TMF8820

Part: TMF8821-1A (ordering codes TMF8821-1A and TMF8821-1AM; datasheet covers TMF8820/21/28) — ams OSRAM

Type: Multizone direct Time-of-Flight (dToF) optical distance sensor module

Description: dToF sensor module with integrated VCSEL, 2.7–3.3 V supply, up to 5000 mm detection range and 3x3, 4x4 or 3x6 zone output (TMF8821), with I²C interface and a 63° FoI/FoV.

Operating Conditions:

• Supply voltage (VDD, VDDC, VDDV): 2.7–3.3 V (3.0 V typ)
• I/O pull-up supply (VIO): 1.62–3.3 V
• Operating ambient temperature: -30 to 70 °C
• CPU clock: up to 80 MHz; I²C clock up to 400 kHz (min/typ/max entries listed as 0 / 400 / 1000 kHz)

Absolute Maximum Ratings:

• Supply voltage (VDDV, VDDC, VDD) to ground: -0.3 to 3.6 V
• Digital I/O voltage (SCL, SDA, INT, EN): -0.3 to 3.6 V
• GPIO0/GPIO1 voltage: -0.3 to VDD+0.3 V (max 3.6 V)
• Latch-up input current: ±100 mA (JEDEC JESD78E)
• ESD: ±2000 V HBM, ±500 V CDM
• Storage temperature: -40 to 85 °C
• Package body temperature: 260 °C (IPC/JEDEC J-STD-020)
• MSL 3

Key Specs:

• Power-down current (EN=0, 23 °C): 2 μA typ, 10 μA max
• Standby current: 8 μA typ
• Active ranging current (VCSEL on, CPU at 80 MHz): 57 mA typ
• Average power at 30 Hz, 3x3 mode, 550k iterations: 141 mW typ; 19 mW with 50k iterations
• Power-on time (EN=1 to ready for I²C): 2 ms max
• Cold start to first measurement: 190 ms typ; warm start (from standby) 60 ms typ
• Firmware download at 1 MHz I²C (TMF8820/21): 50 ms typ
• Logic levels: VIH min 1.26 V, VIL max 0.54 V; VOL 0.36 V max at 2 mA sink
• Accuracy ±3% / ±10 mm; distance range 10–5000 mm

Features:

• Direct time-of-flight with SPAD, TDC and histogram architecture
• TMF8821: 3x3, 4x4 and 3x6 multizone output
• 63° FoI/FoV with integrated VCSEL and multi-lens array
• On-chip processing with distance and confidence output over I²C
• Dynamic cover glass calibration and reference SPAD
• Class 1 eye safe, fast VCSEL driver with protection
• I3C tolerant, can share an I²C/I3C bus

Applications:

• Camera autofocus (LDAF) in mobile phones
• Presence detection (computing and communication)
• Object detection and collision avoidance (robotics)
• Industrial light curtain

Package:

• Optical module, 12 pins, 2.0 mm x 4.6 mm x 1.4 mm
• Tape & reel: 7" reels (500 pcs, -1AM) or 13" reels (4000 pcs, -1A)

The benefits and features of TMF8820/21/28, Multizone Time-of-Flight Sensor, are listed below:

Figure 1:

Added Value of Using TMF8820/21/28

Benefits	Features
Small footprint fits within narrow bezel applications	Modular package - 2.0 mmx 4.6 mmx 1.4 mm
Detecting objects in a very wide field of view	63º FoI/FoV
Benefits	Features
Enable new applications like click to focus, object tracking, presence detection	TMF8828: Multizone with 3x3, 4x4, 3x6 and 8x8 zones TMF8821: Multizone with 3x3, 4x4 and 3x6 zones TMF8820: Multizone with 3x3 zones
Within ±3% / ±10 mm of measurement (accuracy); no multipath and no multiple object problems as for iToF	Time-to-Digital Converter (TDC) Direct Time-of-Flight Measurement
Better accuracy detects reliably closest object Minimum distance 10 mm Maximum distance 5000 mm	Single Photon Avalanche Photodiode (SPAD) Histogram based architecture
No complex calibration	Dynamic cover glass calibration
Compensates for dirt on glass	Reliable operation under demanding use cases
Improved accuracy over temperature and life	Reference SPAD
Make better decisions	Distance and signal quality reported
Class 1 eye safe	Fast VCSEL driver with protection
Integration flexibility	I3C tolerant - operate on a shared I²C / I3C bus
Longer battery life	141 mWpower consumption at 30 Hz operation 8 μA power consumption standby current (keep memory) 2 μA power-down current consumption (EN=0)

