MR4A16BMA35
Magnetoresistive Random Access Memory (MRAM)The MR4A16BMA35 is a magnetoresistive random access memory (mram) from Everspin Technologies. View the full MR4A16BMA35 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Everspin Technologies
Category
Magnetoresistive Random Access Memory (MRAM)
Package
48-BGA
Overview
Part: MR4A16B — Everspin Technologies
Type: Magnetoresistive Random Access Memory (MRAM)
Description: 16,777,216-bit (1M x 16) MRAM device offering SRAM compatible 35 ns read/write timing with unlimited endurance and data non-volatility for over 20 years, featuring internal single bit error correction code.
Operating Conditions:
- Supply voltage: 3.0–3.6 V
- Operating temperature: 0 to +70 °C (suffix-dependent — see Table 4.1 for grade-specific ranges)
- Write inhibit voltage: 2.5–3.0 V
Absolute Maximum Ratings:
- Max supply voltage: 4.0 V
- Max output current per pin: ±20 mA
- Max junction/storage temperature: 150 °C
Key Specs:
- Read cycle time: 35 ns
- Write cycle time: 35 ns
- Address access time: 35 ns
- AC active supply current - read modes (I OUT = 0 mA, V DD = max): 68 mA
- AC active supply current - write modes (V DD = max): 180 mA
- CMOS standby current (E ≥ V DD - 0.2V and V In ≤ V SS + 0.2V or ≥ V DD - 0.2 V): 9 mA
- Data non-volatility: >20 years at temperature
- Input leakage current: ±1 μA
- Output leakage current: ±1 μA
Features:
- +3.3 Volt power supply
- SRAM compatible timing
- Unlimited read & write endurance
- Data always non-volatile for >20-years at temperature
- RoHS-compliant small footprint BGA and TSOP2 package
- AEC-Q100 Grade 1 option in TSOP2 package
- Internal single bit error correction code with 7 ECC parity bits for every 64 data bits
- Low-voltage inhibit circuitry for power loss protection
Applications:
- Systems requiring permanent storage and quick retrieval of critical data and programs
Package:
- 48-pin Ball Grid Array (BGA)
- 54-pin Thin Small Outline Package (TSOP2)
Features
- +3.3 Volt power supply
- Fast 35 ns read/write cycle
- SRAM compatible timing
- Unlimited read & write endurance
- Data always non-volatile for >20-years at temperature
- RoHS-compliant small footprint BGA and TSOP2 package
- AEC-Q100 Grade 1 option in TSOP2 package.
Pin Configuration
Figure 1.1 Block Diagram
Table 1.1 Pin Functions
| SignalName | Function |
|---|---|
| A | Address Input |
| E | Chip Enable |
| W | Write Enable |
| G | Output Enable |
| UB | Upper Byte Enable |
| LB | Lower Byte Enable |
| DQ | Data I/O |
| V DD | Power Supply |
| V SS | Ground |
| DC | Do Not Connect |
| NC | No Connection |
Figure 1.2 Pin Diagrams for Available Packages (Top View)
Table 1.1 Pin Functions
Table 1.2 Operating Modes
| E 1 | G 1 | W 1 | LB 1 | UB 1 | Mode | V DD Current | DQL[7:0] 2 | DQU[15:8] 2 |
|---|---|---|---|---|---|---|---|---|
| H | X | X | X | X | Not selected | I SB1 , I SB2 | Hi-Z | Hi-Z |
| L | H | H | X | X | Output disabled | I DDR | Hi-Z | Hi-Z |
| L | X | X | H | H | Output disabled | I DDR | Hi-Z | Hi-Z |
| L | L | H | L | H | Lower Byte Read | I DDR | D Out | Hi-Z |
| L | L | H | H | L | Upper Byte Read | I DDR | Hi-Z | D Out |
| L | L | H | L | L | Word Read | I DDR | D Out | D Out |
| L | X | L | L | H | Lower Byte Write | I DDW | D in | Hi-Z |
| L | X | L | H | L | Upper Byte Write | I DDW | Hi-Z | D in |
