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EFP0103

Multi-Output Energy Friendly PMIC

The EFP0103 is a multi-output energy friendly pmic from Silicon Labs. View the full EFP0103 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

EFP0103 shares its datasheet with EFP0101, whose page lists every part number it covers.

Official EFP0103 datasheet (PDF) — the source this page was extracted from.

Manufacturer

Silicon Labs

Package

QFN-20 3x3mm

EFP0103 Key Specifications

ParameterValue
PackageQFN20 3x3mm
Peak Efficiencyup to 94%
Temperature GradeG (-40°C to 85°C)
Device ConfigurationWired Buck with LDO C
Communication InterfaceI2C, with IRQ pin
VOA Output Voltage Range1.7V to 3.3V
VOC Output Voltage Range1.7V to 3.3V (linear regulator)
Family Input Voltage Range0.8V to 5.5V
Junction Temperature Range-40°C to 100°C
VOA Default Output Voltage1.86V
VOB Startup Default (EFP0103)1.858V
VOB Output Voltage Range (EFP0103)0.8V to 3.3V
Input Voltage Range (VDDB, EFP0103)1.8V to 5.5V
Quiescent Current (EM2, No Outputs Enabled)150nA
Maximum Output Load Current (VOA, Wired Buck)150mA min
Quiescent Current (EM2, Single Output Enabled)300nA

EFP0103 Overview

Part: EFP01 Energy Friendly PMIC Family (EFP0101–EFP0111, e.g. EFP0101GM20-E) — Silicon Labs

Type: Multi-output Power Management IC (Buck/Boost DC-DC, Buck DC-DC, LDOs, Coulomb Counter)

Description: 0.8–5.5 V input, 4-output PMIC with buck/boost DC-DC A, buck DC-DC B, LDO C and a switched output, up to 94% efficiency, 300 nA EM2 quiescent current (single output), and a lossless Coulomb counter.

Operating Conditions:

  • Supply voltage: 0.8–5.5 V (OPN-dependent, e.g. 1.8–5.5 V for EFP0101/02/03/04/06/07; 0.8–1.8 V for EFP0108)
  • Operating junction temperature: -40 to 100 °C (-G grade)
  • VIO input voltage range: 1.7–5.5 V
  • VOA: 1.7–5.2 V; VOB: 0.8–3.3 V (or 0.8–1.26 V on some OPNs); VOC: 1.7–3.3 V

Absolute Maximum Ratings:

  • Max DC voltage on VDDA: 2.0 V
  • Max DC voltage on VDDB: 5.5 V (transient 6.5 V, t < 30 μs, duty cycle < 0.01%)
  • Max voltage on VIO: 5.5 V; on any I/O pin: VVIO + 0.3 V
  • Max voltage on output pins (VOA, VOB, VOC, VOA_SW): 5.5 V
  • Max on-chip power dissipation: 923 mW (2-layer PCB), 1136 mW (4-layer PCB), at TAMBIENT = 25 °C
  • Storage temperature: -50 to 150 °C
  • Max operating junction temperature: 105 °C (-G grade)

Key Specs:

  • Quiescent current into VDDB, EM2: 300 nA typ (1 output enabled), 425 nA typ (2 outputs), 525 nA typ (3 outputs)
  • Quiescent current into VDDB, EM4 (all coarse regulators enabled): 57 nA typ, 2060 nA max
  • Quiescent current into VDDA (EM0/EM2, VDDA = 1.8 V): 24 nA typ, 670 nA max
  • Bootup time to I2C ready: 1200 μs typ
  • Power-on reset threshold: rising 1.702 V max; falling 1.58–1.68 V
  • UVLO threshold: 1.2 V typ
  • DCDC A buck PMOS RDS(on): 0.150 Ω typ, 0.676 Ω max (VDDB = 3.3 V)
  • Recommended capacitors: CIN 10 μF typ, COUT 10 μF typ (25% tolerance)

Features:

  • DCDC A configurable as Buck/Boost, Buck-only or Boost-only
  • DCDC B buck with parallel internal linear regulator
  • VOC linear regulator, usable independently or combined with DCDC A
  • Switched output (VOA_SW) for powering down leaky external circuits
  • Lossless Coulomb counter (no sense resistor)
  • Fully configurable I2C, Direct Mode for fast energy-mode transitions, IRQ pin
  • Programmable inrush current and short-circuit tolerant outputs
  • UVLO, over-temperature monitoring and IRQ assertion
  • Supports alkaline, lithium primary, NiMH/NiCd, Li-ion/LiPo, LiFePO4 and USB sources

Applications:

  • IoT sensors and end devices
  • Metering
  • Home and building automation and security
  • Health and wellness
  • Wearables
  • Smart accessories
  • Human interface devices

Package:

  • QFN20 3x3 mm

EFP0103 Features

  • Provides 4 supply outputs:
  • One Buck/Boost DC-DC Converter
  • One Buck-only DC-DC Converter + LDO
  • One LDO
  • One Switched Output
  • Up to 94% efficiency

EFP0103 Electrical Characteristics

Unless stated otherwise, all electrical parameters in all tables are specified under the following conditions:

  • Typical values are based on T J =25 °C and V DDB =V IO =3.3V and VOA=VOB=VOC=1.8V, by production test and/or technology characterization.
  • Unless stated otherwise, minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature.
  • Energy mode (EM0/EM2/EM4) programming is defined in Table 3.8 Energy Modes Overview on page 22
  • EM0: BIAS_SW.BIAS0=7, EM_CRSREG_CTRL.EM_STSEL=0
  • EM2: BIAS_SW.BIAS2=1, EM_CRSREG_CTRL.EM_STSEL=2
  • EM4: EM_CRSREG_CTRL.EM_STSEL=3
  • Test board components:
  • LDCDC = 2.2 μH (Samsung CIG22H2R2MAE)
  • CIN = COUT = 10 μF (Murata GRM31CR71A106KA01)

EFP0103 Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report at https://www.silabs.com/about-us/corporate-responsibility/commitment-toquality.

