CC1310F128RHB
Ultra-Low-Power Sub-1 GHz Wireless MCUThe CC1310F128RHB is a ultra-low-power sub-1 ghz wireless mcu from Texas Instruments. View the full CC1310F128RHB datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Category
Ultra-Low-Power Sub-1 GHz Wireless MCU
Package
VQFN32 (5 mm × 5 mm)
Overview
Part: CC1310 — Texas Instruments Type: Ultra-Low-Power Sub-1 GHz Wireless MCU
Description: The CC1310 is a cost-effective, ultra-low-power Sub-1 GHz RF device from Texas Instruments, featuring a 48-MHz Arm Cortex-M3 microcontroller, up to 128 KB of Flash, 20 KB of SRAM, and a dedicated ultra-low-power sensor controller, designed for long-range operation on small coin-cell batteries.
Operating Conditions:
- Supply voltage: 1.8 to 3.8 V
- Operating temperature: -40 to +125 °C
- Max clock speed: 48 MHz
Absolute Maximum Ratings:
- Max supply voltage: 4.1 V
- Max junction/storage temperature: 150 °C
Key Specs:
- CoreMark Score: 142
- ULPBench Score: 158
- Flash Memory: 32KB, 64KB, 128KB
- SRAM: 20KB (ultra-low-leakage) + 8KB (for cache/GP RAM)
- RX Current: 5.4 mA
- TX Current (+10 dBm): 13.4 mA
- Active-Mode MCU Current (48 MHz): 2.5 mA (51 μA/MHz)
- Standby Current: 0.7 μA (RTC Running, RAM and CPU Retention)
- Shutdown Current: 185 nA (Wakeup on External Events)
- Receiver Sensitivity: -124 dBm (Long-Range Mode), -110 dBm (50 kbps)
- Programmable Output Power: up to +15 dBm
- ADC: 12-Bit, 200 ksamples/s, 8-Channel Analog MUX
Features:
- Powerful Arm Cortex-M3 Processor
- Ultra-Low-Power Sensor Controller (16-bit architecture, 2KB SRAM)
- Efficient Code-Size Architecture (TI-RTOS, Drivers, Bootloader in ROM)
- On-Chip Internal DC/DC Converter
- AES-128 Security Module and True Random Number Generator (TRNG)
- Support for Eight Capacitive Sensing Buttons
- Integrated Temperature Sensor
- UART, 2x SSI (SPI, MICROWIRE, TI), I2C, I2S, Real-Time Clock (RTC)
Applications:
- 315-, 433-, 470-, 500-, 779-, 868-, 915-, 920-MHz ISM and SRD Systems
- Low-Power Wireless Systems With 50-kHz to 5-MHz Channel Spacing
- Home and Building Automation
- Wireless Alarm and Security Systems
- Industrial Monitoring and Control
- Smart Grid and Automatic Meter Reading
- Wireless Healthcare Applications
- Wireless Sensor Networks
- Active RFID
- IEEE 802.15.4g, IP-Enabled Smart Objects (6LoWPAN), Wireless M-Bus, KNX Systems, Wi-SUN™, and Proprietary Systems
- Energy-Harvesting Applications
- Electronic Shelf Label (ESL)
- Long-Range Sensor Applications
- Heat-Cost Allocators
Package:
- VQFN48 (7-mm × 7-mm RGZ)
- VQFN32 (5-mm × 5-mm RHB)
- VQFN32 (4-mm × 4-mm RSM)
Features
1
- Microcontroller
- -Powerful Arm ® Cortex ® -M3 Processor
- -EEMBC CoreMark ® Score: 142
- -EEMBC ULPBench™ Score: 158
- -Clock Speed up to 48-MHz
- -32KB, 64KB, and 128KB of In-System Programmable Flash
- -8KB of SRAM for Cache (or as General-Purpose RAM)
- -20KB of Ultra-Low-Leakage SRAM
- -2-Pin cJTAG and JTAG Debugging
- -Supports Over-the-Air (OTA) Update
- Ultra-Low-Power Sensor Controller
- -Can Run Autonomously From the Rest of the System
- -16-Bit Architecture
- -2KB of Ultra-Low-Leakage SRAM for Code and Data