| L | X | L | L | L | WordWrite | I DDW | D in | D in |
Electrical Characteristics
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Input leakage current | I lkg(I) | - | - | ±1 | μA |
| Output leakage current | I lkg(O) | - | - | ±1 | μA |
| Output low voltage (I OL = +4 mA) (I OL = +100 μA) | V OL | - | - | 0.4 V SS + 0.2 | V |
| Output high voltage (I OH = -4 mA) (I OH = -100 μA) | V OH | 2.4 V DD - 0.2 | - | - | V |
Table 2.4 Power Supply Characteristics
| Parameter | Symbol | Typical | Max | Unit |
|---|---|---|---|---|
| AC active supply current - read modes 1 (I OUT = 0 mA,V DD = max) | I DDR | 60 | 68 | mA |
| AC active supply current - write modes 1 (V DD = max) MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BV (AEC-Q100 Grade 1) | I DDW | 152 152 152 | 180 180 180 | mA |
| AC standby current (V DD = max, E =V IH ) no other restrictions on other inputs | I SB1 | 9 | 14 | mA |
| CMOS standby current (E ≥ V DD - 0.2V andV In ≤V SS + 0.2V or≥V DD - 0.2 V) (V DD = max, f = 0 MHz) | I SB2 | 5 | 9 | mA |
1 All active current measurements are measured with one address transition per cycle and at minimum cycle time.
Absolute Maximum Ratings
This device contains circuitry to protect the inputs against damage caused by high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits.
The device also contains protection against external magnetic fields. Precautions should be taken to avoid application of any magnetic field greater than the maximum field intensity specified in the maximum ratings.
Table 2.1 Absolute Maximum Ratings 1
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Supply voltage 2 | V DD | -0.5 to 4.0 | V |
| Voltage on an pin 2 | V IN | -0.5 toV DD + 0.5 | V |
| Output current per pin | I OUT | ±20 | mA |
| Package power dissipation | P D | 0.600 | W |
| Temperature under bias MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BM (AEC-Q100 Grade 1) | T BIAS | -10 to 85 -45 to 95 -45 to 130 | °C |
| Storage Temperature | T stg | -55 to 150 | °C |
| Lead temperature during solder (3 minute max) | T Lead | 260 | °C |
| Maximum magnetic field during write MR4A16B (All Temperatures) | H max_write | 8000 | A/m |
| Maximum magnetic field during read or standby | H max_read | 8000 | A/m |
Table 2.2 Operating Conditions
| Parameter | Symbol | Min | Typical | Max | Unit |
|---|---|---|---|---|---|
| Power supply voltage | V DD | 3.0 i | 3.3 | 3.6 | V |
| Write inhibit voltage | V WI | 2.5 | 2.7 | 3.0 i | V |
| Input high voltage | V IH | 2.2 | - | V DD + 0.3 ii | V |
| Input low voltage | V IL | -0.5 iii | - | 0.8 | V |
| Temperature under bias MR4A16B (Commercial) MR4A16BC (Industrial) MR4A16BM (AEC-Q100 Grade 1) iv | T A | 0 -40 -40 | 70 85 125 | °C |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| MR4A16B | Everspin Technologies | — |
| MR4A16BCMA35 | Everspin Technologies | 48-BGA |
| MR4A16BCMA35R | Everspin Technologies | 48-BGA |
| MR4A16BCYS35 | Everspin Technologies | 54-TSOP2 |
| MR4A16BCYS35R | Everspin Technologies | 54-TSOP2 |
| MR4A16BMA35R | Everspin Technologies | 48-BGA |
| MR4A16BMYS35 | Everspin Technologies | 54-TSOP2 |
| MR4A16BMYS35R | Everspin Technologies | 54-TSOP2 |
| MR4A16BYS35 | Everspin Technologies | 54-TSOP2 |
| MR4A16BYS35R | Everspin Technologies | 54-TSOP2 |
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