The device is ideal for use with applications including:

• Distance measurement for camera autofocus - Laser Detect Autofocus - LDAF (mobile phone)
• Presence detection (computing and communication)
• Object detection and collision avoidance (robotics)
• Light curtain (industrial)

Figure 4:

Pin Description of TMF8820/21/28

Pin Number	Pin Name	Pin Type (1)	Description
1	VDDC	PWR	Charge pump supply voltage (3 V) - connect all VDD pins together; add a capacitor GRM155R70J104KA01 (0402 X7R 0.1 μF 6.3V) to GND
2	GNDC	GND	Charge pump ground; connect all ground pins together
3	GPIO0	I/O	General purpose input/output; default tristate; connect to GND if not used
4	INT	OD	Interrupt. Open-drain output; connect to GND if not used
5	SCL	IN	I²C serial clock
6	SDA	I/O	I²C serial data
7	VDD	PWR	Chip supply voltage (3 V) - connect all VDD pins together; add a capacitor GRM155R70J104KA01 (0402 X7R 0.1 μF 6.3 V) to GND
8	GND	GND	Chip ground; connect all ground pins together
9	EN	IN	Enable input active high; setting to low forces the device into shutdown and all memory content is lost; connect to VDD if not used
10	GPIO1	I/O	General purpose input/output; default tristate; connect to GND if not used
11	GNDV	GND	VCSEL ground; connect all ground pins together
12	VDDV	PWR	VCSEL supply voltage (3 V) - connect all VDD pins together; add a capacitor GRM155R70J104KA01 (0402 X7R 0.1 μF 6.3 V) to GND

• (1) Explanation of abbreviations:

IN

Digital input pin

I/O

Digital Input output pin

OD

Open drain output pin

GND

ground supply pin

PWR

Power Supply pin

SDA, SCL, INT and EN have no diode to any VDD supply. Therefore even with VDD = 0 V they do not block the interrupt line or I²C bus.

GPIO0 and GPIO1 are push/pull output and have a diode to VDD; therefore if VDD is not powered, GPIO0 and GPIO1 shall not be driven from outside.

Device parameters are guaranteed at nominal conditions unless otherwise noted. While the device is operational across the temperature range, functionality will vary with temperature. The parameters with Min and Max values are guaranteed with production tests or SQC (Statistical Quality Control) methods.

