RT9193-25XB

Part: RT9193-33GB — Richtek Technology Corporation

Type: Low-Noise CMOS LDO Linear Regulator

Description: 300 mA, ultra-low noise, ultra-fast CMOS LDO regulator with 2.5–5.5 V input, 220 mV typical dropout at 300 mA, 90 μA typical quiescent current and a 50 μs typical start-up time.

Operating Conditions:

• Supply voltage: 2.5–5.5 V
• Operating temperature: -40 to 85 °C ambient (junction -40 to 125 °C)
• EN input voltage: 0–5.5 V
• Output capacitor: 1 μF minimum, ceramic or other low-ESR types

Absolute Maximum Ratings:

• Max supply input voltage: 6 V
• Max junction temperature: 150 °C
• Storage temperature: -65 to 150 °C
• Lead temperature (soldering, 10 s): 260 °C
• ESD: 2 kV HBM, 200 V MM

Key Specs:

• Output voltage accuracy: ±2% (IOUT = 1 mA, TA = 25 °C)
• Current limit: 360 mA min, 400 mA typ (RLOAD = 1 Ω)
• Quiescent current: 90 μA typ, 130 μA max (VEN ≥ 1.2 V, IOUT = 0 mA)
• Dropout voltage: 220 mV typ, 300 mV max at IOUT = 300 mA (VOUT > 2.8 V)
• Line regulation: 0.3% max (VIN = VOUT + 1 V to 5.5 V, IOUT = 1 mA)
• Load regulation: 0.6% max (1 mA < IOUT < 300 mA)
• Standby current: 0.01 μA typ, 1 μA max (VEN = GND)
• Output noise: 100 μVRMS typ (10 Hz–100 kHz, IOUT = 200 mA, COUT = 1 μF)
• PSRR: -70 dB at 100 Hz, -50 dB at 10 kHz (COUT = 1 μF, IOUT = 10 mA)
• EN thresholds: VIL 0.4 V max, VIH 1.2 V min (VIN = 3–5.5 V)
• Thermal shutdown: 165 °C typ, with 30 °C hysteresis

Features:

• Ultra-low noise for RF applications, with noise bypass (BP) pin
• Ultra-fast line and load transient response
• Quick start-up (typically 50 μs)
• TTL-logic-controlled shutdown input with quick-discharge function
• Current limiting and thermal shutdown protection
• Stable with a 1 μF ceramic output capacitor
• Low temperature coefficient
• Custom output voltages available
• RoHS compliant and 100% lead (Pb)-free

Applications:

• CDMA/GSM cellular handsets
• Battery-powered equipment
• Laptop, palmtop and notebook computers
• Hand-held instruments
• PCMCIA cards
• Portable information appliances

Package:

• SC-70-5
• SOT-23-5
• TSOT-23-5
• WDFN-6L 2x2
• MSOP-8

• z Ultra Low Noise for RF Application

• z Ultra Fast Response in Line/Load Transient

• z Quick Start-Up (Typically 50us)

• z < 0.01μA Standby Current When Shutdown

• z Low Dropout : 220mV @ 300mA

• z Wide Operating Voltage Ranges : 2.5V to 5.5V

• z TTL-Logic-Controlled Shutdown Input

• z Low Temperature Coefficient

• z Current Limiting Protection

• z Thermal Shutdown Protection

• z Only 1 μ F Output Capacitor Required for Stability

• z High Power Supply Rejection Ratio

• z Custom Voltage Available

• z RoHS Compliant and 100% Lead (Pb)-Free

• z CDMA/GSM Cellular Handsets

• z Battery-Powered Equipment

• z Laptop, Palmtops, Notebook Computers

• z Hand-Held Instruments

• z PCMCIA Cards

• z Portable Information Appliances

SC-70-5/SOT-23-5/TSOT-23-5

(VIN = VOUT + 1V, CIN = COUT = 1μF, CBP = 22nF, TA = 25°C, unless otherwise specified)

Thermal protection limits power dissipation in RT9193. When the operation junction temperature exceeds 165 ° C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turn on again after the junction temperature cools by 30 ° C.

For continue operation, do not exceed absolute maximum operation junction temperature 125 ° C. The power dissipation definition in device is :

$$P_D = (V_{IN} - V_{OUT}) \times I_{OUT} + V_{IN} \times I_Q$$

The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula :

$$P_{D(MAX)} = ( T_{J(MAX)} - T_A ) / \theta_{JA}$$

Where TJ(MAX) is the maximum operation junction temperature 125 ° C, TA is the ambient temperature and the θ JA is the junction to ambient thermal resistance.

For recommended operating conditions specification of RT9193, where TJ(MAX) is the maximum junction temperature of the die (125 ° C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance ( θ JA is layout dependent) for TSOT-23-5/ SOT-23-5 package is 250 ° C/W, SC-70-5 package is 333 ° C/W, WDFN-6L 2x2 package is 165 ° C/W and MSOP8 package is 160 ° C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25 ° C can be calculated by following formula :

PD(MAX) = (125 ° C -25 ° C) / 333 = 300mW for

SC-70-5

PD(MAX) = (125 ° C -25 ° C) / 250 = 400mW for

TSOT-23-5/SOT-23-5

PD(MAX) = (125 ° C -25 ° C) / 165 = 606mW for

WDFN-6L 2x2

PD(MAX) = (125 ° C -25 ° C) / 160 = 625mW for

MSOP-8

The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θ JA. For RT9193 packages, the Figure 2 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.

Figure 2. Derating Curve for Packages

Package Type

U5 : SC-70-5

B : SOT-23-5

J5 : TSOT-23-5

QW : WDFN-6L 2x2 (W-Type)

F : MSOP-8

Operating Temperature Range

P : Pb Free with Commercial Standard

• G : Green (Halogen Free with Commercial Standard)

Output Voltage

15 : 1.5V

16 : 1.6V

:

49 : 4.9V

50 : 5.0V

1H : 1.85V

2H : 2.85V

4G : 4.75V