The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, stepdown, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermallyenhanced QFN package. The 5-mm x 5.5-mm x 4mm, 15-pin package uses Enhanced HotRod QFN technology for improved thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external and magnetics part selection from the design process.

components and eliminates the loop compensation The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.

• 5-mm × 5.5-mm × 4-mm Enhanced HotRod QFN package
• -85-mm 2 solution size (single sided)
• -Low EMI: Meets CISPR11 radiated emissions
• -Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
• -Standard footprint: single large thermal pad and all pins accessible from perimeter
• Input voltage range: 3.8 V to 36 V
• Output voltage range: 1 V to 7 V
• Efficiency up to 95%
• Power-good flag
• Precision enable
• Built-in hiccup-mode short-circuit protection, overtemperature protection, start-up into pre-bias output, soft start, and UVLO
• Operating IC junction range: -40°C to +125°C
• Operating ambient range: -40°C to +105°C
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
• Create a custom design using the TPSM53602 with the WEBENCH ® Power Designer
• Download the EVM Design Files for fast board design

• General purpose wide VIN power supplies
• Factory automation and control
• Test and measurement
• Aerospace and defense
• Negative output voltage applications

TPSM53602RDAR Pinout

Package: 15-PowerBQFN Module

Notes

• Pins 7 and 8 are both VOUT (output voltage) and should be connected together.
• Pins 1 and 14 are both VIN (input supply) and should be connected together.
• Pins 4 and 5 are marked DNC (Do Not Connect) — leave unconnected.
• Pins 3, 10, and 11 are marked NC (No Connect) — leave unconnected.
• Pin 15 (PGND) is the central power ground pad and should be soldered to the PCB ground plane.

Limits apply over T A = -40°C to +105°C, VIN = 12 V, VOUT = 3.3 V, I OUT = IOUT maximum, (unless otherwise noted); CIN1 = 2x10 μF, 50-V, 1206 ceramic; C IN2 = 100 nF, 50-V, 0603 ceramic; C OUT = 3x22 μF, 25-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only.

Limits apply over T A = -40°C to +105°C, VIN = 12 V, VOUT = 3.3 V, I OUT = IOUT maximum, (unless otherwise noted); CIN1 = 2x10 μF, 50-V, 1206 ceramic; C IN2 = 100 nF, 50-V, 0603 ceramic; C OUT = 3x22 μF, 25-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only.

Over the recommended operating junction temperature range (1)

• (3) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.

Over operating ambient temperature range (unless otherwise noted) (1)

The TPSM53602 is a synchronous, step-down, DC/DC power module. It is used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 2 A. The TPSM53602 can be configured in a negative output voltage, inverting buck-boost (IBB) topology. For more details, see the Negative Output Voltage using the TPSM53602/3/4 application note. The following design procedure can be used to select components for the TPSM53602. Alternately, the WEBENCH ® software can be used to generate complete designs. When generating a design, the WEBENCH ® software uses an iterative design procedure and accesses comprehensive databases of components. See www.ti.com for more details.