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ESP32-S3-WROOM-1

Wireless MCU Module

The ESP32-S3-WROOM-1 is a wireless mcu module from Espressif Systems. View the full ESP32-S3-WROOM-1 datasheet below including key specifications, pinout, electrical characteristics, absolute maximum ratings.

Official ESP32-S3-WROOM-1 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Espressif Systems

ESP32-S3-WROOM-1 Key Specifications

ParameterValue
CPUXtensa dual-core 32-bit LX7, up to 240 MHz
ROM384 KB
SRAM512 KB (plus 16 KB RTC SRAM)
Flash4 MB, 8 MB or 16 MB (SPI flash, by variant)
GPIOs36
PSRAM0, 2 MB (Quad SPI) or 8 MB (Octal SPI), by variant
Wi-Fi802.11 b/g/n, up to 150 Mbps, 2412 to 2484 MHz
AntennaOn-board PCB antenna
Crystal40 MHz
BluetoothBluetooth 5 LE, Bluetooth mesh, 2 Mbps PHY, long range
Pin Count41
ESD RatingHBM ±2000 V, CDM ±500 V
InterfacesSPI, I2C, I2S, UART, USB 1.1 OTG, USB Serial/JTAG, SDIO host, TWAI (ISO 11898-1), LCD, Camera, ADC, touch sensor
Supply Voltage3.0V to 3.6V
Module Dimensions18 x 25.5 x 3.1 mm
Operating Temperature-40°C to 85°C (-H4 variants: -40°C to 105°C)
Moisture Sensitivity LevelMSL 3

ESP32-S3-WROOM-1 Overview

Part: ESP32-S3-WROOM-1 / ESP32-S3-WROOM-1U from Espressif

Type: Wi-Fi (802.11 b/g/n) and Bluetooth 5 (LE) MCU module

Description: A powerful, generic Wi-Fi + Bluetooth LE MCU module built around an Xtensa dual-core 32-bit LX7 microprocessor up to 240 MHz, featuring up to 16 MB Flash, up to 8 MB PSRAM, and 36 GPIOs.

Operating Conditions:

  • Supply voltage: 3.0–3.6 V
  • Operating temperature: -40 to 105 °C
  • CPU clock frequency: Up to 240 MHz

Absolute Maximum Ratings:

  • Max supply voltage: 3.6 V
  • Max junction/storage temperature: 105 °C

Key Specs:

  • CPU: Xtensa dual-core 32-bit LX7 microprocessor, up to 240 MHz
  • ROM: 384 KB
  • SRAM: 512 KB (plus 16 KB in RTC)
  • Flash: Up to 16 MB SPI flash
  • PSRAM: Up to 8 MB
  • Wi-Fi Standard: 802.11 b/g/n, up to 150 Mbps
  • Bluetooth: Bluetooth 5 (LE), Bluetooth mesh, 2 Mbps PHY
  • GPIOs: 36
  • High-level source current (I_OH): 40 mA (VDD = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3)
  • Low-level sink current (I_OL): 28 mA (VDD = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3)

Features:

  • Integrated 40 MHz crystal oscillator
  • On-board PCB antenna (ESP32-S3-WROOM-1) or external antenna connector (ESP32-S3-WROOM-1U)
  • Rich set of peripherals: GPIO, SPI, LCD, Camera, UART, I2C, I2S, USB 1.1 OTG, ADC, touch sensor, temperature sensor
  • Acceleration for neural network computing and signal processing workloads
  • Low-power co-processor for peripheral monitoring

Applications:

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Speech Recognition
  • Image Recognition
  • Home Automation

Package:

  • 18 × 25.5 × 3.1 mm (ESP32-S3-WROOM-1 variants)
  • 18 × 19.2 × 3.2 mm (ESP32-S3-WROOM-1U variants)

ESP32-S3-WROOM-1 Applications

  • Generic Low-power IoT Sensor Hub
  • Generic Low-power IoT Data Loggers
  • Cameras for Video Streaming
  • Over-the-top (OTT) Devices

PRELIMINARY · USB Devices · Speech Recognition · Image Recognition · Mesh Network · Home Automation · Health Care Applications · Wi-Fi-enabled Toys · Wearable Electronics · Retail & Catering Applications

  • Smart Building
  • Industrial Automation
  • Smart Agriculture
  • Audio Applications

ESP32-S3-WROOM-1 Pin Configuration

ESP32-S3-WROOM-1 Pinout

Package: 41-pin module (WROOM form factor)

PinNameTypeFunction
1GNDPGround
23V3PPower supply (3.3 V)
3ENIChip enable (High: on, Low: off)
4IO4I/O/TRTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3
5IO5I/O/TRTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4
6IO6I/O/TRTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5
7IO7I/O/TRTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6
8IO15I/O/TRTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P
9IO16I/O/TRTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N
10IO17I/O/TRTC_GPIO17, GPIO17, U1TXD, ADC2_CH6
11IO18I/O/TRTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, CLK_OUT3
12IO8I/O/TRTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7, SUBSPICS1
13IO19I/O/TRTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D-
14IO20I/O/TRTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+
15IO3I/O/TRTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2
16IO46I/O/TGPIO46
17IO9I/O/TRTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD, SUBSPIHD
18IO10I/O/TRTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4, SUBSPICS0
19IO11I/O/TRTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5, SUBSPID
20IO12I/O/TRTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6, SUBSPICLK
21IO13I/O/TRTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7, SUBSPIQ
22IO14I/O/TRTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS, SUBSPIWP
23IO21I/O/TRTC_GPIO21, GPIO21
24IO47I/O/TSPICLK_P_DIFF, GPIO47, SUBSPICLK_P_DIFF
25IO48I/O/TSPICLK_N_DIFF, GPIO48, SUBSPICLK_N_DIFF
26IO45I/O/TGPIO45
27IO0I/O/TRTC_GPIO0, GPIO0
28IO35I/O/TSPIIO6, GPIO35, FSPID, SUBSPID
29IO36I/O/TSPIIO7, GPIO36, FSPICLK, SUBSPICLK
30IO37I/O/TSPIDQS, GPIO37, FSPIQ, SUBSPIQ
31IO38I/O/TGPIO38, FSPIWP, SUBSPIWP
32IO39I/O/TMTCK, GPIO39, CLK_OUT3, SUBSPICS1
33IO40I/O/TMTDO, GPIO40, CLK_OUT2
34IO41I/O/TMTDI, GPIO41, CLK_OUT1
35IO42I/O/TMTMS, GPIO42
36RXD0I/O/TU0RXD, GPIO44, CLK_OUT2
37TXD0I/O/TU0TXD, GPIO43, CLK_OUT1
38IO2I/O/TRTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1
39IO1I/O/TRTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0
40GNDPGround
41EPADPGround (exposed pad)

