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MSP430F5527

Mixed-Signal Microcontroller

The MSP430F5527 is a mixed-signal microcontroller from Texas Instruments. View the full MSP430F5527 datasheet below including key specifications, absolute maximum ratings.

Manufacturer

Texas Instruments

Category

Mixed-Signal Microcontroller

Key Specifications

ParameterValue
ConnectivityI2C, IrDA, LINbus, SCI, SPI, UART/USART, USB
Core ProcessorMSP430 CPUXV2
Core Size16-Bit
Data ConvertersA/D 16x12b
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
DigiKey ProgrammableNot Verified
Mounting TypeSurface Mount
Number of I/O63
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Oscillator TypeInternal
Oscillator TypeInternal
Oscillator TypeInternal
Package / Case80-LQFP
PackagingTray
PackagingTray
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
Flash Memory Size128KB (128K x 8)
Program Memory TypeFLASH
RAM Size10K x 8 B
Clock Speed25MHz
Standard Pack Qty119
Standard Pack Qty119
Supplier Device Package80-LQFP (12x12)
Supplier Device Package80-LQFP (12x12)
Supplier Device Package80-LQFP (12x12)
Supplier Device Package80-LQFP (12x12)
Supply Voltage1.8V ~ 3.6V

Overview

Part: MSP430F5529 — Texas Instruments

Type: Mixed-Signal Microcontroller (MCU)

Description: An ultra-low-power 16-bit RISC microcontroller with a 1.8–3.6 V supply range, up to 25 MHz system clock, integrated USB 2.0, a 12-bit ADC, and multiple communication interfaces, optimized for extended battery life in portable measurement applications.

Operating Conditions:

  • Supply voltage: 1.8–3.6 V
  • System clock: up to 25 MHz

Absolute Maximum Ratings:

Key Specs:

  • Active mode current (Flash execution): 290 μA/MHz at 8 MHz, 3.0 V (typical)
  • Active mode current (RAM execution): 150 μA/MHz at 8 MHz, 3.0 V (typical)
  • Standby mode (LPM3) current: 1.9 μA at 2.2 V (typical), 2.1 μA at 3.0 V (typical)
  • Off mode (LPM4) current: 1.1 μA at 3.0 V (typical)
  • Shutdown mode (LPM4.5) current: 0.18 μA at 3.0 V (typical)
  • Wake up from standby mode: 3.5 μs (typical)
  • ADC resolution: 12-bit
  • USB support: Full-speed USB 2.0 with integrated PHY

Features:

  • Ultra-low power consumption with multiple low-power modes
  • 16-bit RISC architecture with extended memory
  • Flexible power-management system with integrated LDO
  • Unified clock system with FLL, VLO, REFO, XT1, and XT2 support
  • Four 16-bit timers (TA0, TA1, TA2, TB0)
  • Two Universal Serial Communication Interfaces (USCI_A0, USCI_A1, USCI_B0, USCI_B1) supporting UART, IrDA, SPI, and I2C
  • Integrated USB-PHY, USB power system, and USB-PLL with eight input/output endpoints
  • 12-bit Analog-to-Digital Converter (ADC) with internal reference
  • Comparator
  • Hardware multiplier supporting 32-bit operations
  • 3-channel internal DMA
  • Basic timer with RTC feature
  • Serial onboard programming

Applications:

  • Analog and digital sensor systems
  • Data loggers
  • Connection to USB hosts

Package:

