MSP432P401M
Mixed-Signal MicrocontrollerThe MSP432P401M is a mixed-signal microcontroller from Texas Instruments. View the full MSP432P401M datasheet below including absolute maximum ratings.
Manufacturer
Texas Instruments
Category
Mixed-Signal Microcontroller
Overview
Part: MSP432P401R, MSP432P401M — Texas Instruments
Type: Mixed-Signal Microcontroller
Description: 32-bit ARM Cortex-M4F CPU with FPU operating up to 48 MHz, featuring up to 256 KB Flash, 64 KB SRAM, and a 1 MSPS 14-bit SAR ADC, designed for ultra-low-power mixed-signal applications.
Operating Conditions:
- Supply voltage: 1.62 V to 3.7 V
- Operating temperature: -40°C to 85°C
- Max CPU frequency: 48 MHz
Absolute Maximum Ratings:
Key Specs:
- CPU: ARM 32-Bit Cortex-M4F with FPU
- Max CPU frequency: 48 MHz
- Flash memory: Up to 256 KB
- SRAM: Up to 64 KB
- Active mode current: 80 μA/MHz
- LPM3 (with RTC) current: 660 nA (Typical)
- ADC: 14-Bit 1-MSPS SAR ADC
- I/O leakage: ±20 nA Maximum
Features:
- Memory Protection Unit
- 16 KB Flash Information Memory
- 32 KB ROM with MSP432 Peripheral Driver Libraries
- Tunable Internal DCO (up to 48 MHz)
- JTAG and SWD Lock
- IP Protection (up to Four Secure Flash Zones)
- 8-Channel DMA
- RTC with Calendar and Alarm Functions
- Up to four 16-bit Timers
- Two 32-bit Timers
- Up to four eUSCI_A Modules (UART, IrDA, SPI)
- Up to four eUSCI_B Modules (I2C, SPI)
- Ultra-Low-Leakage I/Os
- All I/Os with Capacitive-Touch Capability
- Up to 48 I/Os with Interrupt and Wake-up Capability
- Up to 24 I/Os with Port Mapping Capability
- Eight I/Os with Glitch Filtering Capability
- Internal Voltage Reference with 10-ppm/°C Typical Stability
- Two Analog Comparators
- 128-, 192-, or 256-Bit AES Encryption and Decryption Accelerator
- 32-Bit Hardware CRC Engine
- Support for 4-Pin JTAG and 2-Pin SWD Debug Interfaces
- Support for Serial Wire Trace
- Support for Power Debug and Profiling of Applications
Applications:
- Industrial and Automation (Home Automation, Smoke Detectors, Barcode Scanners, Access Panels)
- Metering (Electric Meters, Flow Meters, Communication Modules)
- Health and Fitness (Watches, Activity Monitors, Fitness Accessories, Blood Glucose Meters)
- Consumer Electronics (Mobile Devices, Sensor Hubs)
Package:
- LQFP (100) - 14 mm × 14 mm
- NFBGA (80) - 5 mm × 5 mm
- VQFN (64) - 9 mm × 9 mm
Features
1
- Core
- -ARM ® 32-Bit Cortex ® -M4F CPU With FloatingPoint Unit and Memory Protection Unit
- -Frequency up to 48 MHz
- -ULPBench™ Benchmark:
- 192.3 ULPMark™-CP
- -Performance Benchmark:
- 3.41 CoreMark/MHz
- 1.22 DMIPS/MHz (Dhrystone 2.1)
Applications
- Industrial and Automation
- -Home Automation
- -Smoke Detectors
- -Barcode Scanners
- -Access Panels
- Metering
- -Electric Meters
- -Flow Meters
- -Communication Modules
Pin Configuration
| FUNCTION | CONTROL BITS OR SIGNALS (1) | CONTROL BITS OR SIGNALS (1) | CONTROL BITS OR SIGNALS (1) | |
|---|---|---|---|---|
| P1DIR.x | P1SEL1.x | P1SEL0.x | ||
| P1.0/UCA0STE | P1.0 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.0/UCA0STE | UCA0STE | X (2) | 0 | 1 |
| P1.0/UCA0STE | N/A | 0 | ||
| P1.0/UCA0STE | DVSS | 1 | 1 | 0 |
