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MSP432P401RIZXHR

Mixed-Signal Microcontroller

The MSP432P401RIZXHR is a mixed-signal microcontroller from Texas Instruments. View the full MSP432P401RIZXHR datasheet below including absolute maximum ratings.

Manufacturer

Texas Instruments

Category

Mixed-Signal Microcontroller

Overview

Part: MSP432P401R, MSP432P401M — Texas Instruments

Type: Mixed-Signal Microcontroller

Description: 32-bit ARM Cortex-M4F CPU with FPU operating up to 48 MHz, featuring up to 256 KB Flash, 64 KB SRAM, and a 1 MSPS 14-bit SAR ADC, designed for ultra-low-power mixed-signal applications.

Operating Conditions:

  • Supply voltage: 1.62 V to 3.7 V
  • Operating temperature: -40°C to 85°C
  • Max CPU frequency: 48 MHz

Absolute Maximum Ratings:

Key Specs:

  • CPU: ARM 32-Bit Cortex-M4F with FPU
  • Max CPU frequency: 48 MHz
  • Flash memory: Up to 256 KB
  • SRAM: Up to 64 KB
  • Active mode current: 80 μA/MHz
  • LPM3 (with RTC) current: 660 nA (Typical)
  • ADC: 14-Bit 1-MSPS SAR ADC
  • I/O leakage: ±20 nA Maximum

Features:

  • Memory Protection Unit
  • 16 KB Flash Information Memory
  • 32 KB ROM with MSP432 Peripheral Driver Libraries
  • Tunable Internal DCO (up to 48 MHz)
  • JTAG and SWD Lock
  • IP Protection (up to Four Secure Flash Zones)
  • 8-Channel DMA
  • RTC with Calendar and Alarm Functions
  • Up to four 16-bit Timers
  • Two 32-bit Timers
  • Up to four eUSCI_A Modules (UART, IrDA, SPI)
  • Up to four eUSCI_B Modules (I2C, SPI)
  • Ultra-Low-Leakage I/Os
  • All I/Os with Capacitive-Touch Capability
  • Up to 48 I/Os with Interrupt and Wake-up Capability
  • Up to 24 I/Os with Port Mapping Capability
  • Eight I/Os with Glitch Filtering Capability
  • Internal Voltage Reference with 10-ppm/°C Typical Stability
  • Two Analog Comparators
  • 128-, 192-, or 256-Bit AES Encryption and Decryption Accelerator
  • 32-Bit Hardware CRC Engine
  • Support for 4-Pin JTAG and 2-Pin SWD Debug Interfaces
  • Support for Serial Wire Trace
  • Support for Power Debug and Profiling of Applications

Applications:

  • Industrial and Automation (Home Automation, Smoke Detectors, Barcode Scanners, Access Panels)
  • Metering (Electric Meters, Flow Meters, Communication Modules)
  • Health and Fitness (Watches, Activity Monitors, Fitness Accessories, Blood Glucose Meters)
  • Consumer Electronics (Mobile Devices, Sensor Hubs)

Package:

  • LQFP (100) - 14 mm × 14 mm
  • NFBGA (80) - 5 mm × 5 mm
  • VQFN (64) - 9 mm × 9 mm

Features

1

  • Core
  • -ARM ® 32-Bit Cortex ® -M4F CPU With FloatingPoint Unit and Memory Protection Unit
  • -Frequency up to 48 MHz
  • -ULPBench™ Benchmark:
  • 192.3 ULPMark™-CP
  • -Performance Benchmark:
  • 3.41 CoreMark/MHz
  • 1.22 DMIPS/MHz (Dhrystone 2.1)

Applications

  • Industrial and Automation
  • -Home Automation
  • -Smoke Detectors
  • -Barcode Scanners
  • -Access Panels
  • Metering
  • -Electric Meters
  • -Flow Meters
  • -Communication Modules

Pin Configuration

FUNCTIONCONTROL BITS OR SIGNALS (1)CONTROL BITS OR SIGNALS (1)CONTROL BITS OR SIGNALS (1)
P1DIR.xP1SEL1.xP1SEL0.x
P1.0/UCA0STEP1.0 (I/O)I: 0; O: 100
P1.0/UCA0STEUCA0STEX (2)01
P1.0/UCA0STEN/A0
P1.0/UCA0STEDVSS110
P1.0/UCA0STEN/A0
P1.0/UCA0STEDVSS111
P1.1/UCA0CLKP1.1 (I/O)I: 0; O: 100
P1.1/UCA0CLKUCA0CLKX (2)01
P1.1/UCA0CLKN/A0
P1.1/UCA0CLKDVSS110
P1.1/UCA0CLKN/A0
P1.2/UCA0RXD/UCA0SOMIDVSS111
P1.2/UCA0RXD/UCA0SOMIP1.2 (I/O)I: 0; O: 100
P1.2/UCA0RXD/UCA0SOMIUCA0RXD/UCA0SOMIX (2)01
P1.2/UCA0RXD/UCA0SOMIN/A010
P1.2/UCA0RXD/UCA0SOMIDVSS1
P1.2/UCA0RXD/UCA0SOMIN/A011
P1.3/UCA0TXD/UCA0SIMOP1.3 (I/O)I: 0; O: 100
P1.3/UCA0TXD/UCA0SIMOUCA0TXD/UCA0SIMOX (2)01
P1.3/UCA0TXD/UCA0SIMON/A0
P1.3/UCA0TXD/UCA0SIMODVSS110
P1.3/UCA0TXD/UCA0SIMON/A0
P1.3/UCA0TXD/UCA0SIMODVSS111
P1.4/UCB0STEP1.4 (I/O)I: 0; O: 100
P1.4/UCB0STEUCB0STEX (3)01
P1.4/UCB0STEN/A0
P1.4/UCB0STEDVSS110
P1.4/UCB0STEN/A0
P1.4/UCB0STEDVSS111
P1.5/UCB0CLKP1.5 (I/O)I: 0; O: 100
P1.5/UCB0CLKUCB0CLKX (3)01
P1.5/UCB0CLKN/A0
P1.5/UCB0CLKDVSS110
P1.5/UCB0CLKN/A DVSS0 111
P1.6 (I/O)I: 0; O: 100
UCB0SIMO/UCB0SDA
N/A		X (3)
0		01
DVSS
N/A		1
0		10
DVSS111