Table 5.1. Absolute Maximum Ratings

ParameterSymbolTest ConditionMinTypMaxUnit
Storage temperature rangeT STG-50-150°C
DC voltage on input supply pins VDDA 1V VDDA-0.3-2.0V
DC voltage on input supply pins VDDB 1V VDDB_DC-0.3-5.5V
Transient voltage on input supply pin VDDB 1V VDDB_TRNt < 30 μs, duty cycle < 0.01%--6.5V
DC voltage connected through inductor to LA2 pin in boost configurations. 1V VBOOST-0.3-5.5V
Voltage on output supply pins: VOA, VOB, VOC, VOA_SWV OUT-0.3-5.5V
DC voltage on VIO supply pinV VIO-0.3-5.5V
DC voltage on any I/O pinV DIGPIN-0.3-V VIO +0.3V
On-chip power dissipation 2P DIS2-layer PCB, THETA JA = 81.2 °C/W, T AMBIENT = 25 °C--923mW
On-chip power dissipation 2P DIS4-layer PCB, THETA JA = 66.0 °C/W, T AMBIENT = 25 °C--1136mW
Operating Junction tempera- tureT J-G grade devices-40-105°C
  1. Note that there is no reverse battery insertion protection implemented on-chip. Applications that may be susceptible to a reverse battery insertion should incorporate external protection circuitry.

  2. Max on-chip power dissipation is given by: P MAX = (100 °C - T AMBIENT ) / THETA JA

EFP0103 Thermal Information

Table 5.2. Thermal Characteristic

ParameterSymbolTest ConditionMinTypMaxUnit
Thermal impedance, junc- tion-to-ambient QFN20 (3x3mm)THETA JA2 layer PCB, Natural Convection 1-81.2-°C/W
Thermal impedance, junc- tion-to-ambient QFN20 (3x3mm)THETA JA4 layer PCB, Natural Convection 1-66.0-°C/W
Thermal impedance, junc- tion-to-board QFN20 (3x3mm)THETA JB2 layer PCB, Natural Convection 1-37.9-°C/W
Thermal impedance, junc- tion-to-board QFN20 (3x3mm)THETA JB4 layer PCB, Natural Convection 1-27-°C/W
Thermal impedance, junc- tion-to-case QFN20 (3x3mm)THETA JC2 layer PCB, Natural Convection 1-46.5-°C/W
Thermal impedance, junc- tion-to-case QFN20 (3x3mm)THETA JC4 layer PCB, Natural Convection 1-34.6-°C/W
Junction-to-top thermal char- acterization parameter QFN20 (3x3mm)PSI JT2 layer PCB, Natural Convection 1-2.6-°C/W
Junction-to-top thermal char- acterization parameter QFN20 (3x3mm)PSI JT4 layer PCB, Natural Convection 1-1.9-°C/W
Junction-to-bottom thermal characterization parameter QFN20 (3x3mm)PSI JB2 layer PCB, Natural Convection 1-39.1-°C/W
Junction-to-bottom thermal characterization parameter QFN20 (3x3mm)PSI JB4 layer PCB, Natural Convection 1-26.7-°C/W
  1. Measured according to JEDEC standard JESD51-2A Integrated Circuit Thermal Test Method Environmental Conditions - Natural Convection (Still Air).

EFP0103 Package Information

Figure 9.1. QFN20 Package Drawing

Table 9.1. QFN20 Package Dimensions

DimensionMinTypMax
A0.800.850.90
A10.000.020.05
A30.20 REF0.20 REF0.20 REF
b0.180.250.30
c0.200.250.30
D3.00 BSC3.00 BSC3.00 BSC
D21.601.701.80
e0.50 BSC0.50 BSC0.50 BSC
E3.00 BSC3.00 BSC3.00 BSC
E21.601.701.80
f2.45 BSC2.45 BSC2.45 BSC
K0.20--
L0.300.400.50
R0.09-0.15
aaa--0.15
bbb--0.10
ccc--0.08
ddd--0.10
eee--0.10
ggg--0.05
Note:Note:Note:Note:

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
EFP0101Silicon LabsQFN-20 3x3mm
EFP0102Silicon LabsQFN-20 3x3mm
EFP0104Silicon LabsQFN-20 3x3mm
EFP0106Silicon LabsQFN-20 3x3mm

Other Power Management

  • MX74610T – MaxLinear, Ideal Diode Controller
  • MAX17048 – Analog Devices, Micropower Current Fuel Gauge
  • WRB0505S-3WR3H – unknown, Isolated DC-DC Converter
  • ADE7953ACPZ-RL – Analog Devices, Single-Phase Energy Metering IC
  • EFP0101 – Silicon Labs, Multi-Output Energy Friendly PMIC
  • EFP0102 – Silicon Labs, Energy Friendly Multi-Output PMIC
  • EFP0104 – Silicon Labs, Energy Friendly PMIC
  • EFP0106 – Silicon Labs, Multi-Output Buck/Boost PMIC

All Power Management datasheetsAll Silicon Labs datasheets (179)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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