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LTC7060JMSE#TRPBF

Half-Bridge Driver

The LTC7060JMSE#TRPBF is a half-bridge driver from Analog Devices. View the full LTC7060JMSE#TRPBF datasheet below including key specifications, pinout, electrical characteristics.

Manufacturer

Analog Devices

Category

Half-Bridge Driver

Package

12-TSSOP (0.118", 3.00mm Width) Exposed Pad

Lifecycle

Production (Last Updated: 3 years ago)

Key Specifications

ParameterValue
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Driven ConfigurationHalf-Bridge
Lifecycle StatusProduction (Last Updated: 3 years ago)
Manufacturer Lifecycle StatusPRODUCTION (Last Updated: 3 years ago)
Mounting TypeSurface Mount
Number of Pins12
Operating Temperature-40°C ~ 150°C (TJ)
Package / Case12-TSSOP (0.118", 3.00mm Width) Exposed Pad
PackagingMouseReel
PackagingMouseReel
PackagingMouseReel
PackagingMouseReel
PackagingMouseReel
RoHSCompliant
Standard Pack Qty2500
Standard Pack Qty2500
Standard Pack Qty2500
Standard Pack Qty2500
Standard Pack Qty2500
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supplier Device Package12-MSOP-EP
Supply Voltage6V ~ 14V

Overview

Part: LTC7060 — Analog Devices (formerly Linear Technology)

Type: 100V Half-Bridge Driver with Floating Grounds and Adjustable Dead-Time

Description: The LTC7060 drives two N-Channel MOSFETs in a half-bridge configuration with supply voltages up to 100V, featuring a unique symmetric floating gate driver architecture for high noise immunity, 0.8Ω pull-down and 1.5Ω pull-up drivers, adaptive shoot-through protection, and programmable dead-time.

Operating Conditions:

  • Supply voltage: 6–14 V (VCC)
  • Operating temperature: -40 to 125 °C (suffix-dependent — see Order Information for grade-specific ranges)
  • Input supply operating range: up to 100 V

Absolute Maximum Ratings:

  • Max supply voltage (VCC): 15 V
  • Max top side driver voltage (BST): 115 V
  • Max bottom side driver voltage (BGVCC): 115 V
  • Max junction temperature: 150 °C

Key Specs:

  • VCC Undervoltage Lockout Threshold (VCC Falling): 5.3 V (typ)
  • VCC Overvoltage Lockout Threshold (VCC Rising): 14.6 V (typ)
  • BG Driver Supply Voltage Range (BGVCC-BGRTN): 4–14 V
  • TG Driver Supply Voltage Range (BST-SW): 4–14 V
  • TG Turn-On Input Threshold (PWM Rising): 3.1 V (typ)
  • BG Pull-Down Resistance: 0.8 Ω (typ, VBGVCC-BGRTN = 10V)
  • TG Pull-Down Resistance: 0.8 Ω (typ, VBST-SW = 10V)
  • BG/TG Low to TG/BG High Propagation Delay (Dead-Time, RDT = 0Ω): 32 ns (typ)

Features:

  • Unique Symmetric Floating Gate Driver Architecture
  • High Noise Immunity, Tolerates ±10V Ground Difference between Input and Output Grounds
  • 100V Maximum Input Voltage Independent of IC Supply Voltage VCC
  • 0.8Ω Pull-Down, 1.5Ω Pull-Up for Fast Turn-On/Off
  • Adaptive Shoot-Through Protection
  • Programmable Dead-Time
  • Three-State PWM Input with Enable Pin
  • VCC UVLO/OVLO and Floating Supplies UVLO
  • Drives Dual N-Channel MOSFETs
  • Open-Drain Fault Indicator
  • AEC-Q100 Automotive Qualification in Progress

Applications:

  • Automotive and Industrial Power Systems
  • Telecommunication Power Systems
  • Half-Bridge and Full-Bridge Converters

Package:

  • 12-Lead Plastic MSSOP

Features

  • n Unique Symmetric Floating Gate Driver Architecture
  • n High Noise Immunity,Tolerates ±10V Ground Difference between Input and Output Grounds
  • n 100V Maximum Input Voltage Independent of IC Supply Voltage V CC
  • n 6V to 14V V CC Operating Voltage
  • n 4V to 14V Gate Driver Voltage
  • n 0.8Ω Pull-Down, 1.5Ω Pull-Up for Fast Turn-On/Off
  • n Adaptive Shoot-Through Protection
  • n Programmable Dead-Time
  • n Three-State PWM Input with Enable Pin
  • n VCC UVLO/OVLO and Floating Supplies UVLO
  • n Drives Dual N-Channel MOSFETs
  • n Open-Drain Fault Indicator
  • n Available in Thermally Enhanced 12-LEAD MSOP
  • n AEC-Q100 Automotive Qualification in Progress

Applications

  • n Automotive and Industrial Power Systems
  • n Telecommunication Power Systems
  • n Half-Bridge and Full-Bridge Converters

