W25Q64JVTCJQ

Part: W25Q64JV (Winbond)

Type: 3V 64M-bit Serial Flash Memory with Dual, Quad SPI

Key Specs:

• Memory Size: 64M-bit
• Operating Voltage: 2.7V to 3.6V
• Power-down Current: 1μA
• Page Size: 256-bytes
• Programmable Pages: 32,

New Family of SpiFlash Memories

• W25Q64JV: 64M-bit / 8M-byte
• Standard SPI: CLK, /CS, DI, DO
• Dual SPI: CLK, /CS, IO0, IO¹
• Quad SPI: CLK, /CS, IO0, IO1, IO2, IO³
• Software & Hardware Reset(1)

Highest Performance Serial Flash

• 133MHz Single, Dual/Quad SPI clocks
• 266/532MHz equivalent Dual/Quad SPI
• Min. 100K Program-Erase cycles per sector
• More than 20-year data retention

Low Power, Wide Temperature Range

• Single 2.7 to 3.6V supply
• <1μA Power-down (typ.)
• -40°C to +85°C operating range
• -40°C to +105°C operating range

Flexible Architecture with 4KB sectors

• Uniform Sector/Block Erase (4K/32K/64K-Byte)
• Program 1 to 256 byte per programmable page
• Erase/Program Suspend & Resume

Advanced Security Features

• Software and Hardware Write-Protect
• Special OTP protection
• Top/Bottom, Complement array protection
• Individual Block/Sector array protection
• 64-Bit Unique ID for each device
• Discoverable Parameters (SFDP) Register
• 3X256-Bytes Security Registers
• Volatile & Non-volatile Status Register Bits

Space Efficient Packaging

• 8-pin SOIC 208-mil
• 8-pad WSON 6x5-mm/8x6-mm
• 16-pin SOIC 300-mil
• 8-pad XSON 4x4-mm
• 24-ball TFBGA 8x6-mm (6x4 ball array)
• 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
• 12-ball WLCSP
• Contact Winbond for KGD and other options

Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

3.1 Pin Configuration SOIC 208-mil

Figure 1a. W25Q64JV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)