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MR4A16BYS35

Magnetoresistive Random Access Memory (MRAM)

The MR4A16BYS35 is a magnetoresistive random access memory (mram) from Everspin Technologies. View the full MR4A16BYS35 datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Everspin Technologies

Category

Magnetoresistive Random Access Memory (MRAM)

Package

54-TSOP2

Overview

Part: MR4A16B — Everspin Technologies

Type: Magnetoresistive Random Access Memory (MRAM)

Description: 16,777,216-bit (1M x 16) MRAM device offering SRAM compatible 35 ns read/write timing with unlimited endurance and data non-volatility for over 20 years, featuring internal single bit error correction code.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V
  • Operating temperature: 0 to +70 °C (suffix-dependent — see Table 4.1 for grade-specific ranges)
  • Write inhibit voltage: 2.5–3.0 V

Absolute Maximum Ratings:

  • Max supply voltage: 4.0 V
  • Max output current per pin: ±20 mA
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Read cycle time: 35 ns
  • Write cycle time: 35 ns
  • Address access time: 35 ns
  • AC active supply current - read modes (I OUT = 0 mA, V DD = max): 68 mA
  • AC active supply current - write modes (V DD = max): 180 mA
  • CMOS standby current (E ≥ V DD - 0.2V and V In ≤ V SS + 0.2V or ≥ V DD - 0.2 V): 9 mA
  • Data non-volatility: >20 years at temperature
  • Input leakage current: ±1 μA
  • Output leakage current: ±1 μA

Features:

  • +3.3 Volt power supply
  • SRAM compatible timing
  • Unlimited read & write endurance
  • Data always non-volatile for >20-years at temperature
  • RoHS-compliant small footprint BGA and TSOP2 package
  • AEC-Q100 Grade 1 option in TSOP2 package
  • Internal single bit error correction code with 7 ECC parity bits for every 64 data bits
  • Low-voltage inhibit circuitry for power loss protection

Applications:

  • Systems requiring permanent storage and quick retrieval of critical data and programs

Package:

  • 48-pin Ball Grid Array (BGA)
  • 54-pin Thin Small Outline Package (TSOP2)

Features

  • +3.3 Volt power supply
  • Fast 35 ns read/write cycle
  • SRAM compatible timing
  • Unlimited read & write endurance
  • Data always non-volatile for >20-years at temperature
  • RoHS-compliant small footprint BGA and TSOP2 package
  • AEC-Q100 Grade 1 option in TSOP2 package.

Pin Configuration

Figure 1.1 Block Diagram

Table 1.1 Pin Functions

SignalNameFunction
AAddress Input
EChip Enable
WWrite Enable
GOutput Enable
UBUpper Byte Enable
LBLower Byte Enable
DQData I/O
V DDPower Supply
V SSGround
DCDo Not Connect
NCNo Connection

Figure 1.2 Pin Diagrams for Available Packages (Top View)

Table 1.1 Pin Functions

Table 1.2 Operating Modes

E 1G 1W 1LB 1UB 1ModeV DD CurrentDQL[7:0] 2DQU[15:8] 2
HXXXXNot selectedI SB1 , I SB2Hi-ZHi-Z
LHHXXOutput disabledI DDRHi-ZHi-Z
LXXHHOutput disabledI DDRHi-ZHi-Z
LLHLHLower Byte ReadI DDRD OutHi-Z
LLHHLUpper Byte ReadI DDRHi-ZD Out
LLHLLWord ReadI DDRD OutD Out
LXLLHLower Byte WriteI DDWD inHi-Z
LXLHLUpper Byte WriteI DDWHi-ZD in
LXLLLWordWriteI DDWD inD in

Electrical Characteristics

ParameterSymbolMinTypicalMaxUnit
Input leakage currentI lkg(I)--±1μA
Output leakage currentI lkg(O)--±1μA
Output low voltage (I OL = +4 mA) (I OL = +100 μA)V OL--0.4 V SS + 0.2V
Output high voltage (I OH = -4 mA) (I OH = -100 μA)V OH2.4 V DD - 0.2--V

Table 2.4 Power Supply Characteristics

ParameterSymbolTypicalMaxUnit
AC active supply current - read modes 1 (I OUT = 0 mA,V DD = max)I DDR6068mA
AC active supply current - write modes 1 (V DD = max) MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BV (AEC-Q100 Grade 1)I DDW152 152 152180 180 180mA
AC standby current (V DD = max, E =V IH ) no other restrictions on other inputsI SB1914mA
CMOS standby current (E ≥ V DD - 0.2V andV In ≤V SS + 0.2V or≥V DD - 0.2 V) (V DD = max, f = 0 MHz)I SB259mA

1 All active current measurements are measured with one address transition per cycle and at minimum cycle time.

Absolute Maximum Ratings

This device contains circuitry to protect the inputs against damage caused by high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits.

The device also contains protection against external magnetic fields. Precautions should be taken to avoid application of any magnetic field greater than the maximum field intensity specified in the maximum ratings.

Table 2.1 Absolute Maximum Ratings 1

ParameterSymbolValueUnit
Supply voltage 2V DD-0.5 to 4.0V
Voltage on an pin 2V IN-0.5 toV DD + 0.5V
Output current per pinI OUT±20mA
Package power dissipationP D0.600W
Temperature under bias MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BM (AEC-Q100 Grade 1)T BIAS-10 to 85 -45 to 95 -45 to 130°C
Storage TemperatureT stg-55 to 150°C
Lead temperature during solder (3 minute max)T Lead260°C
Maximum magnetic field during write MR4A16B (All Temperatures)H max_write8000A/m
Maximum magnetic field during read or standbyH max_read8000A/m

Table 2.2 Operating Conditions

ParameterSymbolMinTypicalMaxUnit
Power supply voltageV DD3.0 i3.33.6V
Write inhibit voltageV WI2.52.73.0 iV
Input high voltageV IH2.2-V DD + 0.3 iiV
Input low voltageV IL-0.5 iii-0.8V
Temperature under bias MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BM (AEC-Q100 Grade 1) ivT A0 -40 -4070 85 125°C

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
MR4A16BEverspin Technologies
MR4A16BCMA35Everspin Technologies48-BGA
MR4A16BCMA35REverspin Technologies48-BGA
MR4A16BCYS35Everspin Technologies54-TSOP2
MR4A16BCYS35REverspin Technologies54-TSOP2
MR4A16BMA35Everspin Technologies48-BGA
MR4A16BMA35REverspin Technologies48-BGA
MR4A16BMYS35Everspin Technologies54-TSOP2
MR4A16BMYS35REverspin Technologies54-TSOP2
MR4A16BYS35REverspin Technologies54-TSOP2
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