TPN6R303NC,LQ
N-channel MOS (U-MOS) MOSFETThe TPN6R303NC,LQ is a n-channel mos (u-mos) mosfet from Toshiba Semiconductor and Storage. View the full TPN6R303NC,LQ datasheet below including key specifications, absolute maximum ratings.
Manufacturer
Toshiba Semiconductor and Storage
Category
N-channel MOS (U-MOS) MOSFET
Package
8-PowerVDFN
Key Specifications
| Parameter | Value |
|---|---|
| Continuous Drain Current | 20A (Ta) |
| Drain-Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V, 10V |
| FET Type | N-Channel |
| Gate Charge (Qg) | 24 nC @ 10 V |
| Input Capacitance (Ciss) | 1370 pF @ 15 V |
| Mounting Type | Surface Mount |
| Operating Temperature | 150°C (TJ) |
| Package / Case | 8-PowerVDFN |
| Packaging | MouseReel |
| Packaging | MouseReel |
| Power Dissipation (Max) | 700mW (Ta), 19W (Tc) |
| Rds(on) | 6.3mOhm @ 10A, 10V Ω |
| Standard Pack Qty | 3000 |
| Standard Pack Qty | 3000 |
| Supplier Device Package | 8-TSON Advance (3.1x3.1) |
| Supplier Device Package | 8-TSON Advance (3.1x3.1) |
| Diode Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | ±20V |
| Gate Threshold Voltage | 2.3V @ 200µA |
Overview
Part: TPN6R303NC — Toshiba
Type: N-channel MOS (U-MOS) MOSFET
Description: 30 V, 43 A N-channel MOSFET with 5.2 mΩ (typ.) on-resistance at VGS = 10 V.
Operating Conditions:
- Drain-source voltage: up to 30 V
- Gate-source voltage: ±20 V
- Operating temperature: -55 to 150 °C
Absolute Maximum Ratings:
- Drain-source voltage (VDSS): 30 V
- Gate-source voltage (VGSS): ±20 V
- Drain current (ID): 43 A (DC, Silicon limit)
- Channel temperature (Tch): 150 °C
- Storage temperature (Tstg): -55 to 150 °C
Key Specs:
- Drain-source on-resistance (RDS(ON)): 5.2 mΩ (typ.) at VGS = 10 V, ID = 10 A
- Drain-source on-resistance (RDS(ON)): 6.9 mΩ (typ.) at VGS = 4.5 V, ID = 10 A
- Drain cut-off current (IDSS): 10 μA (max) at VDS = 30 V, VGS = 0 V
- Gate threshold voltage (Vth): 1.3 V (min) to 2.3 V (max) at VDS = 10 V, ID = 0.2 mA
- Input capacitance (Ciss): 1370 pF (typ.) at VDS = 15 V, VGS = 0 V, f = 1 MHz
- Total gate charge (Qg): 24 nC (typ.) at VDD ≈ 24 V, VGS = 10 V, ID = 20 A
- Rise time (tr): 6 ns (typ.)
- Fall time (tf): 14 ns (typ.)
Features:
- Small, thin package
- Low drain-source on-resistance: RDS(ON) = 5.2 mΩ (typ.) (VGS = 10 V)
- Low leakage current: IDSS = 10 μA (max) (VDS = 30 V)
- Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 0.2 mA)
Applications:
- Lithium-Ion Secondary Batteries
- Power Management Switches
Package:
- Weight: 0.02 g (typ.)
Features
- (1) Small, thin package
- (2) Low drain-source on-resistance: RDS(ON) = 5.2 m Ω (typ.) (VGS = 10 V)
- (3) Low leakage current: IDSS = 10 μ A (max) (VDS = 30 V)
- (4) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 0.2 mA)
Applications
- Lithium-Ion Secondary Batteries
- Power Management Switches
Absolute Maximum Ratings
| Characteristics | Characteristics | Characteristics | Symbol | Rating | Unit |
|---|---|---|---|---|---|
| Drain-source voltage | V DSS | 30 | V | ||
| Gate-source voltage | V GSS | ± 20 | V | ||
| Drain current (DC) | (Silicon limit) | (Note 1) | I D | 43 | A |
| Drain current (DC) | (Note 1) | I D | 20 | A | |
| Drain current (pulsed) | (1 ms) | (Note 1) | I DP | 107 | A |
| Power dissipation | (T c = 25 ) | P D | 19 | W | |
| Power dissipation | (t = 10 s) | (Note 2) | P D | 1.9 | W |
| Power dissipation | (t = 10 s) | (Note 3) | P D | 0.7 | W |
| Single-pulse avalanche energy | (Note 4) | E AS | 51 | mJ | |
| Avalanche current | I AR | 20 | A | ||
| Channel temperature | T ch | 150 | |||
| Storage temperature | T stg | -55 to 150 |
Thermal Information
| Characteristics | Characteristics | Characteristics | Symbol | Max | Unit |
|---|---|---|---|---|---|
| Channel-to-case thermal resistance | (T c = 25 ) | (T c = 25 ) | R th(ch-c) | 6.57 | /W |
| Channel-to-ambient thermal resistance | (t = 10 s) | (Note 2) | R th(ch-a) | 65.7 | |
| Channel-to-ambient thermal resistance | (t = 10 s) | (Note 3) | R th(ch-a) | 178 |
Note 2: Device mounted on a glass-epoxy board (a), Figure 5.1
Note 3: Device mounted on a glass-epoxy board (b), Figure 5.2
Note 4: VDD = 24 V, Tch = 25 (initial), L = 0.099 mH, IAR = 20 A
Fig. 5.1 Device Mounted on a Glass-Epoxy Board (a)
Fig. 5.2 Device Mounted on a Glass-Epoxy Board (b)
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
Package Information
Weight: 0.02 g (typ.)
Weight: 0.02 g (typ.)
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| TPN6R303NC | Toshiba | — |
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