MAX31875R2

Part: MAX31875 — Maxim Integrated Type: Local Temperature Sensor Description: A ±1°C-accurate local temperature sensor with I2C/SMBus interface, operating from 1.6V to 3.6V, available in a tiny 4-bump WLP package.

Operating Conditions:

• Supply voltage: 1.6V to 3.6V
• Operating temperature: -40°C to +125°C
• Bus speed: Up to 1 MHz

Absolute Maximum Ratings:

• Max supply voltage: +4V
• Max junction/storage temperature: +150°C

Key Specs:

• Temperature Measurement Error: ±1°C from -0°C to +70°C (V DD = 3.3V, 12-bit resolution)
• Temperature Measurement Error: ±1.75°C from -40°C to +145°C (V DD = 1.6V to 3.6V, 12-bit resolution)
• Temperature Resolution: 0.0625°C (12-bit)
• Conversion Time: 35 ms (typ, 10-bit resolution, V DD ≥ 3V)
• Average Power Supply Current: 1.1 μA (typ, 0.25 conversions/s, 10-bit resolution)
• Standby Supply Current: 0.5 μA (typ, bus timeout disabled)
• Serial Clock Frequency: 1 MHz (max)
• SCL Time Low for Reset of Serial Interface: 14 ms (min) to 55 ms (max)

Features:

• Tiny, 0.84mm x 0.84mm x 0.35mm WLP
• I2C and SMBus Support
• Selectable Timeout Prevents Bus Lockup
• Selectable PEC for Reliable Communications
• Multiple temperature resolution options (8-bit to 12-bit)

Applications:

• Battery-Powered Equipment
• Handheld Electronics
• Data Communications Equipment
• Servers
• Industrial Equipment

Package:

• 4-bump, wafer-level package (WLP)

• Tiny, 0.84mm x 0.84mm x 0.35mm WLP
• Excellent Temperature Accuracy
• ±1.75°C from -40°C to +145°C
• ±1°C from -0°C to +70°C
• <10μA Average Power Supply Current
• Selectable Timeout Prevents Bus Lockup (Default Enabled)
• I 2 C and SMBus Support
• Selectable PEC for Reliable Communications
• Up to 1MHz Bus Speed
• +1.6V to +3.6V Power Supply Voltage

• Battery-Powered Equipment
• Handheld Electronics
• Data Communications Equipment
• Servers
• Industrial Equipment

Ordering Information appears at end of data sheet.

(T A = -40°C to +125°C, V DD = 1.6V to 3.6V, resolution = 10 bits, unless otherwise specified. Limits are 100% tested at T A = 25°C. Limits over the operating temperature range and relevant supply voltage range are guaranteed by design and characterization.)

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• PACKAGE CODE
• Outline Number
• Land Pattern Number
• Thermal Resistance, Four-Layer Board:
• Junction to Ambient (θ JA )
• Junction to Case (θ JC )

For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages . Note that a '+', '#', or '-' in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.

Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial .