RT9193-33GB
CMOS LDO RegulatorThe RT9193-33GB is a cmos ldo regulator from Richtek USA Inc.. View the full RT9193-33GB datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Key Specifications
| Parameter | Value |
|---|---|
| Control Features | Enable |
| Output Current | 300mA |
| Quiescent Current | 130 µA |
| Mounting Type | Surface Mount |
| Number of Regulators | 1 |
| Operating Temperature | -40°C ~ 125°C |
| Output Configuration | Positive |
| Output Type | Fixed |
| Package / Case | SC-74A, SOT-753 |
| Protection Features | Over Current, Over Temperature |
| PSRR | 70dB ~ 50dB (100Hz ~ 10kHz) |
| Supplier Device Package | SOT-23-5 |
| Input Voltage (Max) | 5.5V |
| Output Voltage | 3.3V |
| Dropout Voltage | 0.3V @ 300mA |
Overview
Part: RT9193 — Richtek Technology Corporation
Type: Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator
Description: A 2.5–5.5 V input, 300 mA ultra-low noise LDO regulator optimized for battery-powered RF and wireless applications, featuring fast turn-on time, low quiescent current, and a noise bypass pin.
Operating Conditions:
- Supply voltage: 2.5V to 5.5V
- Operating temperature: -40°C to 125°C (Junction), -40°C to 85°C (Ambient)
- EN Input Voltage: 0V to 5.5V
Absolute Maximum Ratings:
- Max supply voltage: 6V
- Max junction temperature: 150°C
- Max storage temperature: -65°C to 150°C
Key Specs:
- Output Voltage Accuracy: ±2% (I_OUT = 1mA)
- Current Limit: 400 mA (Typ)
- Quiescent Current: 90 μA (Typ, I_OUT = 0mA)
- Dropout Voltage: 220 mV (Typ, I_OUT = 300mA, V_OUT > 2.8V)
- Standby Current: 0.01 μA (Typ, V_EN = GND)
- Output Noise Voltage: 100 μV RMS (Typ, 10Hz to 100kHz, I_OUT = 200mA)
- Power Supply Rejection Ratio (PSRR): -70 dB (Typ, f = 100Hz, I_OUT = 10mA)
- Thermal Shutdown Temperature: 165°C (Typ)
Features:
- Ultra Low Noise for RF Application
- Ultra Fast Response in Line/Load Transient
- Quick Start-Up (Typically 50us)
- < 0.01μA Standby Current When Shutdown
- Low Dropout: 220mV @ 300mA
- Wide Operating Voltage Ranges: 2.5V to 5.5V
- TTL-Logic-Controlled Shutdown Input
- Current Limiting Protection
- Thermal Shutdown Protection
- Only 1 μF Output Capacitor Required for Stability
- High Power Supply Rejection Ratio
Applications:
- CDMA/GSM Cellular Handsets
- Battery-Powered Equipment
- Laptop, Palmtops, Notebook Computers
- Hand-Held Instruments
- PCMCIA Cards
- Portable Information Appliances
Package:
- SC-70-5
- SOT-23-5
- TSOT-23-5
- WDFN-6L 2x2
- MSOP-8
Features
-
z Ultra Low Noise for RF Application
-
z Ultra Fast Response in Line/Load Transient
-
z Quick Start-Up (Typically 50us)
-
z < 0.01μA Standby Current When Shutdown
-
z
Low Dropout : 220mV @ 300mA
-
z Wide Operating Voltage Ranges : 2.5V to 5.5V
-
z TTL-Logic-Controlled Shutdown Input
-
z Low Temperature Coefficient
-
z Current Limiting Protection
-
z Thermal Shutdown Protection
-
z Only 1 μ F Output Capacitor Required for Stability
-
z High Power Supply Rejection Ratio
-
z Custom Voltage Available
-
z RoHS Compliant and 100% Lead (Pb)-Free
Applications
-
z CDMA/GSM Cellular Handsets
-
z Battery-Powered Equipment
-
z Laptop, Palmtops, Notebook Computers
-
z Hand-Held Instruments
-
z PCMCIA Cards
-
z Portable Information Appliances
Pin Configuration
SC-70-5/SOT-23-5/TSOT-23-5
Electrical Characteristics
(VIN = VOUT + 1V, CIN = COUT = 1μF, CBP = 22nF, TA = 25°C, unless otherwise specified)
| Parameter | Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|---|
| Output Voltage Accuracy | Output Voltage Accuracy | Δ V OUT | I OUT = 1mA | - 2 | -- | 2 | % |
| Current Limit | Current Limit | I LIM | R LOAD = 1 Ω | 360 | 400 | -- | mA |
| Quiescent Current | Quiescent Current | I Q | V EN ≥ 1.2V, I OUT =0mA | -- | 90 | 130 | μ A |
| Dropout Voltage | (Note 5) | V DROP | I OUT = 200mA, V OUT > 2.8V | 170 | 200 | mV | |
| Dropout Voltage | V DROP | I OUT = 300mA, V OUT > 2.8V | -- | 220 | 300 | mV | |
| Line Regulation | Line Regulation | Δ V LINE | V IN = (V OUT + 1V) to 5.5V, I OUT = 1mA | -- | -- | 0.3 | % |
| Load Regulation | Load Regulation | Δ V LOAD | 1mA < I OUT < 300mA | -- | -- | 0.6 | % |
| Standby Current | Standby Current | I STBY | V EN = GND, Shutdown | -- | 0.01 | 1 | μ A |
| EN Input Bias Current | EN Input Bias Current | I IBSD | V EN = GND or VIN | -- | 0 | 100 | nA |
| EN Threshold | Logic-Low Voltage | V IL | V IN = 3V to 5.5V, Shutdown | -- | -- | 0.4 | V |
| EN Threshold | Logic-High | V IH | V IN = 3V to 5.5V, Start-Up | 1.2 | -- | -- | V |
Absolute Maximum Ratings
| z Supply Input Voltage------------------------------------------------------------------------------------------------------ | 6V |
