STM32G031G8U6

Part: STM32G031K8T6 — STMicroelectronics

Type: Arm Cortex-M0+ 32-bit MCU

Description: 32-bit Arm Cortex-M0+ MCU at up to 64 MHz with 64 KB Flash and 8 KB SRAM, 1.7–3.6 V supply, 2x USART, 2x SPI, 2x I2C, 12-bit ADC and 11 timers.

Operating Conditions:

• Supply voltage (VDD): 1.7–3.6 V (VDDA 1.62–3.6 V for ADC operation; VBAT 1.55–3.6 V)
• Operating temperature: -40 to 85 °C (suffix 6; TJ up to 105 °C)
• Max AHB/APB clock: 64 MHz
• I/O input voltage: -0.3 V to Min(VDD + 3.6, 5.5) V

Absolute Maximum Ratings:

• Max external supply voltage (VDD − VSS): 4.0 V (min -0.3 V)
• Input voltage on FT_xx pins: VDD + 4.0 V max; on any other pin 4.0 V max
• Current into VDD/VDDA power pin: 100 mA
• Output current sunk/sourced by any I/O and control pin: 15 mA (FT_f pins sink 20 mA)
• Total output current sunk or sourced by all I/Os: 80 mA each
• Max junction temperature: 150 °C
• Storage temperature: -65 to +150 °C

Key Specs:

• CPU frequency: up to 64 MHz (fHCLK, fPCLK)
• VDD operating range: 1.7–3.6 V
• VDDA for ADC: 1.62–3.6 V; for VREFBUF: 2.4–3.6 V
• Ambient temperature: -40 to 85 °C (suffix 6); -40 to 125 °C (suffix 3)
• Junction temperature: -40 to 105 °C (suffix 6); -40 to 130 °C (suffix 3)
• Flash: up to 64 KB; SRAM: 8 KB with HW parity
• ADC: 12-bit, 0.4 μs, up to 16 external channels
• Up to 44 fast I/Os, multiple 5 V-tolerant

Features:

• Arm Cortex-M0+ core, up to 64 MHz
• CRC calculation unit and 96-bit unique ID
• POR/PDR, programmable BOR, programmable voltage detector
• Low-power modes: Sleep, Stop, Standby, Shutdown; VBAT supply for RTC and backup registers
• 4–48 MHz crystal oscillator, 32 kHz crystal oscillator, internal 16 MHz RC with PLL (±1 %), internal 32 kHz RC (±5 %)
• 5-channel DMA controller
• 11 timers including advanced motor control timer, two watchdogs, SysTick
• Calendar RTC with alarm and periodic wakeup
• Two I2C (Fast-mode Plus, 1 Mbit/s), two USARTs, one low-power UART, two SPIs (32 Mbit/s, one multiplexed with I2S)
• Serial wire debug (SWD)
• ECOPACK 2 compliant

Applications:

• General-purpose embedded and mainstream microcontroller applications

Package:

• LQFP32 (STM32G031K8T6, 32 pins)

• Core: Arm ® 32-bit Cortex ® -M0+ CPU, frequency up to 64 MHz
• -40°C to 85°C/125°C operating temperature
• Memories
• -Up to 64 Kbytes of Flash memory
• -8 Kbytes of SRAM with HW parity check
• CRC calculation unit
• Reset and power management
• -Voltage range: 1.7 V to 3.6 V
• -Power-on/Power-down reset (POR/PDR)
• -Programmable Brownout reset (BOR)
• -Programmable voltage detector (PVD)
• -Low-power modes: Sleep, Stop, Standby, Shutdown
• -VBAT supply for RTC and backup registers
• Clock management
• -4 to 48 MHz crystal oscillator
• -32 kHz crystal oscillator with calibration
• -Internal 16 MHz RC with PLL option (±1 %)
• -Internal 32 kHz RC oscillator (±5 %)
• Up to 44 fast I/Os
• -All mappable on external interrupt vectors
• -Multiple 5 V-tolerant I/Os
• 5-channel DMA controller with flexible mapping
• 12-bit, 0.4 μs ADC (up to 16 ext. channels)
• -Up to 16-bit with hardware oversampling
• -Conversion range: 0 to 3.6V
• 11 timers (one 128 MHz capable): 16-bit for advanced motor control, one 32-bit and four 16-bit general-purpose, two low-power 16-bit, two watchdogs, SysTick timer
• Calendar RTC with alarm and periodic wakeup from Stop/Standby/Shutdown

Figure 3. STM32G031CxT LQFP48 pinout

Figure 4. STM32G031CxU UFQFPN48 pinout

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Figure 5. STM32G031KxT LQFP32 pinout

Figure 6. STM32G031KxU UFQFPN32 pinout

Figure 7. STM32G031GxU UFQFPN28 pinout

Figure 8. STM32G031Fx TSSOP20 pinout

Figure 9. STM32G031Yx WLCSP18 ballout

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Figure 10. STM32G031Jx SO8N pinout

MSv47956V1

1

2

3

4

8

7

• 6 PA12[PA10]

5

PB7/PB8/PB9/PC14-OSC32_IN

PA0/PA1/PA2/PF2-NRST

PB5/PB6/PA14-BOOT0/PA15

PA13

VDD/VDDA

VSS/VSSA

PA8/PA11[PA9]/PB0/PB1

Top view

Table 11. Terms and symbols used in Table 12

Table 11. Terms and symbols used in Table 12

Table 12. Pin assignment and description

Table 12. Pin assignment and description

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Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

38

Table 12. Pin assignment and description (continued)

Table 12. Pin assignment and description (continued)

Table 13. Port A alternate function mapping

Table 13. Port A alternate function mapping

Table 14. Port B alternate function mapping

Table 14. Port B alternate function mapping

The definition and values of input/output AC characteristics are given in Figure 23 and Table 54 , respectively.

Unless otherwise specified, the parameters given are derived from tests performed under the ambient temperature and supply voltage conditions summarized in Table 21: General operating conditions .

Table 54. I/O AC characteristics (1)(2)

Table 54. I/O AC characteristics (1)(2)

Table 54. I/O AC characteristics (1)(2) (continued)

1. Guaranteed by design.
2. This value represents the I/O capability but the maximum system frequency is limited to 64 MHz.
3. The fall time is defined between 70% and 30% of the output waveform, according to I 2 C specification.

92

Figure 23. I/O AC characteristics definition (1)

1. Refer to Table 54: I/O AC characteristics .

Stresses above the absolute maximum ratings listed in Table 18 , Table 19 and Table 20 may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Table 18. Voltage characteristics

Table 19. Current characteristics

1. A positive injection is induced by V IN > V DDIOx while a negative injection is induced by V IN < V SS . I INJ(PIN) must never be exceeded. Refer also to Table 18: Voltage characteristics for the maximum allowed input voltage values.
2. Positive injection is not possible on these I/Os and does not occur for input voltages lower than the specified maximum value.
3. When several inputs are submitted to a current injection, the maximum ∑ |I INJ(PIN) | is the absolute sum of the negative injected currents (instantaneous values).

Table 20. Thermal characteristics

Table 20. Thermal characteristics

The operating junction temperature T J must never exceed the maximum given in Table 21: General operating conditions

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

$$T_J(max) = T_A(max) + P_D(max) \times \Theta_{JA}$$

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK ® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark.