NTA/NTE4151P

Small Signal MOSFET

Manufacturer

ON Semiconductor

Overview

Part: ON Semiconductor Small Signal MOSFET

Type: Single P-Channel Small Signal MOSFET

Key Specs:

  • Drain-to-Source Voltage: -20 V
  • Continuous Drain Current: -760 mA
  • Typical RDS(on) @ VGS = -4.5 V: 0.26 Ω
  • Gate-to-Source ESD Rating (Human Body Model): 1800 V
  • Power Dissipation (SC-75): 301 mW
  • Power Dissipation (SC-89): 313 mW

Features:

  • Low RDS(on) for Higher Efficiency and Longer Battery Life
  • Small Outline Package (1.6 x 1.6 mm)
  • SC-75 Standard Gullwing Package
  • ESD Protected Gate
  • Pb-Free Packages are Available

Applications:

  • High Side Load Switch
  • DC-DC Conversion
  • Small Drive Circuits
  • Battery Operated Systems such as Cell Phones, PDAs, Digital Cameras, etc.

Package:

  • SC-75: 1.6 x 1.6 mm
  • SC-89: Small Outline Package

Features

  • Low RDS(on) for Higher Efficiency and Longer Battery Life
  • Small Outline Package (1.6 x 1.6 mm)
  • SC-75 Standard Gullwing Package
  • ESD Protected Gate
  • Pb-Free Packages are Available

Applications

  • High Side Load Switch
  • DC-DC Conversion
  • Small Drive Circuits
  • Battery Operated Systems such as Cell Phones, PDAs, Digital Cameras, etc.

Pin Configuration

SC-89 CASE 463C

xx = Device Code M = Date Code* = Pb-Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending upon manufacturing location.

ORDERING INFORMATION

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

Electrical Characteristics

Parameterer Symbol Test ConditionMinTypMaxUnit
OFF CHARACTERISTICS
Drain-to-Source Breakdown VoltageV (BR)DSSVGS = 0 V, ID = -250 μ A-20V
Zero Gate Voltage Drain CurrentI DSSVGS = 0 V, VDS = -16 V-1.0-100nA
Gate-to-Source Leakage CurrentI GSSVDS = 0 V, VGS = ± 4.5 V± 1.0± 10μΑ
ON CHARACTERISTICS (Note 2)
Gate Threshold VoltageV GS(TH)VDS = VGS, ID = -250 μ A-0.45V
Drain-to-Source On ResistanceR DS(on)VGS = -4.5 V, ID = -350 mA0.260.36Ω
VGS = -2.5 V, ID = -300 mA0.350.45
VGS = -1.8 V, ID = -150 mA0.491.0
Forward Transconductance9FSVDS = -10 V, ID = -250 mA0.4S
CHARGES AND CAPACITANCES
Input CapacitanceC ISSVGS = 0 V, f = 1.0 MHz,156pF
Output CapacitanceC OSSVDS = -5.0 V28
Reverse Transfer CapacitanceC RSS118
Total Gate ChargeQ G(TOT)VGS = -4.5 V, VDD = -10 V, ID = -0.3 A2.1nC
Threshold Gate ChargeQ G(TH)ID = -0.3 A0.1251
Gate-to-Source ChargeQ GS10.325
Gate-to-Drain ChargeQGD0.5
SWITCHING CHARACTERISTICS (Note: 3)
Turn-On Delay Timetd (ON)VGS = -4.5 V, VDD = -10 V,8.0ns
Rise Timet rID = -200 mA, RG = 10 Ω8.2
Turn-Off Delay Timetd (OFF)1291
Fall Timet f120.4
DRAIN-SOURCE DIODE CHARACTERISTICS
Forward Diode VoltageVSDVGS = 0 V, IS = -250 mA-0.72-1.1V

Absolute Maximum Ratings

ParameterSymbolValueUnits
Drain-to-Source VoltageVDSS-20V
Gate-to-Source VoltageVGS±6.0
Continuous Drain Current (Note 1) Steady StateI D –760
Power Dissipation (Note 1)
SC-75
SC-89 Steady State
P D301
313
Pulsed Drain Current tp =10 μsI DM±1000
Operating Junction and StoragT J ,
T STG
–55 to
150
°C
Continuous Source Current (BoI S-250mA
Lead Temperature for Soldering (1/8 in from case for 10 s)T L260°C
Gate-to-Source ESD Rating -
(Human Body Model
ESD1800V

Thermal Information

Junction-to-Ambient - Steady State (Note 1)Rθ JA°C/W
SC-75415
SC-89400

Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces).

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
NTA4151PT1ON Semiconductor
NTA4151PT1GON SemiconductorSC-75(SOT-416)
NTE4151PT1GON Semiconductor
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