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CC2652P7

Multiprotocol 2.4 GHz Wireless MCU

The CC2652P7 is a multiprotocol 2.4 ghz wireless mcu from Texas Instruments. View the full CC2652P7 datasheet below including electrical characteristics, absolute maximum ratings.

Manufacturer

Texas Instruments

Overview

Part: Texas Instruments CC2652R

Type: Multiprotocol 2.4 GHz Wireless MCU

Description: The SimpleLink™ CC2652R is a multiprotocol 2.4 GHz wireless microcontroller (MCU) featuring a 48 MHz Arm Cortex-M4F processor, 352 kB of in-system programmable flash, 80 kB of ultra-low leakage SRAM, and supporting Bluetooth 5.2 Low Energy, Thread, and Zigbee protocols.

Operating Conditions:

  • Supply voltage: 1.8 V to 3.8 V
  • Operating temperature: -40 to +125 °C
  • CPU clock frequency: 48 MHz
  • RF frequency: 2.4 GHz

Absolute Maximum Ratings:

  • Max supply voltage: 4.1 V
  • Max continuous current: null
  • Max junction/storage temperature: +150 °C

Key Specs:

  • CPU: 48 MHz Arm Cortex-M4F processor
  • Flash memory: 352 kB in-system programmable
  • SRAM: 80 kB ultra-low leakage (plus 8 kB cache)
  • Active mode RX current: 6.9 mA
  • Active mode TX current: 7.0 mA (0 dBm), 9.2 mA (5 dBm)
  • Standby current: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
  • ADC: 12-bit, 200 kSamples/s, 8 channels
  • Receiver sensitivity: -105 dBm for Bluetooth 125 kbps (LE Coded PHY)

Features:

  • Powerful 48 MHz Arm Cortex-M4F processor
  • Ultra-low power sensor controller with 4 kB of SRAM
  • Multiprotocol 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and IEEE 802.15.4
  • Integrated AES 128/256-bit, ECC, RSA, SHA2 cryptographic accelerators
  • On-chip buck DC/DC converter
  • Capacitive sensing, up to 8 channels

Applications:

  • Building automation (security systems, HVAC, fire safety)
  • Grid infrastructure (smart meters, long-range sensor applications)
  • Medical
  • Personal electronics (portable electronics, home theater & entertainment, connected peripherals)
  • Factory automation and control

Package:

  • VQFN48 (7 mm × 7 mm)

Features

  • Microcontroller
  • -Powerful 48 MHz Arm ® Cortex ® -M4F processor
  • -EEMBC CoreMark ® score: 148
  • -352 kB of in-system programmable flash
  • -256 kB of ROM for protocols and library functions
  • -8 kB of cache SRAM (alternatively available as general-purpose RAM)
  • -80 kB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
  • -2-pin cJTAG and JTAG debugging
  • -Supports over-the-air (OTA) update
  • Ultra-low power sensor controller with 4 kB of SRAM
  • -Sample, store, and process sensor data
  • -Operation independent from system CPU
  • -Fast wake-up for low-power operation
  • TI-RTOS, drivers, bootloader, Bluetooth ® 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
  • RoHS-compliant package
  • -7 mm × 7 mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
  • -Digital peripherals can be routed to any GPIO
  • -4× 32-bit or 8× 16-bit general-purpose timers
  • -12-bit ADC, 200 kSamples/s, 8 channels
  • -2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
  • -Programmable current source
  • -2× UART
  • -2× SSI (SPI, MICROWIRE, TI)
  • -I 2 C and I 2 S
  • -Real-time clock (RTC)
  • -AES 128- and 256-bit cryptographic accelerator
  • -ECC and RSA public key hardware accelerator
  • -SHA2 accelerator (full suite up to SHA-512)
  • -True random number generator (TRNG)
  • -Capacitive sensing, up to 8 channels
  • -Integrated temperature and battery monitor
  • External system
  • -On-chip buck DC/DC converter
  • Low power
  • -Active mode RX: 6.9 mA
  • -Active mode TX 0 dBm: 7.0 mA
  • -Active mode TX 5 dBm: 9.2 mA
  • -Active mode MCU 48 MHz (CoreMark): 3.4 mA (71 μA/MHz)
  • -Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 μA
  • -Sensor controller, active mode, 24 MHz, running infinite loop: 808 μA
  • -Standby: 0.94 μA (RTC on, 80 kB RAM and CPU retention)
  • -Shutdown: 150 nA (wakeup on external events)
  • Radio section
  • -2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications and IEEE 802.15.4 PHY and MAC
  • -3-wire, 2-wire, 1-wire PTA coexistence mechanisms
  • -Excellent receiver sensitivity: -100 dBm for 802.15.4 (2.4 GHz), -105 dBm for Bluetooth 125 kbps (LE Coded PHY)
  • -Output power up to +5 dBm with temperature compensation
  • -Suitable for systems targeting compliance with worldwide radio frequency regulations
  • EN 300 328, (Europe)
  • EN 300 440 Category 2
  • FCC CFR47 Part 15
  • ARIB STD-T66 (Japan)
  • Wireless protocols
  • -Thread, Zigbee ® , Bluetooth ® 5.2 Low Energy, IEEE 802.15.4, IPv6-enabled smart objects (6LoWPAN), proprietary systems, SimpleLink ™ TI 15.4 stack (2.4 GHz), and dynamic multiprotocol manager (DMM) driver.
  • Development Tools and Software
  • -CC26x2R LaunchPad™ Development Kit
  • -SimpleLink™ LOWPOWER F2 Software Development Kit (SDK)
  • -SmartRF ™ Studio for simple radio configuration
  • -Sensor Controller Studio for building low-power sensing applications

Applications

  • 2400 to 2480 MHz ISM and SRD systems 1 with down to 4 kHz of receive bandwidth
  • Building automation
  • -Building security systems - motion detector, electronic smart lock, door and window sensor, garage door system, gateway
  • -HVAC - thermostat, wireless environmental sensor, HVAC system controller, gateway
  • -Fire safety system - smoke and heat detector, fire alarm control panel (FACP)
  • -Video surveillance - IP network camera
  • -Elevators and escalators - elevator main control panel for elevators and escalators
  • Grid infrastructure
  • -Smart meters - water meter, gas meter, electricity meter, and heat cost allocators
  • -Grid communications - wireless communications - Long-range sensor applications

Electrical Characteristics

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
T A = 25 °C, V DDS = 1.8 V
GPIO VOH at 8 mA loadIOCURR = 2, high-drive GPIOs only1.56V
GPIO VOL at 8 mA loadIOCURR = 2, high-drive GPIOs only0.24V
GPIO VOH at 4 mA loadIOCURR = 11.59V
GPIO VOL at 4 mA loadIOCURR = 10.21V
GPIO pullup currentInput mode, pullup enabled, Vpad = 0 V73μA
GPIO pulldown currentInput mode, pulldown enabled, Vpad = VDDS19μA
GPIO low-to-high input transition, with hysteresisIH = 1, transition voltage for input read as0→11.08V
GPIO high-to-low input transition, with hysteresisIH = 1, transition voltage for input read as1→00.73V
GPIO input hysteresisIH = 1, difference between0→1 and 1 →0points0.35V
T A = 25 °C, V DDS = 3.0 V
GPIO VOH at 8 mA loadIOCURR = 2, high-drive GPIOs only2.59V
GPIO VOL at 8 mA loadIOCURR = 2, high-drive GPIOs only0.42V
GPIO VOH at 4 mA loadIOCURR = 12.63V
GPIO VOL at 4 mA loadIOCURR = 10.4V
T A = 25 °C, V DDS = 3.8 V
GPIO pullup currentInput mode, pullup enabled, Vpad = 0 V282μA
GPIO pulldown currentInput mode, pulldown enabled, Vpad = VDDS110μA
GPIO low-to-high input transition, with hysteresisIH = 1, transition voltage for input read as0→11.97V
GPIO high-to-low input transition, with hysteresisIH = 1, transition voltage for input read as1→01.55V
GPIO input hysteresisIH = 1, difference between0→1 and 1 →0points0.42V
T A = 25 °C
VIHLowest GPIO input voltage reliably interpreted as a High0.8*V DDSV
VILHighest GPIO input voltage reliably interpreted as a Low0.2*V DDSV

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1) (2)

MINMAXUNIT
VDDS (3)Supply voltageSupply voltage-0.34.1V
Voltage on any digital pin (4) (5)Voltage on any digital pin (4) (5)-0.3VDDS + 0.3, max 4.1V
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_PVoltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X48M_N and X48M_P-0.3VDDR + 0.3, max 2.25V
V inVoltage on ADC inputVoltage scaling enabled-0.3VDDSV
Voltage scaling disabled, internal reference-0.31.49V
Voltage scaling disabled, VDDS as reference-0.3VDDS / 2.9V
Input level, RF pinsInput level, RF pins5dBm
T stgStorage temperatureStorage temperature-40150°C
  • (2) All voltage values are with respect to ground, unless otherwise noted.
  • (3) VDDS_DCDC, VDDS2 and VDDS3 must be at the same potential as VDDS.
  • (4) Including analog capable DIOs.
  • (5) Injection current is not supported on any GPIO pin

Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MINMAXUNIT
Operating junction temperature (2)-40105°C
Operating supply voltage (VDDS)1.83.8V
Rising supply voltage slew rate0100mV/μs
Falling supply voltage slew rate (1)020mV/μs

Thermal Information

THERMAL METRIC (1)PACKAGE RGZ (VQFN)UNIT
48 PINS
R θJAJunction-to-ambient thermal resistance23.4°C/W (2)
R θJC(top)Junction-to-case (top) thermal resistance13.3°C/W (2)
R θJBJunction-to-board thermal resistance8.0°C/W (2)
ψ JTJunction-to-top characterization parameter0.1°C/W (2)
ψ JBJunction-to-board characterization parameter7.9°C/W (2)
R θJC(bot)Junction-to-case (bottom) thermal resistance1.7°C/W (2)
  • (2) °C/W = degrees Celsius per watt.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
CC2652Texas Instruments
CC2652PTexas Instruments
CC2652RTexas Instruments
CC2652R1FRGZTexas Instruments
CC2652R1FRGZRTexas Instruments
CC2652R1FRGZTTexas Instruments
CC2652R7Texas Instruments
CC2652RBTexas Instruments
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