Figure 6: Electrical Characteristics of TMF8820/21/28

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
VDD	3 V supply voltage	Pins VDDV, VDDC and VDD	2.7	3.0	3.3	V
VIO	I/O supply voltage	Supply voltage for external pull-up for SCL, SDA and INT.	1.62	1.8	3.3	V
T AMB	Operating ambient temperature		-30	23	70	°C
Current Consumption	Current Consumption	Current Consumption	Current Consumption	Current Consumption	Current Consumption	Current Consumption
I POWER_DOWN	Power down current	Pin EN=0; state: power down; T AMB =23°C		2	10	μA
I STANDBY	Standby current	Current consumption for PON=0, wakeup by special I²C command, only retention RAM keeps content; state: standby; I/O pins not toggling Only register 0xE0 (ENABLE) accessible by I²C interface when in this mode.		8		μA
I STANDBY_TIMED	Standby timed current	Current consumption for waiting for measurement period to expire. goto_standby_timed = 1, low_power_osc_on = 1 Only register 0xE0 (ENABLE) accessible by I²C interface when in this mode		34		μA
I WAIT	Wait current	Wakeup by I²C or timer, all memories keep content, CPU off, oscillator on; State: wait		216		μA
I ACTIVE	Active current	Current consumption for CPU running at 80 MHz, VCSEL and TDC off; State: active - histogram processing		2.8		mA
I ACTIVE_RANGING	Active current for ranging (VCSEL emitting light)	Current consumption for CPU running at 80 MHz, VCSEL and TDC on; State: active - ranging		57		mA
Average Current Consumption for Running Application	Average Current Consumption for Running Application	Average Current Consumption for Running Application	Average Current Consumption for Running Application	Average Current Consumption for Running Application	Average Current Consumption for Running Application	Average Current Consumption for Running Application
P RANGING_AVG	Average power consumption	Default settings with 550 k iterations, 3x3 mode, output data rate 30 Hz		141		mW
P RANGING_AVG_LP	Average power consumption low power	Output data rate 30 Hz, 3x3 mode, 50 k iterations		19		mW

Figure 6: Electrical Characteristics of TMF8820/21/28

Symbol	Parameter	Conditions	Min	Typ	Max	Unit
I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply	I/O Levels - Over Temperature and Supply
I LEAK	Leakage current to VDD or GND	SDA, SCL, GPIO0/1, EN, INT	-5		5	μA
V IH	Input voltage high	SDA, SCL, GPIO0/1, EN	1.26		3.3	V
V IL	Input voltage low	SDA, SCL, GPIO0/1, EN	0		0.54	V
V OL2mA	Output voltage low	SDA, INT, 2 mA sink	0		0.36	V
V OL4mA	Output voltage low	SDA. INT, 4 mA sink	0		0.6	V
I DRIVE_H	Output current high	1 V applied on GPIO0/1	3.6			mA
I DRIVE_L	Output current low	1 V applied on GPIO0/1	3.6			mA
Timings - over Temperature and Supply	Timings - over Temperature and Supply	Timings - over Temperature and Supply	Timings - over Temperature and Supply	Timings - over Temperature and Supply	Timings - over Temperature and Supply	Timings - over Temperature and Supply
f clk	RC oscillator	All internal timings are derived from this clock	4.85	5	5.15	MHz
f CPUclk	Maximum operating frequency of CPU	The CPU can be switched between f clk and f clk *16		f clk * 16 (80 MHz)		MHz
VCSEL CLK	Clock frequency of VCSEL clock			17.77		MHz
t POR	Power on time	EN=1 to ready for I²C command			2	ms
	Time to download	For 1 MHz I²C speed [TMF8820/21]		50		ms
t FW_DOWNLOAD	firmware	For 1 MHz I²C speed [TMF8828]		100		ms
t FIRST_MEAS_COLD t	Time from cold start to first measurement Time from warm start to first	From EN=0->1 (power down) to first measurement result; default settings (33 ms) From standby to first measurement		190 60		ms ms
t	Time to switch to	From command 0x65 to CMD_STAT to first measurement result		65		ms
SWITCH_to_8820/8821 t SWITCH_to_8828	TMF8820/21 mode Time to switch to TMF8828 mode	[TMF8828] From command 0x6C to CMD_STAT to first measurement		115		ms
I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply	I²C Interface - over Temperature and Supply
f SCLK	SCL clock frequency		0	400	100 0	kHz
t BUF	Bus free time between a STOP and START		0.5			μs
t HD:STA	Hold time (Repeated) Start		0.26			μs
t LOW	LOW period of SCL Clock		0.5			μs
t HIGH	HIGH period of SCL clock		0.26			μs
t SU:STA	Setup time for a Repeated START		0.26			μs
t HD:DAT	Data hold time		0			μs
t SU:DAT	Data setup time		50			ns
Symbol	Parameter	Conditions	Min	Typ	Max	Unit
t R	Rise time of both SDA and SCL		20		120	ns
t F	Fall time of both SDA and SCL		20		120	ns
Optical Parameters	Optical Parameters	Optical Parameters	Optical Parameters	Optical Parameters	Optical Parameters	Optical Parameters
FoI	Field of view of the illuminator main area	Diagonal, FWHM (2) of radiant intensity	See section 7.5.2	See section 7.5.2	See section 7.5.2	See section 7.5.2
Optical Multizone Parameters	Optical Multizone Parameters	Optical Multizone Parameters	Optical Multizone Parameters	Optical Multizone Parameters	Optical Multizone Parameters	Optical Multizone Parameters
SPAD X	Delta in angle of single SPAD in x	In optical center		2.4		degrees
SPAD Y	Delta in angle of single SPAD in y (1)	In optical center		5.6		degrees
Optical Stack Requirements	Optical Stack Requirements	Optical Stack Requirements	Optical Stack Requirements	Optical Stack Requirements	Optical Stack Requirements	Optical Stack Requirements
GLASS TRANSPARENCY	Glass transparency @940 nm	The device can work with IR inked or clear glass	85	90		%
XTALK SYSTEM	System Crosstalk	Measured in final application	See ams OSRAM optical design guide	See ams OSRAM optical design guide	See ams OSRAM optical design guide	See ams OSRAM optical design guide