| P1.0/UCA0STE | N/A | 0 | ||
| P1.0/UCA0STE | DVSS | 1 | 1 | 1 |
| P1.1/UCA0CLK | P1.1 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.1/UCA0CLK | UCA0CLK | X (2) | 0 | 1 |
| P1.1/UCA0CLK | N/A | 0 | ||
| P1.1/UCA0CLK | DVSS | 1 | 1 | 0 |
| P1.1/UCA0CLK | N/A | 0 | ||
| P1.2/UCA0RXD/UCA0SOMI | DVSS | 1 | 1 | 1 |
| P1.2/UCA0RXD/UCA0SOMI | P1.2 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.2/UCA0RXD/UCA0SOMI | UCA0RXD/UCA0SOMI | X (2) | 0 | 1 |
| P1.2/UCA0RXD/UCA0SOMI | N/A | 0 | 1 | 0 |
| P1.2/UCA0RXD/UCA0SOMI | DVSS | 1 | ||
| P1.2/UCA0RXD/UCA0SOMI | N/A | 0 | 1 | 1 |
| P1.3/UCA0TXD/UCA0SIMO | P1.3 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.3/UCA0TXD/UCA0SIMO | UCA0TXD/UCA0SIMO | X (2) | 0 | 1 |
| P1.3/UCA0TXD/UCA0SIMO | N/A | 0 | ||
| P1.3/UCA0TXD/UCA0SIMO | DVSS | 1 | 1 | 0 |
| P1.3/UCA0TXD/UCA0SIMO | N/A | 0 | ||
| P1.3/UCA0TXD/UCA0SIMO | DVSS | 1 | 1 | 1 |
| P1.4/UCB0STE | P1.4 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.4/UCB0STE | UCB0STE | X (3) | 0 | 1 |
| P1.4/UCB0STE | N/A | 0 | ||
| P1.4/UCB0STE | DVSS | 1 | 1 | 0 |
| P1.4/UCB0STE | N/A | 0 | ||
| P1.4/UCB0STE | DVSS | 1 | 1 | 1 |
| P1.5/UCB0CLK | P1.5 (I/O) | I: 0; O: 1 | 0 | 0 |
| P1.5/UCB0CLK | UCB0CLK | X (3) | 0 | 1 |
| P1.5/UCB0CLK | N/A | 0 | ||
| P1.5/UCB0CLK | DVSS | 1 | 1 | 0 |
| P1.5/UCB0CLK | N/A DVSS | 0 1 | 1 | 1 |
| P1.6 (I/O) | I: 0; O: 1 | 0 | 0 | |
| UCB0SIMO/UCB0SDA N/A | X (3) 0 | 0 | 1 | |
| DVSS N/A | 1 0 | 1 | 0 | |
| DVSS | 1 | 1 | 1 |
Absolute Maximum Ratings
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
| MIN | MAX | UNIT | |
|---|---|---|---|
| Voltage applied at DVCC and AVCC pins to V SS | -0.3 | 4.17 | V |
| Voltage difference between DVCC and AVCC pins (2) | ±0.3 | V | |
| Voltage applied to any pin (3) | -0.3 | V CC + 0.3 V (4.17 V MAX) | V |
| Diode current at any device pin | ±2 | mA | |
| Storage temperature, T stg (4) | -40 | 125 | °C |
| Maximum junction temperature, T J | 95 | °C |
- (2) Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device.
(3) All voltages referenced to V SS .
(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
Recommended Operating Conditions
Typical data are based on VCC = 3.0 V, TA = 25°C (unless otherwise noted)
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| V CC | At power-up (with internal V CC supervision) | 1.71 | 3.7 | |||
| Supply voltage range at all DVCC and AVCC pins (1) (2) (3) | Normal operation with internal V CC supervision Normal operation without internal V CC supervision | 1.71 1.62 | 3.7 3.7 | V | ||
| V SS | Supply voltage on all DVSS and AVSS pins | Supply voltage on all DVSS and AVSS pins | 0 | 0 | 0 | V |
| I INRUSH | Inrush current into the V CC pins (4) | Inrush current into the V CC pins (4) | 100 | mA | ||
| f MCLK | Frequency of the CPU and AHB clock in the system (5) | Frequency of the CPU and AHB clock in the system (5) | 0 | 48 | MHz | |
| T A | Operating free-air temperature | Operating free-air temperature | -40 | 85 | °C | |
| T J | Operating junction temperature | Operating junction temperature | -40 | 85 | °C |
- (3) Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.
