Skip to main content

STM32G031G8U6

The STM32G031G8U6 is an electronic component from STMicroelectronics. View the full STM32G031G8U6 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Manufacturer

STMicroelectronics

Category

Integrated Circuits (ICs)

Package

28-UFQFN

Lifecycle

Active

Key Specifications

ParameterValue
ADC Channels (Resolution)15-Ch 12-Bit
ADC Channels (Resolution)15-Ch 12-Bit
Ambient Temperature Range High85 °C
Ambient Temperature Range High85 °C
China RoHSCompliant
China RoHSCompliant
ConnectivityI2C, IrDA, LINbus, SPI, SmartCard, UART/USART
Core ArchitectureARM Cortex-M0+
Core ArchitectureARM Cortex-M0+
Core ProcessorARM® Cortex®-M0+
Core Size32-Bit
Data Bus Width32 b
Data Bus Width32 b
Data ConvertersA/D 17x12b SAR
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
EEPROM Memory Size0 B
EEPROM Memory Size0 B
Flash Memory Size64 kB
Flash Memory Size64 kB
Frequency64 MHz
Height600 µm
Height600 µm
Height - Seated (Max)600 µm
Height - Seated (Max)600 µm
InterfaceI2C, I2S, IrDA, LIN, SPI, UART, USART
Length4 mm
Length4 mm
Lifecycle StatusProduction (Last Updated: 2 months ago)
Lifecycle StatusProduction (Last Updated: 2 months ago)
Manufacturer Package IdentifierUFQFPN28-A0B0
Manufacturer Package IdentifierUFQFPN28-A0B0
Max Frequency48 MHz
Max Frequency48 MHz
Max Junction Temperature (Tj)105 °C
Max Junction Temperature (Tj)105 °C
Max Operating Temperature85 °C
Max Operating Temperature85 °C
Max Supply Current6.9 mA
Max Supply Current6.9 mA
Max Supply Voltage3.6 V
Max Supply Voltage3.6 V
Memory Size64 kB
Memory TypeFLASH
Min Operating Temperature-40 °C
Min Operating Temperature-40 °C
Min Supply Voltage1.7 V
Min Supply Voltage1.7 V
Mounting TypeSurface Mount
Number of A/D Converters1
Number of A/D Converters1
Number of ADC Channels19
Number of ADC Channels19
Number of I/O26
Number of I/Os3
Number of I/Os3
Number of I2C Channels2
Number of I2C Channels2
Number of SPI Channels2
Number of SPI Channels2
Number of Terminals28
Number of Terminals28
Number of Timers/Counters9
Number of Timers/Counters9
Number of UART Channels3
Number of UART Channels3
Number of USART Channels2
Number of USART Channels2
Operating Supply Voltage1.8 V
Operating Supply Voltage1.8 V
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Oscillator TypeExternal, Internal
Package / Case28-UFQFN
PackagingTray
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
PeripheralsPOR
Flash Memory Size64KB (64K x 8)
Program Memory TypeFLASH
RAM Size8K x 8 B
RAM Size8 kB
REACH SVHCYes
REACH SVHCYes
RoHSCompliant
RoHSCompliant
Schedule B8542310000
Schedule B8542310000
Clock Speed64MHz
Standard Pack Qty2940
Standard Pack Qty2940
Supplier Device Package28-UFQFPN (4x4)
Supplier Device Package28-UFQFPN (4x4)
Supplier Device Package28-UFQFPN (4x4)
Supplier Device Package28-UFQFPN (4x4)
Supplier Device Package28-UFQFPN (4x4)
Terminal Pitch500 µm
Terminal Pitch500 µm
Supply Voltage1.7V ~ 3.6V
Width4 mm
Width4 mm

Overview

Part: STM32G031x4/x6/x8

Type: Arm Cortex-M0+ 32-bit MCU

Description: 32-bit Arm Cortex-M0+ MCU operating up to 64 MHz with up to 64 KB Flash, 8 KB SRAM, and a 1.7–3.6 V supply voltage.

