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RT9193-25XB

The RT9193-25XB is an electronic component from Richtek USA Inc.. View the full RT9193-25XB datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Richtek USA Inc.

Overview

Part: RT9193 — Richtek Technology Corporation

Type: Ultra-Low Noise, Ultra-Fast CMOS LDO Regulator

Description: A 2.5–5.5 V input, 300 mA ultra-low noise LDO regulator optimized for battery-powered RF and wireless applications, featuring fast turn-on time, low quiescent current, and a noise bypass pin.

Operating Conditions:

  • Supply voltage: 2.5V to 5.5V
  • Operating temperature: -40°C to 125°C (Junction), -40°C to 85°C (Ambient)
  • EN Input Voltage: 0V to 5.5V

Absolute Maximum Ratings:

  • Max supply voltage: 6V
  • Max junction temperature: 150°C
  • Max storage temperature: -65°C to 150°C

Key Specs:

  • Output Voltage Accuracy: ±2% (I_OUT = 1mA)
  • Current Limit: 400 mA (Typ)
  • Quiescent Current: 90 μA (Typ, I_OUT = 0mA)
  • Dropout Voltage: 220 mV (Typ, I_OUT = 300mA, V_OUT > 2.8V)
  • Standby Current: 0.01 μA (Typ, V_EN = GND)
  • Output Noise Voltage: 100 μV RMS (Typ, 10Hz to 100kHz, I_OUT = 200mA)
  • Power Supply Rejection Ratio (PSRR): -70 dB (Typ, f = 100Hz, I_OUT = 10mA)
  • Thermal Shutdown Temperature: 165°C (Typ)

Features:

  • Ultra Low Noise for RF Application
  • Ultra Fast Response in Line/Load Transient
  • Quick Start-Up (Typically 50us)
  • < 0.01μA Standby Current When Shutdown
  • Low Dropout: 220mV @ 300mA
  • Wide Operating Voltage Ranges: 2.5V to 5.5V
  • TTL-Logic-Controlled Shutdown Input
  • Current Limiting Protection
  • Thermal Shutdown Protection
  • Only 1 μF Output Capacitor Required for Stability
  • High Power Supply Rejection Ratio

Applications:

  • CDMA/GSM Cellular Handsets
  • Battery-Powered Equipment
  • Laptop, Palmtops, Notebook Computers
  • Hand-Held Instruments
  • PCMCIA Cards
  • Portable Information Appliances

Package:

  • SC-70-5
  • SOT-23-5
  • TSOT-23-5
  • WDFN-6L 2x2
  • MSOP-8

Features

  • z Ultra Low Noise for RF Application

  • z Ultra Fast Response in Line/Load Transient

  • z Quick Start-Up (Typically 50us)

  • z < 0.01μA Standby Current When Shutdown

  • z

Low Dropout : 220mV @ 300mA

  • z Wide Operating Voltage Ranges : 2.5V to 5.5V

  • z TTL-Logic-Controlled Shutdown Input

  • z Low Temperature Coefficient

  • z Current Limiting Protection

  • z Thermal Shutdown Protection

  • z Only 1 μ F Output Capacitor Required for Stability

  • z High Power Supply Rejection Ratio

  • z Custom Voltage Available

  • z RoHS Compliant and 100% Lead (Pb)-Free

Applications

  • z CDMA/GSM Cellular Handsets

  • z Battery-Powered Equipment

  • z Laptop, Palmtops, Notebook Computers

  • z Hand-Held Instruments

  • z PCMCIA Cards

  • z Portable Information Appliances

Pin Configuration

SC-70-5/SOT-23-5/TSOT-23-5

Electrical Characteristics

(VIN = VOUT + 1V, CIN = COUT = 1μF, CBP = 22nF, TA = 25°C, unless otherwise specified)