(4) Does not include I/O currents (driven by application requirements).
- (5) Operating frequency may require the flash to be accessed with wait states. See Section 5.8 for further details.
Thermal Information
| THERMAL METRICS (1) | THERMAL METRICS (1) | PACKAGE | VALUE (2) | UNIT |
|---|---|---|---|---|
| R θ JA | Junction-to-ambient thermal resistance, still air (3) | LQFP-100 (PZ) | 50.9 | °C/W |
| R θ JC(TOP) | Junction-to-case (top) thermal resistance (4) | LQFP-100 (PZ) | 9.7 | °C/W |
| R θ JB | Junction-to-board thermal resistance (5) | LQFP-100 (PZ) | 27.2 | °C/W |
| Ψ JB | Junction-to-board thermal characterization parameter | LQFP-100 (PZ) | 26.9 | °C/W |
| Ψ JT | Junction-to-top thermal characterization parameter | LQFP-100 (PZ) | 0.2 | °C/W |
| R θ JC(BOTTOM) | Junction-to-case (bottom) thermal resistance (6) | LQFP-100 (PZ) | N/A | °C/W |
| R θ JA | Junction-to-ambient thermal resistance, still air (3) | NFBGA-80 (ZXH) | 58.1 | °C/W |
| R θ JC(TOP) | Junction-to-case (top) thermal resistance (4) | NFBGA-80 (ZXH) | 26.1 | °C/W |
| R θ JB | Junction-to-board thermal resistance (5) | NFBGA-80 (ZXH) | 22.6 | °C/W |
| Ψ JB | Junction-to-board thermal characterization parameter | NFBGA-80 (ZXH) | 22.0 | °C/W |
| Ψ JT | Junction-to-top thermal characterization parameter | NFBGA-80 (ZXH) | 0.5 | °C/W |
| R θ JC(BOTTOM) | Junction-to-case (bottom) thermal resistance (6) | NFBGA-80 (ZXH) | N/A | °C/W |
| R θ JA | Junction-to-ambient thermal resistance, still air (3) | VQFN-64 (RGC) | 29.4 | °C/W |
| R θ JC(TOP) | Junction-to-case (top) thermal resistance (4) | VQFN-64 (RGC) | 14.8 | °C/W |
| R θ JB | Junction-to-board thermal resistance (5) | VQFN-64 (RGC) | 8.3 | °C/W |
| Ψ JB | Junction-to-board thermal characterization parameter | VQFN-64 (RGC) | 8.2 | °C/W |
| Ψ JT | Junction-to-top thermal characterization parameter | VQFN-64 (RGC) | 0.2 | °C/W |
| R θ JC(BOTTOM) | Junction-to-case (bottom) thermal resistance (6) | VQFN-64 (RGC) | 1.0 | °C/W |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| MSP432P401MIPZ | Texas Instruments | LQFP (100) |
| MSP432P401MIPZR | Texas Instruments | — |
| MSP432P401MIRGC | Texas Instruments | VQFN (64) |
| MSP432P401MIZXH | Texas Instruments | NFBGA (80) |
| MSP432P401MIZXHR | Texas Instruments | — |
| MSP432P401MIZXHT | Texas Instruments | — |
| MSP432P401R | Texas Instruments | — |
| MSP432P401RIPZ | Texas Instruments | LQ |
| MSP432P401RIPZR | Texas Instruments | — |
| MSP432P401RIRGC | Texas Instruments | VQFN (64) |
| MSP432P401RIZXH | Texas Instruments | NFBGA (80) |
| MSP432P401RIZXHR | Texas Instruments | — |
| MSP432P401RIZXHT | Texas Instruments | — |
| MSP432P401X | Texas Instruments | — |
| MSP432P401XX | Texas Instruments | — |
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