TPSM53602/3/4

Part: TPSM53602 (TPSM53602RDAR) — Texas Instruments

Type: Step-Down DC/DC Power Module (Buck Converter with Integrated Inductor)

Description: 3.8–36 V input, 1–7 V output, 2 A power module with integrated MOSFETs and shielded inductor in a 5 mm × 5.5 mm × 4 mm Enhanced HotRod QFN package, with efficiency up to 95%.

Operating Conditions:

• Supply voltage: 3.8–36 V (minimum is 3.8 V or VOUT + 1 V, whichever is greater)
• Operating ambient temperature: -40 to 105 °C
• Output voltage: 1–7 V
• Output current: 0–2 A
• Minimum ceramic input capacitance: 20 μF

Absolute Maximum Ratings:

• Max input voltage (VIN to PGND): 38 V
• Max junction temperature: 150 °C
• Storage temperature: -55 to 150 °C
• Peak reflow case temperature: 245 °C

Key Specs:

• Feedback voltage: 0.985 / 1 / 1.015 V (min/typ/max, -40°C ≤ TJ ≤ 125°C, IOUT = 0.75 A)
• Quiescent current: 24 μA typ (non-switching, VFB = 1.2 V)
• Shutdown supply current: 5 μA typ, 10 μA max (VEN = 0 V)
• Efficiency: 91% typ (IOUT = 2 A, TA = 25°C, VIN = 12 V, VOUT = 3.3 V)
• Over-current threshold: 3.5 A typ
• Max switching frequency: 1.4 MHz typ (IOUT = 2 A, TA = 25°C)
• Internal soft-start time: 4 ms typ
• EN rising threshold: 1.2 / 1.23 / 1.26 V (min/typ/max), with 100 mV hysteresis
• VIN turn-on / turn-off: 3.55 V / 3.05 V typ
• Thermal resistance RθJA: 19.5 °C/W; thermal shutdown 165 °C

Features:

• Enhanced HotRod QFN package with single large thermal pad and all pins accessible from the perimeter
• Approx. 85 mm² single-sided solution size; low EMI, meets CISPR11 radiated emissions
• Up to 14 W output power at 85°C with no airflow
• Power-good flag and precision enable with programmable UVLO
• Hiccup-mode short-circuit protection, overtemperature protection, pre-bias start-up, soft start
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with 3-A TPSM53603 and 4-A TPSM53604
• Functional safety-capable documentation available

Applications:

• General purpose wide VIN power supplies
• Factory automation and control
• Test and measurement
• Aerospace and defense
• Negative output voltage applications

Package:

• B3QFN (RDA), 15 pins, 5.0 mm × 5.5 mm (4 mm height)

• Functional Safety-Capable
• -Documentation available to aid functional safety system design
• 5-mm × 5.5-mm × 4-mm Enhanced HotRod ™ QFN package
• -85-mm 2 solution size (single sided)
• -Low EMI: meets CISPR11 radiated emissions
• -Excellent thermal performance: Up to 14 W output power at 85°C, no airflow
• -Standard footprint: single large thermal pad and all pins accessible from perimeter
• Input voltage range: 3.8 V to 36 V
• Output voltage range: 1 V to 7 V
• Efficiency up to 95%
• Power-good flag
• Precision enable
• Built-in hiccup-mode short-circuit protection, overtemperature protection, start-up into pre-bias output, soft start, and UVLO
• Operating IC junction range: -40°C to +125°C
• Operating ambient range: -40°C to +105°C
• Shock and vibration tested to Mil-STD-883D
• Pin compatible with: 3-A TPSM53603 and 4-A TPSM53604
• Create a custom design using the TPSM53602 with the WEBENCH ® Power Designer
• Download the EVM Design Files for fast board design

• General purpose wide VIN power supplies
• Factory automation and control
• Test and measurement
• Aerospace and defense
• Negative output voltage applications

Figure 5-1. RDA Package 15-Pin QFN Top View

Table 5-1. Pin Functions

Limits apply over T A = -40°C to +105°C, VIN = 12 V, VOUT = 3.3 V, I OUT = IOUT maximum, (unless otherwise noted); CIN1 = 2x10 μF, 50-V, 1206 ceramic; CIN2 = 100 nF, 50-V, 0603 ceramic; COUT = 3x22 μF, 25-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only.

Limits apply over T A = -40°C to +105°C, VIN = 12 V, VOUT = 3.3 V, I OUT = IOUT maximum, (unless otherwise noted); CIN1 = 2x10 μF, 50-V, 1206 ceramic; CIN2 = 100 nF, 50-V, 0603 ceramic; COUT = 3x22 μF, 25-V, 1210 ceramic. Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely parametric norm and are provided for reference only.

Over the recommended operating junction temperature range (1)

• (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions . Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
• (2) The voltage on this pin must not exceed the voltage on the VIN pin by more than 0.3 V.
• (3) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area (SOA) curves in the typical characteristics sections, ensures that the maximum junction temperature of any component inside the module is never exceeded.

Over operating ambient temperature range (unless otherwise noted) (1)

• (3) The recommended minimum VIN is 3.8 V or (VOUT + 1 V), whichever is greater. See the Section 7.3.9 section for more information.

(4) The recommended maximum output voltage varies depending input voltage. See the Section 7.3.9 section for more information.

• (5) Minimum CIN of 20 μF must be ceramic type.
• (6) The minimum amount of required output capacitance varies depending on the output voltage. See Table 7-1.

The TPSM53602 is a synchronous, step-down, DC/DC power module. It is used to convert a higher DC voltage to a lower DC voltage with a maximum output current of 2 A. The TPSM53602 can be configured in a negative output voltage, inverting buck-boost (IBB) topology. For more details, see the Negative Output Voltage using the TPSM53602/3/4 application note. The following design procedure can be used to select components for the TPSM53602. Alternately, the WEBENCH ® software can be used to generate complete designs. When generating a design, the WEBENCH ® software uses an iterative design procedure and accesses comprehensive databases of components. See www.ti.com for more details.