Operating Conditions:

  • Supply voltage: 1.7 V to 3.6 V
  • Operating temperature: -40 to 85 °C / -40 to 125 °C
  • Max CPU frequency: 64 MHz
  • ADC conversion range: 0 to 3.6 V

Absolute Maximum Ratings:

  • Max supply voltage (V DD - V SS): 4.0 V
  • Max input voltage (5V tolerant I/O): 5.5 V
  • Max continuous current (I DD): 120 mA
  • Max continuous current (per I/O): 25 mA
  • Max junction temperature: 125 °C
  • Max storage temperature: 150 °C

Key Specs:

  • Core: Arm 32-bit Cortex-M0+ CPU
  • Flash memory: Up to 64 Kbytes
  • SRAM: 8 Kbytes with HW parity check
  • ADC resolution: 12-bit
  • ADC conversion time: 0.4 μs
  • I/Os: Up to 44 fast I/Os, multiple 5 V-tolerant
  • I2C speed: Up to 1 Mbit/s (Fastmode Plus)
  • SPI speed: Up to 32 Mbit/s

Features:

  • CRC calculation unit
  • Power-on/Power-down reset (POR/PDR)
  • Programmable Brownout reset (BOR)
  • Low-power modes: Sleep, Stop, Standby, Shutdown
  • VBAT supply for RTC and backup registers
  • 5-channel DMA controller with flexible mapping
  • 11 timers (one 128 MHz capable)
  • Calendar RTC with alarm and periodic wakeup
  • 96-bit unique ID

Package:

  • LQFP48
  • UFQFPN48
  • LQFP32
  • UFQFPN32
  • UFQFPN28
  • TSSOP20
  • WLCSP18
  • SO8N

Features

  • Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
  • -40°C to 85°C/125°C operating temperature
  • Memories
  • -Up to 64 Kbytes of Flash memory
  • -8 Kbytes of SRAM with HW parity check
  • CRC calculation unit
  • Reset and power management
  • -Voltage range: 1.7 V to 3.6 V
  • -Power-on/Power-down reset (POR/PDR)
  • -Programmable Brownout reset (BOR)
  • -Programmable voltage detector (PVD)
  • -Low-power modes: Sleep, Stop, Standby, Shutdown
  • -VBAT supply for RTC and backup registers
  • Clock management
  • -4 to 48 MHz crystal oscillator
  • -32 kHz crystal oscillator with calibration
  • -Internal 16 MHz RC with PLL option (±1 %)
  • -Internal 32 kHz RC oscillator (±5 %)
  • Up to 44 fast I/Os
  • -All mappable on external interrupt vectors
  • -Multiple 5 V-tolerant I/Os
  • 5-channel DMA controller with flexible mapping
  • 12-bit, 0.4 μs ADC (up to 16 ext. channels)
  • -Up to 16-bit with hardware oversampling
  • -Conversion range: 0 to 3.6V
  • 11 timers (one 128 MHz capable): 16-bit for advanced motor control, one 32-bit and four 16-bit general-purpose, two low-power 16-bit, two watchdogs, SysTick timer
  • Calendar RTC with alarm and periodic wakeup from Stop/Standby/Shutdown

