MPXV7002GC6T1

Part: NXP MPXV7002 Series

Type: Integrated Silicon Pressure Sensor

Key Specs:

• Pressure Range: -2 to +2 kPa (-0.3 to +0.3 psi)
• Output Voltage: 0.5 to 4.5 V
• Supply Voltage: 4.75 to 5.25 Vdc
• Accuracy (Typ): ±2.5%VFSS (with Auto Zero)
• Operating Temperature: 10 to 60 °C

Features:

• 2.5% Typical Error over +10°C to +60°C with Auto Zero
• 6.25% Maximum Error over +10°C to +60°C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10° to +60°C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations

Applications:

• Microcontroller or Microprocessor-Based Systems

Package:

• Thermoplastic (PPS) Surface Mount Package
• Small Outline Package
• Basic Chip Carrier (Case 482)

• 2.5% Typical Error over +10°C to +60°C with Auto Zero
• 6.25% Maximum Error over +10°C to +60°C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10° to +60°C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations

-2 to +2 kPa (-0.3 to +0.3 psi) 0.5 to 4.5 V Output

• Device Name
• Small Outline Package (MPXV7002 Series)
• MPXV7002GC6U
• MPXV7002GC6T1
• MPXV7002GP
• MPXV7002DP
• MPXV7002DPT1

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.

Figure 5. Small Outline Package Footprint

Table 2. Maximum Ratings(1)

1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Integrated Pressure Sensor Schematic

3 On-Chip Temperature Compensation, Calibration and Signal Conditioning

The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip.

Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm.

The MPXV7002 series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.

Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.

Figure 4 shows the sensor output signal relative to pressure input. Typical, minimum, and maximum output curves are shown for operation over a temperature range of 10° to 60°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range.

Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.)

Figure 4. Output versus Pressure Differential