Overview

Part: MAX232, MAX232I from Texas Instruments

Type: Dual EIA-232 Drivers/Receivers

Key Specs:

Power Supply: Single 5-V
Charge-Pump Capacitors: 1.0-µF
Data Rate: up to 120 kbit/s
Drivers: Two
Receivers: Two
Receiver Input Levels: ±30-V
Supply Current: 8 mA Typical
ESD Protection (Human-Body Model): 2000-V (A114-A)
Receiver Typical Threshold: 1.3 V
Receiver Typical Hysteresis: 0.5 V

Features:

Meets or Exceeds TIA/EIA-232-F and ITU Recommendation V.28
Operates From a Single 5-V Power Supply With 1.0-µF Charge-Pump Capacitors
Operates up to 120 kbit/s
Two Drivers and Two Receivers
±30-V Input Levels
Low Supply Current: 8 mA Typical
ESD Protection Exceeds JESD 22

Applications:

TIA/EIA-232-F
Battery-Powered Systems
Terminals
Modems
Computers

Package:

SOIC (16): 9.90 mm × 3.91 mm
SOIC (16): 10.30 mm × 7.50 mm
PDIP (16): 19.30 mm × 6.35 mm
SOP (16): 10.3 mm × 5.30 mm

Features

¹• Meets or Exceeds TIA/EIA-232-F and ITU Recommendation V.28
Operates From a Single 5-V Power Supply With 1.0-µF Charge-Pump Capacitors
Operates up to 120 kbit/s
Two Drivers and Two Receivers
±30-V Input Levels
Low Supply Current: 8 mA Typical
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
Upgrade With Improved ESD (15-kV HBM) and 0.1-µF Charge-Pump Capacitors is Available With the MAX202 Device

Applications

TIA/EIA-232-F
Battery-Powered Systems
Terminals
Modems
Computers

Pin Configuration

Top View

1 2 3 4 16 15 14 13 C1+ VS+ C1− C2+ VCC GND T1OUT R1IN MAX232 . . . D, DW, N, OR NS PACKAGE MAX232I . . . D, DW, OR N PACKAGE (TOP VIEW)

R1OUT T1IN T2IN R2OUT

C2− VS− T2OUT R2IN

| PIN | |--------------|--------|------|--------------------------------------------------------| | NAME | NO. | TYPE | DESCRIPTION | | C1+ | 1 | — | Positive lead of C1 capacitor | | VS+ | 2 | O | Positive charge pump output for storage capacitor only | | C1- | 3 | — | Negative lead of C1 capacitor | | C2+ | 4 | — | Positive lead of C2 capacitor | | C2- | 5 | — | Negative lead of C2 capacitor | | VS- | 6 | O | Negative charge pump output for storage capacitor only | | T2OUT, T1OUT | 7, 14 | O | RS232 line data output (to remote RS232 system) | | R2IN, R1IN | 8, 13 | I | RS232 line data input (from remote RS232 system) | | R2OUT, R1OUT | 9, 12 | O | Logic data output (to UART) | | T2IN, T1IN | 10, 11 | I | Logic data input (from UART) | | GND | 15 | — | Ground | | VCC | 16 | — | Supply Voltage, Connect to external 5V power supply |

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

	PARAMETER	TEST CONDITIONS(1)	MIN	TYP(2)	MAX	UNIT
ICC	Supply current	VCC = 5.5V, all outputs open, TA = 25°C		8	10	mA

(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V

(2) All typical values are at VCC = 5 V, and T^A = 25°C.

Product Folder Links: MAX232

⁽²⁾ All voltages are with respect to network GND.

⁽²⁾ JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.6 Electrical Characteristics — Driver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

	PARAMETER		TEST CONDITIONS ⁽¹⁾	MIN	TYP ⁽²⁾	MAX	UNIT
$V_{OH}$	High-level output voltage	T1OUT, T2OUT	$R_L = 3 \text{ k}\Omega \text{ to GND}$	5	7		V
$V_{OL}$	Low-level output voltage (3)	T1OUT, T2OUT	$R_L = 3 \text{ k}\Omega \text{ to GND}$		-7	-5	V
r _O	Output resistance	T1OUT, T2OUT	$V_{S+} = V_{S-} = 0, V_O = \pm 2 V$	300			Ω
I _OS (4)	Short-circuit output current	T1OUT, T2OUT	V _CC = 5.5 V, V _O = 0 V		±10		mA
I _IS	Short-circuit input current	T1IN, T2IN	V ₁ = 0			200	μΑ

(1) Test conditions are C1–C4 = 1 $\mu$ F at V_CC = 5 V ± 0.5 V (2) All typical values are at V_CC = 5 V, T_A = 25°C.
(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only.
(4) Not more than one output should be shorted at a time.

