N32G031F6S7

Part: N32G031x6/x8 — Nuvoton

Type: ARM Cortex-M0 Microcontroller

Description: 32-bit ARM Cortex-M0 microcontroller with a maximum operating frequency of 48MHz, integrating up to 64KB Flash, 8KB SRAM, 1x12bit 1Msps ADC, 1xOPAMP, 1xCOMP, and multiple U(S)ART, I2C, SPI interfaces.

Operating Conditions:

• Supply voltage: 1.8V–5.5V
• Operating temperature: -40 °C to 105 °C
• Max CPU frequency: 48 MHz

Absolute Maximum Ratings:

Key Specs:

• CPU Core: 32-bit ARM Cortex-M0
• Max CPU Frequency: 48 MHz
• Flash Memory: Up to 64 KByte
• SRAM: 8 KByte
• ADC Resolution: 12-bit
• ADC Sample Rate: 1 Msps
• I2C Max Rate: 1 MHz
• SPI Max Rate: 18 MHz

Features:

• Single-cycle hardware multiplication instruction
• Encrypted Flash storage with hardware ECC
• Low power Stop and Power Down modes
• Multiple clock sources (HSE, LSE, HSI, LSI, PLL)
• Programmable low voltage detection and reset
• 3 U(S)ART, 2 SPI, 2 I2C interfaces
• 12-channel 12-bit 1Msps ADC
• 1 operational amplifier with programmable gain
• 1 high-speed analog comparator
• Up to 40 GPIOs
• 5-channel DMA controller
• RTC with perpetual calendar and alarm events
• Multiple timers (advanced, general-purpose, basic, low-power, SysTick)
• Window Watchdog (WWDG) and Independent Watchdog (IWDG)
• SWD on-line debugging and UART Bootloader
• Hardware divider (HDIV) and square root (SQRT) acceleration
• Flash Write Protection (WRP) and Read Protection (RDP) levels
• Clock failure detection, anti-tamper detection
• 96-bit UID and 128-bit UCID

Applications:

Package:

• UFQFPN20 (3mm x 3mm)
• TSSOP20 (6.5mm x 4.4mm)
• QFN32 (4mm x 4mm)
• QFN32 (5mm x 5mm)
• LQFP32 (7mm x 7mm)
• LQFP48 (7mm x 7mm)
• TQFP48 (7mm x 7mm)

• Flash storage encryption
• CRC16/32 calculation
• Supports Write Protection (WRP), multiple Read Protection (RDP) levels (L0/L1/L2)
• Supports clock failure detection, anti-tamper detection
• 96-bit UID and 128-bit UCID

Unless otherwise specified, parameters are measured under ambient temperature, fHCLK frequency, and VDDA supply voltage conditions compliant with Table 4-4.

Table 4-33 ADC Characteristics

Table 4-33 ADC Characteristics

1. Guaranteed by design and characterization, not tested in production.
2. VREF+ is internally connected to VDDA.

Formula 1: Maximum RAIN Formula

RAIN < TS fADC ×CADC × ln(2 N+2 ) -RADC

The above formula (Formula 1) is used to determine the maximum external impedance such that the error is less than 1/4 LSB. Where N=12 (representing 12-bit resolution).

Table 4-34 ADC Accuracy - Limited Test Conditions (1)(2)

1. ADC DC accuracy values are measured after internal calibration.
2. Relationship between ADC accuracy and reverse injection current: It is necessary to avoid injecting reverse current on any standard analog input pin, as this will significantly reduce the conversion accuracy of another analog input pin that is currently converting. It is recommended to add a Schottky diode (between the pin and ground) on standard analog pins where reverse injection current may occur.
3. Guaranteed by characterization, not tested in production.

Stresses above the values listed in the 'Absolute Maximum Ratings' tables (Table 4-1, Table 4-2, Table 4-3) may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or at any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

Table 4-1 Voltage Characteristics

Table 4-2 Current Characteristics

Figure 4-4 Current Consumption Measurement Scheme

Table 4-2 Current Characteristics

1. Reverse injection current can interfere with the device's analog performance. See Section 4.3.17.
2. When several I/O ports have injection current simultaneously, the maximum value of ∑IINJ(PIN) is the sum of the instantaneous absolute values of the positive injection current and the reverse injection current. This result is based on the characterization of the maximum ∑IINJ(PIN) on 4 I/O ports of the device.

Table 4-3 Temperature Characteristics