Pin Configuration

LTC7060JMSE#TRPBF Pinout

Package: 12-TSSOP (0.118", 3.00mm Width) with Exposed Pad

Pin NumberPin NameTypeDescription
1PWMIPWM Input Signal
2ENIEnable Input
3FLTOFault Output (Open Drain)
4DTIDead-Time Programming (Resistor to GND)
5VCCPIC Supply Voltage (6V to 14V)
6BGVCCPBottom Gate Driver Supply
7BGRTNPBottom Gate Driver Return
8BGOBottom Gate Driver Output
9NCNo Connect
10SWPSwitch Node
11TGOTop Gate Driver Output
12BSTPTop Gate Driver Bootstrap Supply
13SGNDPSignal Ground / Exposed Pad (must be soldered to PCB)

Notes

  • Pin 13 is the exposed pad (SGND) and must be soldered to the PCB for proper thermal and electrical performance.
  • PWM input has internal pull-up (48 kΩ) and pull-down (42 kΩ) resistors; floating voltage is ~2.1V typical.
  • EN pin has internal 2 MΩ pull-down resistor.
  • FLT is an open-drain output with ~60 Ω pull-down resistance and 100 μs release delay.
  • DT pin sets dead-time via external resistor to SGND (0 Ω to open circuit).

Electrical Characteristics

The l denotes the specifications which apply over the specified operating temperature range, otherwise specifications are at T A = 25°C (Note 2). V CC = V BGVCC = V BST =10V, V BGRTN = V SW = 0V, unless otherwise noted.

SYMBOLPARAMETERCONDITIONSTYPMAXUNITS
Low Side Gate Driver Output (BG)Low Side Gate Driver Output (BG)Low Side Gate Driver Output (BG)Low Side Gate Driver Output (BG)Low Side Gate Driver Output (BG)Low Side Gate Driver Output (BG)
V OH(BG)BG High Output VoltageI BG = -100mA, V OH(BG) = V BGVCC - V BG150mV
V OL(BG)BG Low Output VoltageI BG = 100mA, V OL(BG) =V BG - V BGRTN80mV
R UP(BG)BG Pull-Up ResistanceV BGVCC-BGRTN =10V1.5Ω
R DOWN(BG)BG Pull-Down ResistanceV BGVCC-BGRTN =10V0.8Ω
High Side Gate Driver Output (TG)High Side Gate Driver Output (TG)High Side Gate Driver Output (TG)High Side Gate Driver Output (TG)High Side Gate Driver Output (TG)High Side Gate Driver Output (TG)
V OH(TG)TG High Output VoltageI TG = -100mA, V OH(TG) = V BST - V TG150mV
V OL(TG)TG Low Output VoltageI TG = 100mA, V OL(TG) = V TG - V SW80mV
R UP(TG)TG Pull-Up ResistanceV BST-SW = 10V1.5Ω
R DOWN(TG)TG Pull-Down ResistanceV BST-SW = 10V0.8Ω
Switching TimeSwitching TimeSwitching TimeSwitching TimeSwitching TimeSwitching Time
t PHL(BG)PWM High to BG Low Propagation Delay17ns
t PHL(TG)PWM Low to TG Low Propagation Delay17ns
t r(BG)BG Output Rise TimeC LOAD = 3.3nF (Note 5)18ns
t f(BG)BG Output Fall TimeC LOAD = 3.3nF (Note 5)13ns
t r(TG)TG Output Rise TimeC LOAD = 3.3nF (Note 5)18ns
t f(TG)TG Output Fall TimeC LOAD = 3.3nF (Note 5)13ns
t PH(EN)EN High to TG/BG High Propagation Delay30ns
t PL(EN)EN Low to TG/BG Low Propagation Delay36ns

Note 2: The LTC7060E is guaranteed to meet performance specifications from 0°C to 85°C junction temperature. Specifications over the -40°C to 125°C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LTC7060I is guaranteed over the -40°C to 125°C operation junction temperature range. The LTC7060J is guaranteed over the -40°C to 150°C operation junction temperature range. The LTC7060H is guaranteed over the -40°C to 150°C operation junction temperature range. High junction temperature degrades operation lifetimes; operating lifetime is derated for junction temperatures greater than 125°C. Note that the maximum ambient temperature consistent with these specifications is determined by specific operating conditions in conjunction with board layout, the rated package thermal impedance and other environment factors.

Note 3: T J is calculated from the ambient temperature T A and power dissipation PD according to the following formula

T J = T A + (P D · 51°C/W) for LFCSP package; T J = T A + (P D · 40°C/W) for MSOP package.

Note 4: The total current includes both the current from BGV CC /BST to BGRTN/SW and the current to SGND. Dynamic supply current is higher due to the gate charge being delivered at the switching frequency.

Note 5: Rise and fall times are measured using 10% and 90% levels.

Typical Application

W

M

P

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