GD32F103C8

Part: GD32F103xx — GigaDevice Semiconductor Inc.

Type: Arm Cortex-M3 32-bit MCU

Description: A 32-bit Arm Cortex-M3 microcontroller family operating at up to 108 MHz, offering various Flash memory sizes from 16 KB to 3 MB and SRAM from 6 KB to 96 KB, with a wide range of integrated peripherals.

Operating Conditions:

• Supply voltage: 2.6–3.6 V
• Operating temperature: -40 to +85 °C
• Max CPU frequency: 108 MHz

Absolute Maximum Ratings:

• Max supply voltage: 4.0 V
• Max junction/storage temperature: 150 °C

Key Specs:

• CPU: Arm Cortex-M3
• Max CPU frequency: 108 MHz
• Flash memory: 16 KB to 3 MB
• SRAM: 6 KB to 96 KB
• Operating voltage (VDD): 2.6 V to 3.6 V
• Operating temperature: -40 °C to +85 °C
• Run mode current (GD32F103xC/D/E/F/G/I/K, 108 MHz, VDD=3.3V): 23.5 mA (typical)
• Standby mode current (GD32F103xC/D/E/F/G/I/K, VDD=3.3V): 2.0 μA (typical)

Features:

• Up to 108 MHz Arm Cortex-M3 CPU
• Multiple Flash memory options (16 KB to 3 MB)
• Multiple SRAM options (6 KB to 96 KB)
• Multiple communication interfaces (I2C, SPI, USART, I2S, SDIO, USBD, CAN)
• Analog peripherals (ADC, DAC, Temperature sensor)
• Timers and PWM generation
• Real-time clock (RTC)
• Direct Memory Access (DMA)

Applications:

Package:

• LQFP144
• LQFP100
• LQFP64
• LQFP48
• QFN36

Figure 2-3. GD32F103Zx LQFP144 pinouts

Figure 2-4. GD32F103Vx LQFP100 pinouts

Figure 2-5. GD32F103Rx LQFP64 pinouts

Figure 2-6. GD32F103Cx LQFP48 pinouts

Figure 2-7. GD32F103Tx QFN36 pinouts

Table 4-34. ADC characteristics(For GD32F103x4/6/8/B devices)

Table 4-34. ADC characteristics(For GD32F103x4/6/8/B devices)

• (2) Guaranteed by design, not tested in production.
• (3) VREFP should always be equal to or less than VDDA, especially during power up.
• (2) Guaranteed by design, not tested in production.

Table 4-35. ADC characteristics(For GD32F103xC/D/E/F/G/I/K devices)

(3) VREFP should always be equal to or less than VDDA, especially during power up.

The formula above ( Equation 1 ) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. Here N = 12 (from 12-bit resolution).

Table 4-36. ADC RAIN max for fADC = 14 MHz (For GD32F103x4/6/8/B devices)

• T s (cycles) t s (μs) R AIN max (kΩ)
• 1.5 0.11 0.1
• 7.5 0.54 1.5
• 13.5 0.96 2.9
• 28.5 2.04 6.3
• 41.5 2.96 9.3
• 55.5 3.96 12.5
• 71.5 5.11 16.2
• 239.5 17.11 54.8

Table 4-36. ADC RAIN max for fADC = 14 MHz (For GD32F103x4/6/8/B devices)

Table 4-37. ADC RAIN max for fADC = 14 MHz (For GD32F103xC/D/E/F/G/I/K devices)

• T s (cycles) t s (μs) R AIN max (kΩ)
• 1.5 0.11 0.8
• 7.5 0.54 6.4
• 13.5 0.96 11.9
• 28.5 2.04 25.7
• 41.5 2.96 37.6
• 55.5 3.96 50.5
• 71.5 5.11 65.2
• 239.5 17.11 219.8

The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly beyond the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.

Table 4-1. Absolute maximum ratings (1)(4)

Thermal resistance is used to characterize the thermal performance of the package device, which is represented by the Greek letter 'θ'. For semiconductor devices, thermal resistance represents the steady-state temperature rise of the chip junction due to the heat dissipated on the chip surface.

θJA: Thermal resistance, junction-to-ambient.

θJB: Thermal resistance, junction-to-board.

θJC: Thermal resistance, junction-to-case.

ᴪJB: Thermal characterization parameter, junction-to-board.

ᴪJT: Thermal characterization parameter, junction-to-top center.

Where, TJ = Junction temperature.

TA = Ambient temperature

TB = Board temperature

TC = Case temperature which is monitoring on package surface

PD = Total power dissipation

θJA represents the resistance of the heat flows from the heating junction to ambient air. It is an indicator of package heat dissipation capability. Lower θJA can be considerate as better overall thermal performance. θJA is generally used to estimate junction temperature.

θJB is used to measure the heat flow resistance between the chip surface and the PCB board.

θJC represents the thermal resistance between the chip surface and the package top case. θJC is mainly used to estimate the heat dissipation of the system (using heat sink or other heat dissipation methods outside the device package).

Table 5-6. Package thermal characteristics (1)

Table 5-6. Package thermal characteristics (1)

Figure 5-1. LQFP144 package outline

Table 5-1. LQFP144 package dimensions

(Original dimensions are in millimeters)

Table 5-1. LQFP144 package dimensions

Figure 5-2. LQFP144 recommended footprint

(Original dimensions are in millimeters)