(1) Due to SPADs with too high dark count, which are disabled by production test (screamer detection), need to use always at least two SPADs next to each other.

(2) FWHM - full width half maximum.

Stresses beyond those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under 'Operating Conditions' is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Figure 5: Absolute Maximum Ratings of TMF8820/21/28

Symbol	Parameter	Min	Max	Unit	Comments
Electrical Parameters	Electrical Parameters
V DDMAX	3 V Supply Voltage to Ground	-0.3	3.6 (1)	V	Pins VDDV, VDDC, VDD
V GND	Ground	0.0	0.0	V	Pins GNDV, GNDC, GND
V IOMAX	Digital I/O Terminal Voltage	-0.3	3.6	V	SCL, SDA, INT and EN; has no internal diode to VDD
V IO_GPIO_MAX	Interface Digital I/O terminal voltage	-0.3	VDD+0.3 max 3.6	V	GPIO0, GPIO1 has an internal diode to VDD
I SCR	Input Current (latch-up immunity)	± 100	± 100	mA	JEDEC JESD78E
Electrostatic Discharge	Electrostatic Discharge
ESD HBM	Electrostatic Discharge HBM	± 2000	± 2000	V	JS-001-2017
ESD CDM	Electrostatic Discharge CDM	± 500	± 500	V	JEDEC JS-002-2018
Temperature Ranges and Storage Conditions	Temperature Ranges and Storage Conditions
T STRG	Storage Temperature Range	-40	85	°C
T BODY	Package Body Temperature		260	°C	IPC/JEDEC J-STD-020 (2)
RH NC	Relative Humidity (non- condensing)	5	85	%
MSL	Moisture Sensitivity Level	3	3		Represents a maximum floor life time of 168h with T A <30 °C and RH NC <60%

• (1) All dimensions are in millimeters. Angles in degrees.
• (2) Dimensioning and tolerancing conform to ASME Y14.5M-1994.
• (3) n is the total number of terminals.
• (4) This package contains no lead (Pb).
• (5) This drawing is subject to change without notice.
• (6) 8-digit tracecode only on bottom side of the package.

Ref.	Min	Nom	Max
A	1.3	1.4	1.5
A1		0.2	REF
A2		1.2	REF
D		4.6	BSC
E		2	BSC
W	0.45	0.5	0.55
L	0.3	0.35	0.4
e		0.82	BSC
n	12	12	12
D1		4.1	BSC
E1		1.35	BSC
SD	0.41		BSC
aaa	0.1	0.1	0.1
ddd	0.08	0.08	0.08