  • LQFP (80) - 12 mm × 12 mm

Features

  • Low supply voltage range: 3.6 V down to 1.8 V
  • Ultra-low power consumption
  • -Active mode (AM):
  • All system clocks active:
  • -290 μA/MHz at 8 MHz, 3.0 V, flash program execution (typical)
  • -150 μA/MHz at 8 MHz, 3.0 V, RAM program execution (typical)
  • -Standby mode (LPM3):
  • Real-time clock (RTC) with crystal, watchdog, and supply supervisor operational, full RAM retention, fast wakeup:
  • -1.9 μA at 2.2 V, 2.1 μA at 3.0 V (typical)
  • Low-power oscillator (VLO), generalpurpose counter, watchdog, and supply supervisor operational, full RAM retention, fast wakeup:
  • -1.4 μA at 3.0 V (typical)
  • -Off mode (LPM4):
  • Full RAM retention, supply supervisor operational, fast wakeup:
  • -1.1 μA at 3.0 V (typical)
  • -Shutdown mode (LPM4.5):
  • 0.18 μA at 3.0 V (typical)
  • Wake up from standby mode in 3.5 μs (typical)
  • 16-bit RISC architecture, extended memory, up to 25-MHz system clock
  • Flexible power-management system
  • -Fully integrated LDO with programmable regulated core supply voltage
  • -Supply voltage supervision, monitoring, and brownout
  • Unified clock system
  • -FLL control loop for frequency stabilization
  • -Low-power low-frequency internal clock source (VLO)
  • -Low-frequency trimmed internal reference source (REFO)
  • -32-kHz watch crystals (XT1)
  • -High-frequency crystals up to 32 MHz (XT2)
  • 16-bit timer TA0, Timer_A with five capture/ compare registers
  • 16-bit timer TA1, Timer_A with three capture/ compare registers
  • 16-bit timer TA2, Timer_A with three capture/ compare registers
  • 16-bit timer TB0, Timer_B with seven capture/ compare shadow registers
  • Two universal serial communication interfaces (USCIs)
  • -USCI_A0 and USCI_A1 each support:
  • Enhanced UART supports automatic baudrate detection
  • IrDA encoder and decoder
  • Synchronous SPI
  • -USCI_B0 and USCI_B1 each support:
  • I 2 C
  • Synchronous SPI
  • Full-speed universal serial bus (USB)
  • -Integrated USB-PHY
  • -Integrated 3.3-V and 1.8-V USB power system
  • -Integrated USB-PLL
  • -Eight input and eight output endpoints
  • 12-bit analog-to-digital converter (ADC) (MSP430F552x only) with internal reference, sample-and-hold, and autoscan features
  • Comparator
  • Hardware multiplier supports 32-bit operations
  • Serial onboard programming, no external programming voltage needed
  • 3-channel internal DMA
  • Basic timer with RTC feature
  • Development tools and software (also see Tools and Software)
  • -LaunchPad ™ development kit (MSP -EXP430F5529LP)
  • -MSP430F5529 experimenter's board (MSP -EXP430F5529)
  • -80-pin target development board (MSP -TS430PN80USB)
  • -64-pin target development board (MSP -TS430RGC64USB)
  • -USB developers package (MSP430USBDEVPACK)
  • -MSP430Ware ™ code examples
  • Device Comparison summarizes the available family members

Applications

  • Analog and digital sensor systems
  • Data loggers
  • Connection to USB hosts

MSP430F5528

Product Folder Links:

MSP430F5529

MSP430F5524

MSP430F5522

MSP430F5521

MSP430F5527

MSP430F5526

MSP430F5519

MSP430F5517

MSP430F5513

MSP430F5525

MSP430F5515

MSP430F5514

1

Pin Configuration

PIN NAME (P1.x)xCONTROL BITS OR SIGNALSCONTROL BITS OR SIGNALS
PIN NAME (P1.x)xP1DIR.xP1SEL.x
P1.0 (I/O)I: 0; O: 10
P1.0/TA0CLK/ACLK0TA0CLK01
ACLK11
P1.1 (I/O)I: 0; O: 10
P1.1/TA0.01TA0.CCI0A01
TA0.011
P1.2 (I/O)I: 0; O: 10
P1.2/TA0.12TA0.CCI1A01
TA0.111
P1.3 (I/O)I: 0; O: 10
P1.3/TA0.23TA0.CCI2A01
TA0.211
P1.4 (I/O)I: 0; O: 10
P1.4/TA0.34TA0.CCI3A01
TA0.311
P1.5 (I/O)I: 0; O: 10
P1.5/TA0.45TA0.CCI4A01
TA0.411
P1.6 (I/O)I: 0; O: 10
P1.6/TA1CLK/CBOUT6TA1CLK01
CBOUT comparator B11
P1.7 (I/O)I: 0; O: 10
P1.7/TA1.07
TA1.CCI0A01
TA1.011

www.ti.com

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MINMAXUNIT
Voltage applied at V CC to V SS-0.34.1V
Voltage applied to any pin (excluding VCORE, VBUS, V18) (2)-0.3V CC + 0.3V
Diode current at any device pin±2mA
Maximum operating junction temperature, T J95°C
Storage temperature, T stg (3)-55150°C