Absolute Maximum Ratings

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

MINMAXUNIT
Voltage applied at DVCC and AVCC pins to V SS-0.34.17V
Voltage difference between DVCC and AVCC pins (2)±0.3V
Voltage applied to any pin (3)-0.3V CC + 0.3 V (4.17 V MAX)V
Diode current at any device pin±2mA
Storage temperature, T stg (4)-40125°C
Maximum junction temperature, T J95°C
  • (2) Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device.

(3) All voltages referenced to V SS .

(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

Recommended Operating Conditions

Typical data are based on VCC = 3.0 V, TA = 25°C (unless otherwise noted)

MINNOMMAXUNIT
V CCAt power-up (with internal V CC supervision)1.713.7
Supply voltage range at all DVCC and AVCC pins (1) (2) (3)Normal operation with internal V CC supervision
Normal operation without internal V CC supervision		1.71
1.62		3.7
3.7		V
V SSSupply voltage on all DVSS and AVSS pinsSupply voltage on all DVSS and AVSS pins000V
I INRUSHInrush current into the V CC pins (4)Inrush current into the V CC pins (4)100mA
f MCLKFrequency of the CPU and AHB clock in the system (5)Frequency of the CPU and AHB clock in the system (5)048MHz
T AOperating free-air temperatureOperating free-air temperature-4085°C
T JOperating junction temperatureOperating junction temperature-4085°C
  • (3) Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.

(4) Does not include I/O currents (driven by application requirements).

  • (5) Operating frequency may require the flash to be accessed with wait states. See Section 5.8 for further details.

Thermal Information

THERMAL METRICS (1)THERMAL METRICS (1)PACKAGEVALUE (2)UNIT
R θ JAJunction-to-ambient thermal resistance, still air (3)LQFP-100 (PZ)50.9°C/W
R θ JC(TOP)Junction-to-case (top) thermal resistance (4)LQFP-100 (PZ)9.7°C/W
R θ JBJunction-to-board thermal resistance (5)LQFP-100 (PZ)27.2°C/W
Ψ JBJunction-to-board thermal characterization parameterLQFP-100 (PZ)26.9°C/W
Ψ JTJunction-to-top thermal characterization parameterLQFP-100 (PZ)0.2°C/W
R θ JC(BOTTOM)Junction-to-case (bottom) thermal resistance (6)LQFP-100 (PZ)N/A°C/W
R θ JAJunction-to-ambient thermal resistance, still air (3)NFBGA-80 (ZXH)58.1°C/W
R θ JC(TOP)Junction-to-case (top) thermal resistance (4)NFBGA-80 (ZXH)26.1°C/W
R θ JBJunction-to-board thermal resistance (5)NFBGA-80 (ZXH)22.6°C/W
Ψ JBJunction-to-board thermal characterization parameterNFBGA-80 (ZXH)22.0°C/W
Ψ JTJunction-to-top thermal characterization parameterNFBGA-80 (ZXH)0.5°C/W
R θ JC(BOTTOM)Junction-to-case (bottom) thermal resistance (6)NFBGA-80 (ZXH)N/A°C/W
R θ JAJunction-to-ambient thermal resistance, still air (3)VQFN-64 (RGC)29.4°C/W
R θ JC(TOP)Junction-to-case (top) thermal resistance (4)VQFN-64 (RGC)14.8°C/W
R θ JBJunction-to-board thermal resistance (5)VQFN-64 (RGC)8.3°C/W
Ψ JBJunction-to-board thermal characterization parameterVQFN-64 (RGC)8.2°C/W
Ψ JTJunction-to-top thermal characterization parameterVQFN-64 (RGC)0.2°C/W
R θ JC(BOTTOM)Junction-to-case (bottom) thermal resistance (6)VQFN-64 (RGC)1.0°C/W

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MSP432P401MTexas Instruments—
MSP432P401MIPZTexas InstrumentsLQFP (100)
MSP432P401MIPZRTexas Instruments—
MSP432P401MIRGCTexas InstrumentsVQFN (64)
MSP432P401MIZXHTexas InstrumentsNFBGA (80)
MSP432P401MIZXHRTexas Instruments—
MSP432P401MIZXHTTexas Instruments—
MSP432P401RTexas Instruments—
MSP432P401RIPZTexas InstrumentsLQ
MSP432P401RIPZRTexas Instruments—
MSP432P401RIRGCTexas InstrumentsVQFN (64)
MSP432P401RIZXHTexas InstrumentsNFBGA (80)
MSP432P401RIZXHTTexas Instruments—
MSP432P401XTexas Instruments—
MSP432P401XXTexas Instruments—
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