7.7 Electrical Characteristics — Receiver

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

	PARAMETER		TEST CONDITIONS ⁽¹⁾	MIN	TYP ⁽²⁾	MAX	UNIT
$V_{OH}$	High-level output voltage	R1OUT, R2OUT	$I_{OH} = -1 \text{ mA}$	3.5			V
$V_{OL}$	Low-level output voltage (3)	R1OUT, R2OUT	$I_{OL} = 3.2 \text{ mA}$			0.4	V
V _IT+	Receiver positive-going input threshold voltage	R1IN, R2IN	V _CC = 5 V, T _A = 25°C		1.7	2.4	٧
V _IT	Receiver negative-going input threshold voltage	R1IN, R2IN	V _CC = 5 V, T _A = 25°C	0.8	1.2		V
$V_{\text{hys}}$	Input hysteresis voltage	R1IN, R2IN	V _CC = 5 V	0.2	0.5	1	٧
r _l	Receiver input resistance	R1IN, R2IN	$V_{CC} = 5 \text{ V}, T_A = 25^{\circ}\text{C}$	3	5	7	kΩ

⁽¹⁾ Test conditions are C1–C4 = 1 $\mu$ F at V_CC = 5 V ± 0.5 V. (2) All typical values are at V_CC = 5 V, T_A = 25°C.

7.8 Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

	PARAMETER	TEST CONDITIONS ⁽¹⁾	TYP ⁽¹⁾	MAX	UNIT
SR	Driver slew rate	RL = 3 k $\Omega$ to 7 k $\Omega$ , see Figure 4		30	V/μs
SR(t)	Driver transition region slew rate	see Figure 5	3		V/μs
	Data rate	One TOUT switching	120		kbit/s
t _PLH®)	Receiver propagation delay time, low- to high-level output	TTL load, see Figure 3	500		ns
t _PHL®)	Receiver propagation delay time, high- to low-level output	TTL load, see Figure 3	500		ns

(1) Test conditions are C1–C4 = 1 $\mu$ F at $V_{CC}$ = 5 V $\pm$ 0.5 V.

Product Folder Links: MAX232

⁽³⁾ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage levels only.

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

			MIN	MAX	UNIT
VCC	Input Supply voltage range(2)		–0.3	6	V
VS+	Positive output supply voltage range		VCC – 0.3	15	V
VS–	Negative output supply voltage range		–0.3	–15	V
	Input voltage range	T1IN, T2IN	–0.3	VCC + 0.3
VI		R1IN, R2IN		±30	V
		T1OUT, T2OUT	VS– – 0.3	VS+ + 0.3
VO	Output voltage range	R1OUT, R2OUT	–0.3	VCC + 0.3	V
	Short-circuit duration	T1OUT, T2OUT		Unlimited
TJ	Operating virtual junction temperature			150	°C

⁽¹⁾ Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

			MIN	MAX	UNIT
Tstg	Storage temperature range		-65	150	°C
		Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)	0	2000
V(ESD)	Electrostatic discharge	Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)	0	1000	V

⁽¹⁾ JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

			MIN	NOM	MAX	UNIT
VCC	Supply voltage		4.5	5	5.5	V
VIH	High-level input voltage (T1IN,T2IN)		2			V
VIL	Low-level input voltage (T1IN, T2IN)				0.8	V
R1IN, R2IN	Receiver input voltage				±30	V
		MAX232	0		70
TA	Operating free-air temperature	MAX232I	–40		85	°C

7.4 Thermal Information

| | | | MAX232xDW | MAX232xN | MAX232xNS | |------|----------------------------------------|---------|-----------|----------|-----------|------| | | THERMAL METRIC(1) | SOIC | SOIC wide | PDIP | SOP | UNIT | | | | 16 PINS | 16 PINS | 16 PINS | 16 PINS | | RθJA | Junction-to-ambient thermal resistance | 73 | 57 | 67 | 64 | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

Recommended Operating Conditions

			MIN	NOM	MAX	UNIT
VCC	Supply voltage		4.5	5	5.5	V
VIH	High-level input voltage (T1IN,T2IN)		2			V
VIL	Low-level input voltage (T1IN, T2IN)				0.8	V
R1IN, R2IN	Receiver input voltage				±30	V
		MAX232	0		70
TA	Operating free-air temperature	MAX232I	–40		85	°C

Thermal Information

| | | | MAX232xDW | MAX232xN | MAX232xNS | |------|----------------------------------------|---------|-----------|----------|-----------|------| | | THERMAL METRIC(1) | SOIC | SOIC wide | PDIP | SOP | UNIT | | | | 16 PINS | 16 PINS | 16 PINS | 16 PINS | | RθJA | Junction-to-ambient thermal resistance | 73 | 57 | 67 | 64 | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

MAX232DR

Overview

Features

Applications

Pin Configuration

Top View

Electrical Characteristics

7.6 Electrical Characteristics — Driver

7.7 Electrical Characteristics — Receiver

7.8 Switching Characteristics

Absolute Maximum Ratings

7.2 Handling Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

Recommended Operating Conditions

Thermal Information