MPXV7002DP

Part: MPXV7002 — NXP B.V.

Type: Integrated Silicon Pressure Sensor

Description: Piezoresistive transducer with a -2 to +2 kPa pressure range and 0.5 to 4.5 V analog output, featuring on-chip signal conditioning, temperature compensation, and calibration.

Operating Conditions:

• Supply voltage: 4.75–5.25 Vdc (at T_A = 25°C)
• Operating temperature: 10 to 60 °C
• Pressure range: -2.0 to 2.0 kPa

Absolute Maximum Ratings:

• Max pressure: 75 kPa (P1 > P2)
• Max storage temperature: -30 to +100 °C
• Max operating temperature: 10 to 60 °C

Key Specs:

• Supply current: Max 10 mAdc
• Pressure offset: 0.25 to 0.75 Vdc (at V_S = 5.0 Volts, 10 to 60 °C)
• Full scale output: 4.25 to 4.75 Vdc (at V_S = 5.0 Volts, 10 to 60 °C)
• Full scale span: 3.5 to 4.5 Vdc (at V_S = 5.0 Volts, 10 to 60 °C)
• Accuracy: Typ ±2.5 %V_FSS, Max ±6.25 %V_FSS (at 10 to 60 °C)
• Sensitivity: Typ 1.0 V/kPa
• Response time: Typ 1.0 ms
• Warm-up time: Typ 20 ms

Features:

• 2.5% Typical Error over +10 °C to +60 °C with Auto Zero
• 6.25% Maximum Error over +10 °C to +60 °C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10 ° to +60 °C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations

Package:

• Small Outline Package (Case 482A)
• Small Outline Package (Case 1369)
• Small Outline Package (Case 1351)

• 2.5% Typical Error over +10 ° C to +60 ° C with Auto Zero
• 6.25% Maximum Error over +10 ° C to +60 ° C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10 ° to +60 ° C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations

Rev 4, 03/2017

Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads.

Figure 5. Small Outline Package Footprint

Table 2. Maximum Ratings (1)

• 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Integrated Pressure Sensor Schematic

CASE 482A-01 ISSUE A

CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE

K

DATE 05/13/98

CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE