MSP432P401MIZXHT

Part: MSP432P401R, MSP432P401M — Texas Instruments

Type: Mixed-Signal Microcontroller

Description: 32-bit ARM Cortex-M4F CPU with FPU operating up to 48 MHz, featuring up to 256 KB Flash, 64 KB SRAM, and a 1 MSPS 14-bit SAR ADC, designed for ultra-low-power mixed-signal applications.

Operating Conditions:

• Supply voltage: 1.62 V to 3.7 V
• Operating temperature: -40°C to 85°C
• Max CPU frequency: 48 MHz

Absolute Maximum Ratings:

Key Specs:

• CPU: ARM 32-Bit Cortex-M4F with FPU
• Max CPU frequency: 48 MHz
• Flash memory: Up to 256 KB
• SRAM: Up to 64 KB
• Active mode current: 80 μA/MHz
• LPM3 (with RTC) current: 660 nA (Typical)
• ADC: 14-Bit 1-MSPS SAR ADC
• I/O leakage: ±20 nA Maximum

Features:

• Memory Protection Unit
• 16 KB Flash Information Memory
• 32 KB ROM with MSP432 Peripheral Driver Libraries
• Tunable Internal DCO (up to 48 MHz)
• JTAG and SWD Lock
• IP Protection (up to Four Secure Flash Zones)
• 8-Channel DMA
• RTC with Calendar and Alarm Functions
• Up to four 16-bit Timers
• Two 32-bit Timers
• Up to four eUSCI_A Modules (UART, IrDA, SPI)
• Up to four eUSCI_B Modules (I2C, SPI)
• Ultra-Low-Leakage I/Os
• All I/Os with Capacitive-Touch Capability
• Up to 48 I/Os with Interrupt and Wake-up Capability
• Up to 24 I/Os with Port Mapping Capability
• Eight I/Os with Glitch Filtering Capability
• Internal Voltage Reference with 10-ppm/°C Typical Stability
• Two Analog Comparators
• 128-, 192-, or 256-Bit AES Encryption and Decryption Accelerator
• 32-Bit Hardware CRC Engine
• Support for 4-Pin JTAG and 2-Pin SWD Debug Interfaces
• Support for Serial Wire Trace
• Support for Power Debug and Profiling of Applications

Applications:

• Industrial and Automation (Home Automation, Smoke Detectors, Barcode Scanners, Access Panels)
• Metering (Electric Meters, Flow Meters, Communication Modules)
• Health and Fitness (Watches, Activity Monitors, Fitness Accessories, Blood Glucose Meters)
• Consumer Electronics (Mobile Devices, Sensor Hubs)

Package:

• LQFP (100) - 14 mm × 14 mm
• NFBGA (80) - 5 mm × 5 mm
• VQFN (64) - 9 mm × 9 mm

1

• Core
• -ARM ® 32-Bit Cortex ® -M4F CPU With FloatingPoint Unit and Memory Protection Unit
• -Frequency up to 48 MHz
• -ULPBench™ Benchmark:
• 192.3 ULPMark™-CP
• -Performance Benchmark:
• 3.41 CoreMark/MHz
• 1.22 DMIPS/MHz (Dhrystone 2.1)
• Memories
• -Up to 256KB of Flash Main Memory (Organized Into Two Banks Enabling Simultaneous Read/Execute During Erase)
• -16KB of Flash Information Memory (Used for BSL, TLV, and Flash Mailbox)
• -Up to 64KB of SRAM (Including 6KB of Backup Memory)
• -32KB of ROM With MSP432™ Peripheral Driver Libraries
• Operating Characteristics
• -Wide Supply Voltage Range: 1.62 V to 3.7 V
• -Temperature Range (Ambient): -40°C to 85°C
• Ultra-Low-Power Operating Modes
• -Active: 80 μA/MHz
• -Low-Frequency Active: 83 μA at 128 kHz (Typical)
• -LPM3 (With RTC): 660 nA (Typical)
• -LPM3.5 (With RTC): 630 nA (Typical)
• -LPM4: 500 nA (Typical)
• -LPM4.5: 25 nA (Typical)
• Flexible Clocking Features
• -Tunable Internal DCO (up to 48 MHz)
• -32.768 kHz Low-Frequency Crystal Support (LFXT)
• -High-Frequency Crystal Support (HFXT) up to 48 MHz
• -Low-Frequency Internal Reference Oscillator (REFO)
• -Very Low-Power Low-Frequency Internal Oscillator (VLO)
• -Module Oscillator (MODOSC)
• -System Oscillator (SYSOSC)
• Code Security Features
• -JTAG and SWD Lock
• -IP Protection (up to Four Secure Flash Zones, Each With Configurable Start Address and Size)

1

• Enhanced System Features
• -Programmable Supervision and Monitoring of Supply Voltage
• -Multiple-Class Resets for Better Control of Application and Debug
• -8-Channel DMA
• -RTC With Calendar and Alarm Functions
• Timing and Control
• -Up to Four 16-Bit Timers, Each With up to Five Capture, Compare, PWM Capability
• -Two 32-Bit Timers, Each With Interrupt Generation Capability
• Serial Communication
• -Up to Four eUSCI_A Modules
• UART With Automatic Baud-Rate Detection
• IrDA Encode and Decode
• SPI (up to 16 Mbps)
• -Up to Four eUSCI_B Modules
• I 2 C (With Multiple-Slave Addressing)
• SPI (up to 16 Mbps)
• Flexible I/O Features
• -Ultra-Low-Leakage I/Os (±20 nA Maximum)
• -All I/Os With Capacitive-Touch Capability
• -Up to 48 I/Os With Interrupt and Wake-up Capability
• -Up to 24 I/Os With Port Mapping Capability
• -Eight I/Os With Glitch Filtering Capability
• Advanced Low-Power Analog Features
• -14-Bit 1-MSPS SAR ADC With Differential and Single-Ended Inputs
• -Internal Voltage Reference With 10-ppm/°C Typical Stability
• -Two Analog Comparators
• Encryption and Data Integrity Accelerators
• -128-, 192-, or 256-Bit AES Encryption and Decryption Accelerator
• -32-Bit Hardware CRC Engine
• JTAG and Debug Support
• -Support for 4-Pin JTAG and 2-Pin SWD Debug Interfaces
• -Support for Serial Wire Trace
• -Support for Power Debug and Profiling of Applications

• Industrial and Automation
• -Home Automation
• -Smoke Detectors
• -Barcode Scanners
• -Access Panels
• Metering
• -Electric Meters
• -Flow Meters
• -Communication Modules

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

• (2) Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device.
• (3) All voltages referenced to V SS .

(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

Typical data are based on VCC = 3.0 V, TA = 25°C (unless otherwise noted)

• (2) Supply voltage must not change faster than 1 V/ms. Faster changes can cause the VCCDET to trigger a reset even within the recommended supply voltage range.
• (3) Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.
• (4) Does not include I/O currents (driven by application requirements).
• (5) Operating frequency may require the flash to be accessed with wait states. See Section 5.8 for further details.