|---|---|
| z PowerDissipation,P D @T A = 25 ° C | |
| SC-70-5 ---------------------------------------------------------------------------------------------------------------------- | 300mW |
| TSOT-23-5/SOT-23-5------------------------------------------------------------------------------------------------------ | 400mW |
| WDFN-6L2x2 | -------------------------------------------------------------------------------------------------------------- 606mW |
| MSOP-8 --------------------------------------------------------------------------------------------------------------------- | 625mW |
| z Package Thermal Resistance (Note 2) | |
| SOT-70-5, θ JA --------------------------------------------------------------------------------------------------------------- | 333 ° C/W |
| TSOT-23-5/SOT-23-5, θ JA ------------------------------------------------------------------------------------------------ | 250 ° C/W |
| TSOT-23-5/SOT-23-5, θ JC ----------------------------------------------------------------------------------------------- | 25 ° C/W |
| WDFN-6L 2x2, θ JA --------------------------------------------------------------------------------------------------------- | 165 ° C/W |
| WDFN-6L 2x2, θ JC -------------------------------------------------------------------------------------------------------- | 20 ° C/W |
| MSOP-8 θ JA ---------------------------------------------------------------------------------------------------------------- | 160 ° C/W |
| MSOP-8 θ JC ---------------------------------------------------------------------------------------------------------------- | 55 ° C/W |
| z Junction Temperature----------------------------------------------------------------------------------------------------- | 150 ° C |
| z Lead Temperature (Soldering, 10 sec.)------------------------------------------------------------------------------- | 260 ° C |
| z StorageTemperatureRange -------------------------------------------------------------------------------------------- | - 65 ° Cto150 ° C |
| z ESD Susceptibility (Note 3) | |
| HBM(HumanBodyMode) ---------------------------------------------------------------------------------------------- | 2kV |
| MM(Machine Mode) ------------------------------------------------------------------------------------------------------ | 200V |
| Recommended Operating Conditions (Note | 4) |
| z Supply Input Voltage------------------------------------------------------------------------------------------------------ | 2.5V to 5.5V |
| z ENInput Voltage ----------------------------------------------------------------------------------------------------------- | 0V to 5.5V |
| z JunctionTemperature Range-------------------------------------------------------------------------------------------- | - 40 ° Cto125 ° C |
| z AmbientTemperature Range-------------------------------------------------------------------------------------------- | - 40 ° Cto 85 ° C |
Thermal Information
Thermal protection limits power dissipation in RT9193. When the operation junction temperature exceeds 165 ° C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turn on again after the junction temperature cools by 30 ° C.
For continue operation, do not exceed absolute maximum operation junction temperature 125 ° C. The power dissipation definition in device is :
The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula :
Where TJ(MAX) is the maximum operation junction temperature 125 ° C, TA is the ambient temperature and the θ JA is the junction to ambient thermal resistance.
For recommended operating conditions specification of RT9193, where TJ(MAX) is the maximum junction temperature of the die (125 ° C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance ( θ JA is layout dependent) for TSOT-23-5/ SOT-23-5 package is 250 ° C/W, SC-70-5 package is 333 ° C/W, WDFN-6L 2x2 package is 165 ° C/W and MSOP8 package is 160 ° C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25 ° C can be calculated by following formula :
PD(MAX) = (125 ° C -25 ° C) / 333 = 300mW for
SC-70-5
PD(MAX) = (125 ° C -25 ° C) / 250 = 400mW for
TSOT-23-5/SOT-23-5
PD(MAX) = (125 ° C -25 ° C) / 165 = 606mW for
WDFN-6L 2x2
PD(MAX) = (125 ° C -25 ° C) / 160 = 625mW for
MSOP-8
The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θ JA. For RT9193 packages, the Figure 2 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.
Figure 2. Derating Curve for Packages
Typical Application
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| RT9193 | Richtek | — |
| RT9193-25XB | Richtek USA Inc. | — |
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