Part: MCP2551 High-Speed CAN Transceiver (Microchip)

Type: High-Speed CAN Transceiver

Description: The MCP2551 is a fault-tolerant high-speed CAN transceiver that provides differential transmit and receive capability for CAN protocol controllers, supporting up to 1 Mb/s operation and compatible with ISO-11898 standard physical layer requirements.

Operating Conditions:

• Supply voltage: 4.5–5.5 V
• Operating temperature: -40 to +125 °C
• Max data rate: 1 Mb/s
• Max nodes: 112

Absolute Maximum Ratings:

• Max supply voltage: 7.0 V
• Max DC voltage at CANH, CANL: -42 V to +42 V
• Max junction temperature: +150 °C

Key Specs:

• Dominant differential input voltage: 0.9–5.0 V
• Differential input hysteresis: 100–200 mV
• CANH, CANL Common-mode input resistance: 5–50 kΩ
• Differential input resistance: 20–100 kΩ
• TXD High-level input voltage: 2.0 V (min)
• RXD Low-level output voltage: 0.8 V (max)
• Shutdown junction temperature: 155–180 °C
• ESD protection on CANH and CANL pins: 6 kV

Features:

• Supports 1 Mb/s operation
• Implements ISO-11898 standard physical layer requirements
• Externally-controlled slope for reduced RFI emissions
• Power-on Reset and voltage brown-out protection
• Automatic thermal shutdown protection
• Up to 112 nodes can be connected

Applications:

Package:

• 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

• Supports 1 Mb/s operation
• Implements ISO-11898 standard physical layer requirements
• · Suitable for 12V and 24V systems
• Externally-controlled slope for reduced RFI emissions
• Detection of ground fault (permanent Dominant) on TXD input
• Power-on Reset and voltage brown-out protection
• An unpowered node or brown-out event will not disturb the CAN bus
• · Low current standby operation
• Protection against damage due to short-circuit conditions (positive or negative battery voltage)
• · Protection against high-voltage transients
• Automatic thermal shutdown protection
• Up to 112 nodes can be connected
• High-noise immunity due to differential bus implementation
• Temperature ranges:
  • Industrial (I): -40°C to +85°C
  • Extended (E): -40°C to +125°C

MCP2551 PDIP-8 Pinout

Notes

• TXD has an internal pull-up resistor (nominal 25 kΩ to VDD)
• When TXD is Low, CANH and CANL are in Dominant state; when High, they are in Recessive state (unless another CAN node drives Dominant)
• Pin numbers extracted directly from Table 1-3 in the datasheet

2.1 Terms and Definitions

A number of terms are defined in ISO-11898 that are used to describe the electrical characteristics of a CAN transceiver device. These terms and definitions are summarized in this section.

2.1.1 BUS VOLTAGE

VCANL and VCANH denote the voltages of the bus line wires CANL and CANH relative to ground of each individual CAN node.

2.1.2 COMMON MODE BUS VOLTAGE RANGE

Boundary voltage levels of VCANL and VCANH with respect to ground, for which proper operation will occur, if up to the maximum number of CAN nodes are connected to the bus.

2.1.3 DIFFERENTIAL INTERNAL CAPACITANCE, CDIFF (OF A CAN NODE)

Capacitance seen between CANL and CANH during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.4 DIFFERENTIAL INTERNAL RESISTANCE, RDIFF (OF A CAN NODE)

Resistance seen between CANL and CANH during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.5 DIFFERENTIAL VOLTAGE, VDIFF (OF CAN BUS)

Differential voltage of the two-wire CAN bus, value VDIFF = VCANH - VCANL.

2.1.6 INTERNAL CAPACITANCE, CIN (OF A CAN NODE)

Capacitance seen between CANL (or CANH) and ground during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

2.1.7 INTERNAL RESISTANCE, RIN (OF A CAN NODE)

Resistance seen between CANL (or CANH) and ground during the Recessive state when the CAN node is disconnected from the bus (see Figure 2-1).

FIGURE 2-1: PHYSICAL LAYER DEFINITIONS

Absolute Maximum Ratings†

• DC Voltage at TXD, RXD, VREF and VS0.3V to VDD + 0.3V

• DC Voltage at CANH, CANL (Note 1)42V to +42V

• Transient Voltage on Pins 6 and 7 (Note 2)250V to +250V

• Storage temperature55°C to +150°C

• Operating ambient temperature40°C to +125°C

• Virtual Junction Temperature, TVJ (Note 3)40°C to +150°C

• Soldering temperature of leads (10 seconds)+300°C

• ESD protection on CANH and CANL pins (Note 4)6 kV

• ESD protection on all other pins (Note 4)4 kV

• Note 1: Short-circuit applied when TXD is High and Low.

  • 2: In accordance with ISO-7637.
  • 3: In accordance with IEC 60747-1.
  • 4: Classification A: Human Body Model.

† NOTICE: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

2.2 DC Characteristics

^2: ITXD = IRXD = IVREF = 0 mA; 0V < VCANL < VDD; 0V < VCANH < VDD; VRS = VDD

^3: This is valid for the receiver in all modes; High-speed, Slope-control and Standby.

• DC Voltage at TXD, RXD, VREF and VS0.3V to VDD + 0.3V

• DC Voltage at CANH, CANL (Note 1)42V to +42V

• Transient Voltage on Pins 6 and 7 (Note 2)250V to +250V

• Storage temperature55°C to +150°C

• Operating ambient temperature40°C to +125°C

• Virtual Junction Temperature, TVJ (Note 3)40°C to +150°C

• Soldering temperature of leads (10 seconds)+300°C

• ESD protection on CANH and CANL pins (Note 4)6 kV

• ESD protection on all other pins (Note 4)4 kV

• Note 1: Short-circuit applied when TXD is High and Low.

  • 2: In accordance with ISO-7637.
  • 3: In accordance with IEC 60747-1.
  • 4: Classification A: Human Body Model.

† NOTICE: Stresses above those listed under "Maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.