Pin Configuration

PinNameTypeDescription
1PC14-OSC32_IN (PC14)I/Oalt: RCC_OSC32_IN, RCC_OSC_IN, TIM1_BK2
2PC15-OSC32_OUT (PC15)I/Oalt: RCC_OSC32_EN, RCC_OSC32_OUT, RCC_OSC_EN
3VDD/VDDAP
4VSS/VSSAP
5PF2 - NRSTI/Oalt: RCC_MCO
6PA0I/Oalt: ADC1_IN0, LPTIM1_OUT, RTC_TAMP_IN2, SPI2_SCK, SYS_WKUP1, TIM2_CH1, TIM2_ETR, USART2_CTS, USART2_NSS
7PA1I/Oalt: ADC1_IN1, I2C1_SMBA, I2S1_CK, SPI1_SCK, TIM2_CH2, USART2_CK, USART2_DE, USART2_RTS
8PA2I/Oalt: ADC1_IN2, I2S1_SD, LPUART1_TX, RCC_LSCO, SPI1_MOSI, SYS_WKUP4, TIM2_CH3, USART2_TX
9PA3I/Oalt: ADC1_IN3, LPUART1_RX, SPI2_MISO, TIM2_CH4, USART2_RX
10PA4I/Oalt: ADC1_IN4, I2S1_WS, LPTIM2_OUT, RTC_OUT_ALARM, RTC_OUT_CALIB, RTC_TAMP_IN1, RTC_TS, SPI1_NSS, SPI2_MOSI, SYS_WKUP2, TIM14_CH1
11PA5I/Oalt: ADC1_IN5, I2S1_CK, LPTIM2_ETR, SPI1_SCK, TIM2_CH1, TIM2_ETR
12PA6I/Oalt: ADC1_IN6, I2S1_MCK, LPUART1_CTS, SPI1_MISO, TIM16_CH1, TIM1_BK, TIM3_CH1
13PA7I/Oalt: ADC1_IN7, I2S1_SD, SPI1_MOSI, TIM14_CH1, TIM17_CH1, TIM1_CH1N, TIM3_CH2
14PB0I/Oalt: ADC1_IN8, I2S1_WS, LPTIM1_OUT, SPI1_NSS, TIM1_CH2N, TIM3_CH3
15PB1I/Oalt: ADC1_IN9, LPTIM2_IN1, LPUART1_DE, LPUART1_RTS, TIM14_CH1, TIM1_CH3N, TIM3_CH4
16PA8I/Oalt: LPTIM2_OUT, RCC_MCO, SPI2_NSS, TIM1_CH1
17PC6I/Oalt: TIM2_CH3, TIM3_CH1
18PA11 [PA9]I/Oalt: ADC1_EXTI11, ADC1_IN15, I2C2_SCL, I2S1_MCK, SPI1_MISO, TIM1_BK2, TIM1_CH4, USART1_CTS, USART1_NSS
18PA9 [PA11]I/Oalt: I2C1_SCL, RCC_MCO, SPI2_MISO, TIM1_CH2, USART1_TX
19PA12 [PA10]I/Oalt: ADC1_IN16, I2C2_SDA, I2S1_SD, I2S_CKIN, SPI1_MOSI, TIM1_ETR, USART1_CK, USART1_DE, USART1_RTS
19PA10 [PA12]I/Oalt: I2C1_SDA, SPI2_MOSI, TIM17_BK, TIM1_CH3, USART1_RX
20PA13I/Oalt: ADC1_IN17, IR_OUT, SYS_SWDIO
21PA14-BOOT0I/Oalt: ADC1_IN18, SYS_SWCLK, USART2_TX
22PA15I/Oalt: I2S1_WS, SPI1_NSS, TIM2_CH1, TIM2_ETR, USART2_RX
23PB3I/Oalt: I2S1_CK, SPI1_SCK, TIM1_CH2, TIM2_CH2, USART1_CK, USART1_DE, USART1_RTS
24PB4I/Oalt: I2S1_MCK, SPI1_MISO, TIM17_BK, TIM3_CH1, USART1_CTS, USART1_NSS
25PB5I/Oalt: I2C1_SMBA, I2S1_SD, LPTIM1_IN1, SPI1_MOSI, SYS_WKUP6, TIM16_BK, TIM3_CH2
26PB6I/Oalt: I2C1_SCL, LPTIM1_ETR, SPI2_MISO, TIM16_CH1N, TIM1_CH3, USART1_TX
27PB7I/Oalt: ADC1_IN11, I2C1_SDA, LPTIM1_IN2, SPI2_MOSI, SYS_PVD_IN, TIM17_CH1N, USART1_RX
28PB8I/Oalt: I2C1_SCL, SPI2_SCK, TIM16_CH1

Electrical Characteristics

The definition and values of input/output AC characteristics are given in Figure 23 and Table 54 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 54. I/O AC characteristics (1)(2)