ParameterParameterSymbolTest ConditionsMinTypMaxUnit
Output Voltage AccuracyOutput Voltage AccuracyΔ V OUTI OUT = 1mA- 2--2%
Current LimitCurrent LimitI LIMR LOAD = 1 Ω360400--mA
Quiescent CurrentQuiescent CurrentI QV EN ≥ 1.2V, I OUT =0mA--90130μ A
Dropout Voltage(Note 5)V DROPI OUT = 200mA, V OUT > 2.8V170200mV
Dropout VoltageV DROPI OUT = 300mA, V OUT > 2.8V--220300mV
Line RegulationLine RegulationΔ V LINEV IN = (V OUT + 1V) to 5.5V, I OUT = 1mA----0.3%
Load RegulationLoad RegulationΔ V LOAD1mA < I OUT < 300mA----0.6%
Standby CurrentStandby CurrentI STBYV EN = GND, Shutdown--0.011μ A
EN Input Bias CurrentEN Input Bias CurrentI IBSDV EN = GND or VIN--0100nA
EN ThresholdLogic-Low VoltageV ILV IN = 3V to 5.5V, Shutdown----0.4V
EN ThresholdLogic-HighV IHV IN = 3V to 5.5V, Start-Up1.2----V

Absolute Maximum Ratings

z Supply Input Voltage------------------------------------------------------------------------------------------------------6V
z PowerDissipation,P D @T A = 25 ° C
SC-70-5 ----------------------------------------------------------------------------------------------------------------------300mW
TSOT-23-5/SOT-23-5------------------------------------------------------------------------------------------------------400mW
WDFN-6L2x2-------------------------------------------------------------------------------------------------------------- 606mW
MSOP-8 ---------------------------------------------------------------------------------------------------------------------625mW
z Package Thermal Resistance (Note 2)
SOT-70-5, θ JA ---------------------------------------------------------------------------------------------------------------333 ° C/W
TSOT-23-5/SOT-23-5, θ JA ------------------------------------------------------------------------------------------------250 ° C/W
TSOT-23-5/SOT-23-5, θ JC -----------------------------------------------------------------------------------------------25 ° C/W
WDFN-6L 2x2, θ JA ---------------------------------------------------------------------------------------------------------165 ° C/W
WDFN-6L 2x2, θ JC --------------------------------------------------------------------------------------------------------20 ° C/W
MSOP-8 θ JA ----------------------------------------------------------------------------------------------------------------160 ° C/W
MSOP-8 θ JC ----------------------------------------------------------------------------------------------------------------55 ° C/W
z Junction Temperature-----------------------------------------------------------------------------------------------------150 ° C
z Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------------260 ° C
z StorageTemperatureRange --------------------------------------------------------------------------------------------- 65 ° Cto150 ° C
z ESD Susceptibility (Note 3)
HBM(HumanBodyMode) ----------------------------------------------------------------------------------------------2kV
MM(Machine Mode) ------------------------------------------------------------------------------------------------------200V
Recommended Operating Conditions (Note4)
z Supply Input Voltage------------------------------------------------------------------------------------------------------2.5V to 5.5V
z ENInput Voltage -----------------------------------------------------------------------------------------------------------0V to 5.5V
z JunctionTemperature Range--------------------------------------------------------------------------------------------- 40 ° Cto125 ° C
z AmbientTemperature Range--------------------------------------------------------------------------------------------- 40 ° Cto 85 ° C

Thermal Information

Thermal protection limits power dissipation in RT9193. When the operation junction temperature exceeds 165 ° C, the OTP circuit starts the thermal shutdown function turn the pass element off. The pass element turn on again after the junction temperature cools by 30 ° C.

For continue operation, do not exceed absolute maximum operation junction temperature 125 ° C. The power dissipation definition in device is :

The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula :

Where TJ(MAX) is the maximum operation junction temperature 125 ° C, TA is the ambient temperature and the θ JA is the junction to ambient thermal resistance.

For recommended operating conditions specification of RT9193, where TJ(MAX) is the maximum junction temperature of the die (125 ° C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance ( θ JA is layout dependent) for TSOT-23-5/ SOT-23-5 package is 250 ° C/W, SC-70-5 package is 333 ° C/W, WDFN-6L 2x2 package is 165 ° C/W and MSOP8 package is 160 ° C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25 ° C can be calculated by following formula :

PD(MAX) = (125 ° C -25 ° C) / 333 = 300mW for

SC-70-5

PD(MAX) = (125 ° C -25 ° C) / 250 = 400mW for

TSOT-23-5/SOT-23-5

PD(MAX) = (125 ° C -25 ° C) / 165 = 606mW for

WDFN-6L 2x2

PD(MAX) = (125 ° C -25 ° C) / 160 = 625mW for

MSOP-8

The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θ JA. For RT9193 packages, the Figure 2 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed.

Figure 2. Derating Curve for Packages

Typical Application

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
RT9193Richtek
RT9193-33GBRichtek USA Inc.SC-74A, SOT-753
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