Part: MAX32660 from Maxim Integrated

Type: Arm Cortex-M4 Processor with FPU-Based Microcontroller (MCU)

Key Specs:

• Flash Memory: 256KB
• SRAM: 96KB
• Internal Oscillator: up to 96MHz
• Active Current: 85μA/MHz
• VCORE Supply Voltage: 1.1V (typical)
• VDD Supply Voltage: 1.71V to 3.63V
• Operating Temperature: -40°C to +105°C
• Full Memory Retention Power in Backup Mode: 2μA
• Ultra-Low Power RTC: 450nA

Features:

• Arm Cortex-M4 processor with FPU
• Flexible and versatile power management unit
• SPI, UART, and I2C communication support
• Optional bootloader through I2C, UART, or SPI
• 16KB Instruction Cache
• Memory Protection Unit (MPU)
• Low 1.1V VCORE Supply Voltage
• 3.6V GPIO Operating Range
• Internal LDO
• Internal 80kHz Ring Oscillator
• Up to 14 General-Purpose I/O Pins
• I2S
• Four-Channel Standard DMA Controller
• Three 32-Bit Timers
• Watchdog Timer
• CMOS-Level 32.768kHz RTC Output

Applications:

• Sports Watches
• Fitness Monitors
• Wearable Medical Patches
• Portable Medical Devices
• Industrial Sensors
• IoT
• Optical Modules: QSFP-DD, QSFP, 400G

Package:

• 16-bump WLP: 1.6mm x 1.6mm
• 20-pin TQFN-EP: 4mm x 4mm
• 24-pin TQFN-EP: 3mm x 3mm

• High-Efficiency Microcontroller for Wearable Devices
  • Internal Oscillator Operates up to 96MHz
  • 256KB Flash Memory
  • 96KB SRAM, Optionally Preserved in Lowest Power Backup Mode
  • 16KB Instruction Cache
  • Memory Protection Unit (MPU)
  • Low 1.1V VCORE Supply Voltage
  • 3.6V GPIO Operating Range
  • Internal LDO Provides Operation from Single Supply
  • Wide Operating Temperature: -40°C to +105°C
• Power Management Maximizes Uptime for Battery Applications
  • 85μA/MHz Active Executing from Flash
  • 2μA Full Memory Retention Power in Backup Mode at VDD = 1.8V
  • 450nA Ultra-Low Power RTC at VDD = 1.8V
  • Internal 80kHz Ring Oscillator
• Optimal Peripheral Mix Provides Platform Scalability
  • Up to 14 General-Purpose I/O Pins
  • Up to Two SPI
  • I2S
  • Up to Two UARTs
  • Up to Two I2C, 3.4Mbps High Speed
  • Four-Channel Standard DMA Controller
  • Three 32-Bit Timers
  • Watchdog Timer
  • CMOS-Level 32.768kHz RTC Output

Ordering Information appears at end of data sheet.

Arm and Cortex are registered trademarks of Arm Limited (or its subsidiaries) in the US and/or elsewhere.

19-100236; Rev 9; 6/22

• Sports Watches
• Fitness Monitors
• Wearable Medical Patches
• Portable Medical Devices
• Industrial Sensors
• IoT
• Optical Modules: QSFP-DD, QSFP, 400G

MAX32660 WLP-16 Pinout

Notes

• WLP Package: 16-bump wafer-level package (1.6mm × 1.6mm × 0.65mm, 0.35mm pitch)
• GPIO Availability: 10 GPIO pins available on 16 WLP (P0.0–P0.9); P0.10–P0.13 are not pinned out in this package
• Dual-Function Pins: Most GPIO pins support multiple alternate functions (I2C, SPI, UART, I2S, timers, debug). Pin function is selectable via firmware configuration
• Debug Interface: SWDIO and SWDCLK (pins 7, 8, 15, 16) support Serial Wire Debug (SWD) for code loading and ICE debugging
• I2S Support: Pins P0.0–P0.3 support I2S functionality when enabled (I2S_SDI, I2S_SDO, I2S_BCLK, I2S_LRCLK)
• Crystal Pins: XTAL32 pins (A2, A1) require external 32.768kHz crystal for RTC operation
• Power: Single VDD supply pin (A3); internal voltage regulator provides VCORE to processor core

• VCORE-0.3V to +1.21V
• VDD-0.3V to +3.63V
• 32KIN, 32KOUT-0.3V to VDD + 0.3V
• RSTN, All GPIO except P0.[4–7, 9] -0.3V to VDD + 0.3V
• GPIO P0.[4–7, 9]-0.3V to VDD + 0.3V
• Total Current into All GPIO Combined (sink)10

Note: Long-term storage at +150°C is not recommended as this will reduce the lifetime of the flash storage. Please keep long-term storage of the part below +125°C.

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

16 WLP

20 TQFN-EP

24 TQFN-EP

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics