EFM32GG11B3XX

EFM32 Giant Gecko Series 1 Family EFM32GG11 Family Data Sheet

The EFM32GG11B3XX is an electronic component from Silicon Labs. EFM32 Giant Gecko Series 1 Family EFM32GG11 Family Data Sheet. View the full EFM32GG11B3XX datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Silicon Labs

Overview

Part: EFM32 Giant Gecko Series 1 Family EFM32GG11 Family

Type: ARM Cortex-M4 MCU

Key Specs:

CPU: ARM Cortex-M4 at 72 MHz
Active Mode Current (EM0): 80 μA/MHz
Deep Sleep Current (EM2): 2.1 μA (RTCC running with state and RAM retention)
Flash Program Memory: Up to 2048 kB
RAM Data Memory: Up to 512 kB
Supply Voltage: 1.8 V to 3.8 V

Features:

Hardware cryptographic engine (AES, ECC, SHA, TRNG)
SD/MMC/SDIO Host Controller
Octal/Quad-SPI memory interface with XIP
10/100 Ethernet MAC with 802.3az EEE, IEEE1588
Dual CAN 2.0 Bus Controller
Crystal-free low-energy USB with Device and Host support
Robust capacitive touch sense
Integrated DC-DC buck converter
Up to 144 General Purpose I/O Pins
Up to 24 Channel DMA Controller
Up to 24 Channel Peripheral Reflex System (PRS)
External Bus Interface with TFT Controller and alpha-blending engine
Hardware CRC engine
Security Management Unit (SMU)
Integrated Low-energy LCD Controller
Backup Power Domain
Ultra Low-Power Precision Analog Peripherals (ADC, VDAC, IDAC, ACMP, OPAMP, CSEN)
Various Timers/Counters (16-bit, 32-bit, RTCC, RTC, CRYOTIMER, Low Energy Timer, Pulse Counter, Watchdog)
Low Energy Sensor Interface (LESENSE)
5 V tolerant I/O on select pins
Pre-Programmed Bootloader

Applications:

Smart energy meters
Industrial and factory automation
Home automation and security
Mid- and high-tier wearables
IoT devices
Battery-powered applications

Package:

QFN64: 9x9 mm
TQFP64: 10x10 mm
TQFP100: 14x14 mm
BGA112: 10x10 mm
BGA120: 7x7 mm
BGA152: 8x8 mm
BGA192: 7x7mm

Electrical Characteristics

All electrical parameters in all tables are specified under the following conditions, unless stated otherwise:

Typical values are based on TAMB=25 °C and VDD= 3.3 V, by production test and/or technology characterization.
Minimum and maximum values represent the worst conditions across supply voltage, process variation, and operating temperature, unless stated otherwise.

Refer to 4.1.2.1 General Operating Conditions for more details about operational supply and temperature limits.

Absolute Maximum Ratings

Stresses above those listed below may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. For more information on the available quality and reliability data, see the Quality and Reliability Monitor Report athttp://www.silabs.com/support/quality/pages/default.aspx.

Table 4.1. Absolute Maximum Ratings
-------------------------------------

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Storage temperature range	TSTG		-50	—	150	°C
Voltage on supply pins other than VREGI and VBUS	VDDMAX		-0.3	—	3.8	V
Voltage ramp rate on any supply pin	VDDRAMPMAX		—	—	1	V / μs
DC voltage on any GPIO pin	VDIGPIN	5V tolerant GPIO pins1 2 3	-0.3	—	Min of 5.25 and IOVDD +2	V
		LCD pins3	-0.3	—	Min of 3.8 and IOVDD +2	V
		Standard GPIO pins	-0.3	—	IOVDD+0.3	V
Total current into VDD power lines	IVDDMAX	Source	—	—	200	mA
Total current into VSS ground lines	IVSSMAX	Sink	—	—	200	mA
Current per I/O pin	IIOMAX	Sink	—	—	50	mA
		Source	—	—	50	mA
Current for all I/O pins	IIOALLMAX	Sink	—	—	200	mA
		Source	—	—	200	mA
Junction temperature	TJ	-G grade devices	-40	—	105	°C
		-I grade devices	-40	—	125	°C
Voltage on regulator supply pins VREGI and VBUS	VVREGI		-0.3	—	5.5	V

Thermal Information

Parameter	Symbol	Test Condition	Min	Typ	Max	Unit
Thermal resistance, QFN64 Package	THETAJA_QFN64	4-Layer PCB, Air velocity = 0 m/s	—	17.8	—	°C/W
		4-Layer PCB, Air velocity = 1 m/s	—	15.4	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	13.8	—	°C/W
Thermal resistance, TQFP64	THE	4-Layer PCB, Air velocity = 0 m/s	—	33.9	—	°C/W
Package	TAJA_TQFP64	4-Layer PCB, Air velocity = 1 m/s	—	32.1	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	30.1	—	°C/W
Thermal resistance,	THE TAJA_TQFP100	4-Layer PCB, Air velocity = 0 m/s	—	44.1	—	°C/W
TQFP100 Package		4-Layer PCB, Air velocity = 1 m/s	—	37.7	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	35.5	—	°C/W
Thermal resistance, BGA112 Package	THE TAJA_BGA112	4-Layer PCB, Air velocity = 0 m/s	—	42.0	—	°C/W
		4-Layer PCB, Air velocity = 1 m/s	—	37.0	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	35.3	—	°C/W
Thermal resistance, BGA120 Package	THE TAJA_BGA120	4-Layer PCB, Air velocity = 0 m/s	—	47.9	—	°C/W
		4-Layer PCB, Air velocity = 1 m/s	—	41.8	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	39.6	—	°C/W
Thermal resistance, BGA152 Package	THE TAJA_BGA152	4-Layer PCB, Air velocity = 0 m/s	—	35.7	—	°C/W
		4-Layer PCB, Air velocity = 1 m/s	—	31.0	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	29.5	—	°C/W
Thermal resistance, BGA192	THE TAJA_BGA192	4-Layer PCB, Air velocity = 0 m/s	—	47.9	—	°C/W
Package		4-Layer PCB, Air velocity = 1 m/s	—	41.8	—	°C/W
		4-Layer PCB, Air velocity = 2 m/s	—	39.6	—	°C/W

Package Information

Figure 6.1. BGA192 Package Drawing

Dimension	Min	Typ	Max
A	0.77	0.83	0.89
A1	0.13	0.18	0.23
A3	0.16	0.20	0.24
A2		0.45 REF
D		7.00 BSC
e	0.40 BSC
E	7.00 BSC
D1		6.00 BSC
E1		6.00 BSC
b	0.20	0.25	0.30
aaa		0.10
bbb		0.10
ddd	0.08
eee		0.15
fff		0.05

Related Variants

The following components are covered by the same datasheet.

Part Number	Manufacturer	Package
EFM32	Silicon Labs	—
EFM32GG11	Silicon Labs	QFN64 (9x9 mm)
EFM32GG11B1XX	Silicon Labs	—
EFM32GG11B4XX	Silicon Labs	—
EFM32GG11B5XX	Silicon Labs	—
EFM32GG11B8XX	Silicon Labs	—

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