Recommended Operating Conditions

MINNOMMAXUNIT
V CCPMMCOREVx = 01.83.6V
V CCSupply voltage during program execution and flashPMMCOREVx = 0, 123.6V
V CCprogramming (AV CC = DV CC1 = DV CC2 = DV CC ) (1) (2)PMMCOREVx = 0, 1, 22.23.6V
V CCPMMCOREVx = 0, 1, 2, 32.43.6V
V CC, USBSupply voltage during USB operation, USB PLL disabled, USB_EN = 1, UPLLEN = 0PMMCOREVx = 01.83.6V
V CC, USBSupply voltage during USB operation, USB PLL disabled, USB_EN = 1, UPLLEN = 0PMMCOREVx = 0, 123.6V
V CC, USBSupply voltage during USB operation, USB PLL disabled, USB_EN = 1, UPLLEN = 0PMMCOREVx = 0, 1, 22.23.6V
V CC, USBSupply voltage during USB operation, USB PLL disabled, USB_EN = 1, UPLLEN = 0PMMCOREVx = 0, 1, 2, 32.43.6V
V CC, USBSupply voltage during USB operation, USB PLL enabled (3) , USB_EN = 1, UPLLEN = 1PMMCOREVx = 22.23.6V
V CC, USBSupply voltage during USB operation, USB PLL enabled (3) , USB_EN = 1, UPLLEN = 1PMMCOREVx = 2, 32.43.6V
V SSSupply voltage (AV SS = DV SS1 = DV SS2 = DV SS )0V
T AOperating free-air temperatureI version-4085°C
T JOperating junction temperatureI version-4085°C
C VCORERecommended capacitor at VCORE (4)470nF
C DVCC / C VCORECapacitor ratio of DVCC to VCORE10ratio
f SYSTEMProcessor frequency (maximum MCLK frequency) (5) (see Figure 8-1)PMMCOREVx = 0, 1.8 V ≤ V CC ≤ 3.6 V (default condition)08MHz
f SYSTEMProcessor frequency (maximum MCLK frequency) (5) (see Figure 8-1)PMMCOREVx = 1, 2.0 V ≤ V CC ≤ 3.6 V012MHz
f SYSTEMProcessor frequency (maximum MCLK frequency) (5) (see Figure 8-1)PMMCOREVx = 2, 2.2 V ≤ V CC ≤ 3.6 V020MHz
f SYSTEMPMMCOREVx = 3, 2.4 V ≤ V CC ≤ 3.6 V025MHz
f SYSTEM_USBMinimum processor frequency for USB operation1.5MHz
USB_waitWait state cycles during USB operation161616cycles

NOTE: The numbers within the fields denote the supported PMMCOREVx settings.

Figure 8-1. Maximum System Frequency

Thermal Information

THERMAL METRIC (1)THERMAL METRIC (1)THERMAL METRIC (1)VALUEUNIT
LQFP (PN)70°C/W
VQFN (RGC)55°C/W
BGA (ZQE)84°C/W
LQFP (PN)45°C/W
VQFN (RGC)25°C/W
BGA (ZQE)46°C/W
Rθ JC Junction-to-case thermalLQFP (PN)12°C/W
Rθ JC Junction-to-case thermalVQFN (RGC)12°C/W
Rθ JC Junction-to-case thermalBGA (ZQE)30°C/W
Rθ Junction-to-boardLQFP (PN)22°C/W
JBVQFN (RGC)6°C/W
BGA (ZQE)20°C/W

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MSP430F5513Texas Instruments
MSP430F5514Texas Instruments
MSP430F5515Texas Instruments
MSP430F5517Texas Instruments
MSP430F5519Texas Instruments
MSP430F5521Texas Instruments
MSP430F5522Texas Instruments
MSP430F5524Texas Instruments
MSP430F5525Texas Instruments
MSP430F5526Texas Instruments
MSP430F5528Texas Instruments
MSP430F5529Texas Instruments
MSP430F5529IPNTexas Instruments80-LQFP
MSP430F5529IPNRTexas Instruments80-LQFP
MSP430F5529IRGCT
MSP430F55XXTexas Instruments
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