Notes

  • Strapping pins (GPIO0, GPIO3, GPIO45, GPIO46): These pins sample voltage levels during chip reset and determine boot mode, VDD_SPI voltage, and JTAG signal source. GPIO0, GPIO45, and GPIO46 have internal weak pull-up/pull-down; GPIO3 is floating by default.
  • OSPI PSRAM variants: In module variants with embedded OSPI PSRAM (ESP32-S3R8), pins IO35, IO36, and IO37 are reserved for PSRAM and unavailable for general use.
  • Type codes: P = power supply; I = input; O = output; T = high impedance (tri-state capable).
  • EN pin: Must not be left floating; tie to 3V3 for normal operation or to GND to power off.

ESP32-S3-WROOM-1 Electrical Characteristics

The values presented in this section are preliminary and may change with the final release of this datasheet.

ESP32-S3-WROOM-1 Absolute Maximum Ratings

SymbolParameterMinMaxUnit
VDD33Power supply voltage-0.33.6V
T STOREStorage temperature-40105°C
SymbolParameterMinTypMaxUnit
VDD33Power supply voltage3.03.33.6V
I VDDCurrent delivered by external power supply0.5--A
T AOperating ambient temperature 85 °C version 105 °C version-40-85 105°C
HumidityHumidity condition--85%RH
SymbolParameterMinTypMaxUnit
C INPin capacitance-2-pF
V IHHigh-level input voltage0.75 × VDD 1-VDD 1 + 0.3V
V ILLow-level input voltage-0.3-0.25 × VDD 1V
I IHHigh-level input current--50nA
I ILLow-level input current--50nA
V OH 2High-level output voltage0.8 × VDD 1--V
V OL 2Low-level output voltage--0.1 × VDD 1V
I OHHigh-level source current (VDD 1 = 3.3 V, V OH >= 2.64 V, PAD_DRIVER = 3)-40-mA
I OLLow-level sink current (VDD 1 = 3.3 V, V OL = 0.495 V, PAD_DRIVER = 3)-28-mA

PRELIMINARY Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Table 5: Absolute Maximum Ratings 4.2 Recommended Operating Conditions Table 6: Recommended Operating Conditions 4.3 DC Characteristics (3.3 V, 25 °C) Table 7: DC Characteristics (3.3 V, 25 °C)

Cont'd on next page

Table 7 - cont'd from previous page

SymbolParameterMinTypMaxUnit
R PUInternal weak pull-up resistor-45-k Ω
R PDInternal weak pull-down resistor-45-k Ω
V IH _ nRSTChip reset release voltage (EN voltage is within the specified range)0.75 × VDD 1-VDD 1 + 0.3V
V IL _ nRSTChip reset voltage (EN voltage is within the specified range)-0.3-0.25 × VDD 1V
Work modeDescriptionDescriptionPeak (mA)
Active (RF working)TX802.11b, 1 Mbps, @20.5 dBm330
Active (RF working)802.11g, 54 Mbps, @18 dBm280
Active (RF working)802.11n, HT20, MCS7, @17.5 dBm273
Active (RF working)RX802.11n, HT40, MCS7, @17 dBm278
Active (RF working)802.11b/g/n, HT2097
Active (RF working)802.11n, HT40100
Work modeDescriptionTypUnit
Light-sleep-240μ A
Deep-sleepRTC memory and RTC peripherals are powered on.8μ A
HibernationRTC memory is powered on. RTC peripherals are powered off.7μ A
Power offCHIP_PU is set to low level. The chip is powered off.1μ A

PRELIMINARY 1 VDD is the I/O voltage for pins of a particular power domain. 2 V OH and V OL are measured using high-impedance load. 4.4 Current Consumption Characteristics Owing to the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-S3 Series Datasheet . Table 8: Current Consumption Depending on RF Modes 1 The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters' measurements are based on a 100% duty cycle. 2 The current consumption figures in RX mode are for cases where the peripherals are disabled and the CPU idle. Note that the data in Table 9 only applies to the module variants that embed ESP32-S3. Table 9: Current Consumption Depending on Work Modes

ESP32-S3-WROOM-1 Package Information

PRELIMINARY Figure 10: ESP32­S3­WROOM­1 Recommended PCB Land Pattern

PRELIMINARY Figure 11: ESP32­S3­WROOM­1U Recommended PCB Land Pattern

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
ESP32Espressif SystemsESP32-WROOM-32E (18.0 x 25.5 x 3.1 mm)

More part numbers on this datasheet

Their pages show this same datasheet. Some are linked through their part family rather than checked part by part, so confirm the exact part in the ordering information.

Other RF / Wireless

All RF / Wireless datasheetsAll Espressif Systems datasheets (86)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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