CC2652P7
Multiprotocol 2.4 GHz Wireless MCUThe CC2652P7 is a multiprotocol 2.4 ghz wireless mcu from Texas Instruments. View the full CC2652P7 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Category
RF / WirelessOverview
Part: Texas Instruments CC2652R
Type: Multiprotocol 2.4 GHz Wireless MCU
Description: The SimpleLink™ CC2652R is a multiprotocol 2.4 GHz wireless microcontroller (MCU) featuring a 48 MHz Arm Cortex-M4F processor, 352 kB of in-system programmable flash, 80 kB of ultra-low leakage SRAM, and supporting Bluetooth 5.2 Low Energy, Thread, and Zigbee protocols.
Operating Conditions:
- Supply voltage: 1.8 V to 3.8 V
- Operating temperature: -40 to +125 °C
- CPU clock frequency: 48 MHz
- RF frequency: 2.4 GHz
Absolute Maximum Ratings:
- Max supply voltage: 4.1 V
- Max continuous current: null
- Max junction/storage temperature: +150 °C
Key Specs:
- CPU: 48 MHz Arm Cortex-M4F processor
- Flash memory: 352 kB in-system programmable
- SRAM: 80 kB ultra-low leakage (plus 8 kB cache)
- Active mode RX current: 6.9 mA
- Active mode TX current: 7.0 mA (0 dBm), 9.2 mA (5 dBm)
- Standby current: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
- ADC: 12-bit, 200 kSamples/s, 8 channels
- Receiver sensitivity: -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
Features:
- Powerful 48 MHz Arm Cortex-M4F processor
- Ultra-low power sensor controller with 4 kB of SRAM
- Multiprotocol 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and IEEE 802.15.4
- Integrated AES 128/256-bit, ECC, RSA, SHA2 cryptographic accelerators
- On-chip buck DC/DC converter
- Capacitive sensing, up to 8 channels
Applications:
- Building automation (security systems, HVAC, fire safety)
- Grid infrastructure (smart meters, long-range sensor applications)
- Medical
- Personal electronics (portable electronics, home theater & entertainment, connected peripherals)
- Factory automation and control
Package:
- VQFN48 (7 mm × 7 mm)
Features
- Microcontroller
- -Powerful 48 MHz Arm ® Cortex ® -M4F processor
- -EEMBC CoreMark ® score: 148
- -352 kB of in-system programmable flash
- -256 kB of ROM for protocols and library functions
- -8 kB of cache SRAM (alternatively available as general-purpose RAM)
- -80 kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
- -2-pin cJTAG and JTAG debugging
- -Supports over-the-air (OTA) update
- Ultra-low power sensor controller with 4 kB of SRAM
- -Sample, store, and process sensor data
- -Operation independent from system CPU
- -Fast wake-up for low-power operation
- TI-RTOS, drivers, bootloader, Bluetooth ® 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
- RoHS-compliant package
- -7 mm × 7 mm RGZ VQFN48 (31 GPIOs)
- Peripherals
- -Digital peripherals can be routed to any GPIO
- -4× 32-bit or 8× 16-bit general-purpose timers
- -12-bit ADC, 200 kSamples/s, 8 channels
- -2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
- -Programmable current source
- -2× UART
- -2× SSI (SPI, MICROWIRE, TI)
- -I 2 C and I 2 S
- -Real-time clock (RTC)
- -AES 128- and 256-bit cryptographic accelerator
- -ECC and RSA public key hardware accelerator
- -SHA2 accelerator (full suite up to SHA-512)
- -True random number generator (TRNG)
- -Capacitive sensing, up to 8 channels
- -Integrated temperature and battery monitor
- External system
- -On-chip buck DC/DC converter
- Low power
- -Active mode RX: 6.9 mA
- -Active mode TX 0 dBm: 7.0 mA
- -Active mode TX 5 dBm: 9.2 mA
- -Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
- -Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 μA
- -Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
- -Standby: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
- -Shutdown: 150 nA (wakeup on external events)
- Radio section
- -2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
- -3-wire, 2-wire, 1-wire PTA coexistence mechanisms
- -Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
- -Output power up to +5 dBm with temperature compensation
- -Suitable for systems targeting compliance with worldwide radio frequency regulations
- EN 300 328, (Europe)
- EN 300 440 Category 2
- FCC CFR47 Part 15
- ARIB STD-T66 (Japan)
- Wireless protocols
- -Thread, Zigbee ® , Bluetooth ® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink ™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
- Development Tools and Software
- -CC26x2R LaunchPad™ Development Kit
- -SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
- -SmartRF ™ Studio for simple radio configuration
- -Sensor Controller Studio for building low-power sensing applications