SpeedSymbolParameterConditionsMinMaxUnit
00FmaxMaximum frequencyC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-2MHz
00FmaxMaximum frequencyC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-0.35MHz
00FmaxMaximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-3MHz
00FmaxMaximum frequencyC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-0.45MHz
00Tr/TfOutput rise and fall timeC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-100ns
00Tr/TfOutput rise and fall timeC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-225ns
00Tr/TfOutput rise and fall timeC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-75ns
00Tr/TfOutput rise and fall timeC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-150ns

Table 54. I/O AC characteristics (1)(2)

Table 54. I/O AC characteristics (1)(2) (continued)

SpeedParameterConditionsMinMaxUnit
01C=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-10MHz
01Maximum frequencyC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-2MHz
01C=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-15MHz
01C=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-2.5MHz
01Tr/Tf Output rise and fallC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-30ns
01timeC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-60ns
01Tr/Tf Output rise and fallC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-15ns
01Tr/Tf Output rise and fallC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-30ns
10Fmax Maximum frequencyC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-30MHz
10Fmax Maximum frequencyC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-15MHz
10Fmax Maximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-60MHz
10Fmax Maximum frequencyC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-30MHz
10Tr/Tf Output rise and fallC=50 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-11ns
10timeC=50 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-22ns
10Tr/Tf Output rise and fallC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-4ns
10Tr/Tf Output rise and fallC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-8ns
11Fmax Maximum frequencyC=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-60MHz
11Fmax Maximum frequencyC=30 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-30MHz
11Fmax Maximum frequencyC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-80 (3)MHz
11Fmax Maximum frequencyC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-40MHz
11Tr/Tf Output rise and fallC=30 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-5.5ns
11timeC=30 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-11ns
11Tr/Tf Output rise and fallC=10 pF, 2.7 V ≤ V DDIO1 ≤ 3.6 V-2.5ns
11Tr/Tf Output rise and fallC=10 pF, 1.6 V ≤ V DDIO1 ≤ 2.7 V-5ns
Fm+Maximum frequencyC=50 pF, 1.6 V ≤ V DDIO1 ≤ 3.6 V-1MHz
Fm+Output fall time (4)C=50 pF, 1.6 V ≤ V DDIO1 ≤ 3.6 V-5ns
  1. Guaranteed by design.
  2. This value represents the I/O capability but the maximum system frequency is limited to 64 MHz.
  3. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.

92

Figure 23. I/O AC characteristics definition (1)

  1. Refer to Table 54: I/O AC characteristics .

Absolute Maximum Ratings

Stresses above the absolute maximum ratings listed in Table 18 , Table 19 and Table 20 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 18. Voltage characteristics

SymbolRatingsMinMaxUnit
V DD - V SS V BAT - V SSExternal supply voltage-0.34.0
V IN (1)Input voltage on FT_xxV SS - 0.3V DD + 4.0 (2)V
V IN (1)Input voltage on any other pinV SS - 0.34.0
SymbolRatingsMaxUnit
I VDD/VDDACurrent into VDD/VDDA power pin (source) (1)100mA
I VSS/VSSACurrent out of VSS/VSSA ground pin (sink) (1)100mA
I IO(PIN)Output current sunk by any I/O and control pin except FT_f15mA
I IO(PIN)Output current sunk by any FT_f pin20mA
I IO(PIN)Output current sourced by any I/O and control pin15mA
∑ I IO(PIN)Total output current sunk by sum of all I/Os and control pins (2)80mA
∑ I IO(PIN)Total output current sourced by sum of all I/Os and control pins (2)80mA
I INJ(PIN) (3)Injected current on a FT_xx pin-5 / NA (4)mA
∑ \I INJ(PIN) \Total injected current (sum of all I/Os and control pins) (5)
  1. A positive injection is induced by V IN > V DDIOx while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 18: Voltage characteristics for the maximum allowed input voltage values.
  2. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
  3. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 20. Thermal characteristics

SymbolRatingsValueUnit
T STGStorage temperature range-65 to +150°C
T JMaximum junction temperature150°C

Table 20. Thermal characteristics

Thermal Information

The operating junction temperature T J must never exceed the maximum given in Table 21: General operating conditions

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

Package Information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
STM32G031K8STMicroelectronics
STM32G031K8T6STMicroelectronics32-LQFP
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free