO | ±2 | μA | |||
| Standby Current | ICC1 | /CS = VCC, VIN = GND or VCC | 10 | 50 | μA | |
| Power-down Current | ICC2 | /CS = VCC, VIN = GND or VCC | 1 | 15 | μA | |
| Current Read Data / Dual /Quad 50MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 8 | 15 | mA | |
| Current Read Data / Dual /Quad 80MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 10 | 18 | mA | |
| Current Read Data / Dual Output Read/Quad Output Read 104MHz (2) | ICC3 | C = 0.1 VCC / 0.9 VCC DO = Open | 12 | 20 | mA | |
| Current Write Status Register | ICC4 | /CS = VCC | 20 | 25 | mA | |
| Current Page Program | ICC5 | /CS = VCC | 20 | 25 | mA | |
| Current Sector/Block Erase | ICC6 | /CS = VCC | 20 | 25 | mA | |
| Current Chip Erase | ICC7 | /CS = VCC | 20 | 25 | mA | |
| Input Low Voltage | VIL | -0.5 | VCC x 0.3 | V | ||
| Input High Voltage | VIH | VCC x 0.7 | VCC + 0.4 | V | ||
| Output Low Voltage | VOL | IOL = 100 μA | 0.2 | V | ||
| Output High Voltage | VOH | IOH = -100 μA | VCC - 0.2 | V |
Absolute Maximum Ratings
| PARAMETERS | SYMBOL | CONDITIONS | RANGE | UNIT |
|---|---|---|---|---|
| Supply Voltage | VCC | -0.6 to 4.6 | V | |
| Voltage Applied to Any Pin | VIO | Relative to Ground | -0.6 to VCC+0.4 | V |
| Transient Voltage on any Pin | VIOT | <20nS Transient Relative to Ground | -2.0V to VCC+2.0V | V |
| Storage Temperature | TSTG | -65 to +150 | ° C | |
| Lead Temperature | TLEAD | See Note (2) | ° C | |
| Electrostatic Discharge Voltage | VESD | Human Body Model (3) | -2000 to +2000 | V |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| W25Q64JV | Winbond | — |
| W25Q64JV-IM | Winbond | — |
| W25Q64JV-IQ/JQ | Winbond | — |
| W25Q64JVBYIQ | Winbond | — |
| W25Q64JVSFIM | Winbond | — |
| W25Q64JVSFIQ | Winbond | — |
| W25Q64JVSFJM | Winbond | — |
| W25Q64JVSFJQ | Winbond | — |
| W25Q64JVSSIM | Winbond | — |
| W25Q64JVSSIQ | Winbond | — |
| W25Q64JVSSJM | Winbond | — |
| W25Q64JVSSJQ | Winbond | — |
| W25Q64JVTBIM | Winbond | — |
| W25Q64JVTBIQ | Winbond | — |
| W25Q64JVTBJQ | Winbond | — |
| W25Q64JVTCIQ | Winbond | — |
| W25Q64JVTCJQ | Winbond | — |
| W25Q64JVXGIM | Winbond | — |
| W25Q64JVXGIQ | Winbond | — |
| W25Q64JVXGJM | Winbond | — |
| W25Q64JVXGJQ | Winbond | — |
| W25Q64JVZEIM | Winbond | — |
| W25Q64JVZEIQ | Winbond | — |
| W25Q64JVZEJM | Winbond | — |
| W25Q64JVZEJQ | Winbond | — |
| W25Q64JVZPIM | Winbond | — |
| W25Q64JVZPIQ | Winbond | — |
| W25Q64JVZPJM | Winbond | — |
| W25Q64JVZPJQ | Winbond | — |
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