Applications
- 2400 to 2480 MHz ISM and SRD systems 1 with down to 4 kHz of receive bandwidth
- Building automation
- -Building security systems - motion detector, electronic smart lock, door and window sensor, garage door system, gateway
- -HVAC - thermostat, wireless environmental sensor, HVAC system controller, gateway
- -Fire safety system - smoke and heat detector, fire alarm control panel (FACP)
- -Video surveillance - IP network camera
- -Elevators and escalators - elevator main control panel for elevators and escalators
- Grid infrastructure
- -Smart meters - water meter, gas meter, electricity meter, and heat cost allocators
- -Grid communications - wireless communications - Long-range sensor applications
Electrical Characteristics
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|
| T A = 25 °C, V DDS = 1.8 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 1.56 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.24 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 1.59 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.21 | V | ||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 73 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 19 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.08 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 0.73 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.35 | V | ||
| T A = 25 °C, V DDS = 3.0 V | |||||
| GPIO VOH at 8 mA load | IOCURR = 2, high-drive GPIOs only | 2.59 | V | ||
| GPIO VOL at 8 mA load | IOCURR = 2, high-drive GPIOs only | 0.42 | V | ||
| GPIO VOH at 4 mA load | IOCURR = 1 | 2.63 | V | ||
| GPIO VOL at 4 mA load | IOCURR = 1 | 0.4 | V | ||
| T A = 25 °C, V DDS = 3.8 V | |||||
| GPIO pullup current | Input mode, pullup enabled, Vpad = 0 V | 282 | μA | ||
| GPIO pulldown current | Input mode, pulldown enabled, Vpad = VDDS | 110 | μA | ||
| GPIO low-to-high input transition, with hysteresis | IH = 1, transition voltage for input read as0→1 | 1.97 | V | ||
| GPIO high-to-low input transition, with hysteresis | IH = 1, transition voltage for input read as1→0 | 1.55 | V | ||
| GPIO input hysteresis | IH = 1, difference between0→1 and 1 →0points | 0.42 | V | ||
| T A = 25 °C | |||||
| VIH | Lowest GPIO input voltage reliably interpreted as a High | 0.8*V DDS | V | ||
| VIL | Highest GPIO input voltage reliably interpreted as a Low | 0.2*V DDS | V |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VDDS (3) | Supply voltage | Supply voltage | -0.3 | 4.1 | V |
| Voltage on any digital pin (4) (5) | Voltage on any digital pin (4) (5) | -0.3 | VDDS + 0.3, max 4.1 | V | |
| Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P | -0.3 | VDDR + 0.3, max 2.25 | V | |
| V in | Voltage on ADC input | Voltage scaling enabled | -0.3 | VDDS | V |
| Voltage scaling disabled, internal reference | -0.3 | 1.49 | V | ||
| Voltage scaling disabled, VDDS as reference | -0.3 | VDDS / 2.9 | V | ||
| Input level, RF pins | Input level, RF pins | 5 | dBm | ||
| T stg | Storage temperature | Storage temperature | -40 | 150 | °C |
- (2) All voltage values are with respect to ground, unless otherwise noted.
- (3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
- (4) Including analog capable DIOs.
- (5) Injection current is not supported on any GPIO pin
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | |
|---|---|---|---|
| Operating junction temperature (2) | -40 | 105 | °C |
| Operating supply voltage (VDDS) | 1.8 | 3.8 | V |
| Rising supply voltage slew rate | 0 | 100 | mV/μs |
| Falling supply voltage slew rate (1) | 0 | 20 | mV/μs |
Thermal Information
| THERMAL METRIC (1) | PACKAGE RGZ (VQFN) | UNIT | |
|---|---|---|---|
| 48 PINS | |||
| R θJA | Junction-to-ambient thermal resistance | 23.4 | °C/W (2) |
| R θJC(top) | Junction-to-case (top) thermal resistance | 13.3 | °C/W (2) |
| R θJB | Junction-to-board thermal resistance | 8.0 | °C/W (2) |
| ψ JT | Junction-to-top characterization parameter | 0.1 | °C/W (2) |
| ψ JB | Junction-to-board characterization parameter | 7.9 | °C/W (2) |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | 1.7 | °C/W (2) |
- (2) °C/W = degrees Celsius per watt.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CC2652 | Texas Instruments | — |
| CC2652P | Texas Instruments | — |
| CC2652R | Texas Instruments | — |
| CC2652R1FRGZ | Texas Instruments | — |
| CC2652R1FRGZR | Texas Instruments | — |
| CC2652R1FRGZT | Texas Instruments | — |
| CC2652R7 | Texas Instruments | — |
| CC2652RB | Texas Instruments | — |
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