- Efficient Code-Size Architecture, Placing Parts of TI-RTOS, Drivers, and Bootloader in ROM
- RoHS-Compliant Package
- -7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
- -5-mm × 5-mm RHB VQFN32 (15 GPIOs)
- -4-mm × 4-mm RSM VQFN32 (10 GPIOs)
- Peripherals
- -All Digital Peripheral Pins Can Be Routed to Any GPIO
- -Four General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
- -12-Bit ADC, 200 ksamples/s, 8-Channel Analog MUX
- -Continuous Time Comparator
- -Ultra-Low-Power Clocked Comparator
- -Programmable Current Source
- UART
- -2× SSI (SPI, MICROWIRE, TI)
- -I 2 C, I2S
- -Real-Time Clock (RTC)
- -AES-128 Security Module
- -True Random Number Generator (TRNG)
- -Support for Eight Capacitive Sensing Buttons
- -Integrated Temperature Sensor
SPACER
SPACER
SPACER
Technical
Documents
SPACER
- External System
- -On-Chip Internal DC/DC Converter
- -Seamless Integration With the SimpleLink™ CC1190 Range Extender
- Low Power
- -Wide Supply Voltage Range: 1.8 to 3.8 V
- -RX: 5.4 mA
- -TX at +10 dBm: 13.4 mA
- -Active-Mode MCU 48 MHz Running Coremark: 2.5 mA (51 μA/MHz)
- -Active-Mode MCU: 48.5 CoreMark/mA
- -Active-Mode Sensor Controller at 24 MHz: 0.4 mA + 8.2 μA/MHz
- -Sensor Controller, One Wakeup Every Second Performing One 12-Bit ADC Sampling: 0.95 μA
- -Standby: 0.7 μA (RTC Running and RAM and CPU Retention)
- -Shutdown: 185 nA (Wakeup on External Events)
- RF Section
- -Excellent Receiver Sensitivity -124 dBm Using Long-Range Mode, -110 dBm at 50 kbps
- -Excellent Selectivity (±100 kHz): 56 dB
- -Excellent Blocking Performance (±10 MHz): 90 dB
- -Programmable Output Power up to +15 dBm
- -Single-Ended or Differential RF Interface
- -Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
- -ETSI EN 300 220, EN 303 204 (Europe)
- -FCC CFR47 Part 15 (US)
- -ARIB STD-T108 (Japan)
- -Wireless M-Bus (EN 13757-4) and IEEE ® 802.15.4g PHY
- Tools and Development Environment
- -Full-Feature and Low-Cost Development Kits
- -Multiple Reference Designs for Different RF Configurations
- -Packet Sniffer PC Software
- -Sensor Controller Studio
- -SmartRF™ Studio
- -SmartRF Flash Programmer 2
- -IAR Embedded Workbench ® for Arm
- -Code Composer Studio™ (CCS) IDE
- -CCS UniFlash
Applications
- 315-, 433-, 470-, 500-, 779-, 868-, 915-, 920-MHz ISM and SRD Systems
- Low-Power Wireless Systems With 50-kHz to 5-MHz Channel Spacing
- Home and Building Automation
- Wireless Alarm and Security Systems
- Industrial Monitoring and Control
- Smart Grid and Automatic Meter Reading
- Wireless Healthcare Applications
Electrical Characteristics
Tc = 25°C, VDDS = 3.0 V, DC/DC disabled. Input voltage scaling enabled, unless otherwise noted. (1)
| PARAMETER | PARAMETER | TEST CONDITIONS | MIN TYP | MAX | UNIT |
|---|---|---|---|---|---|
| Input voltage range | 0 | V DDS | V | ||
| Resolution | 12 | Bits | |||
| Sample rate | 200 | ksamples/s | |||
| Offset | Internal 4.3-V equivalent reference (2) | 2.1 | LSB | ||
| Gain error | Internal 4.3-V equivalent reference (2) | -0.14 | LSB | ||
| DNL (3) | Differential nonlinearity | >-1 | LSB | ||
| INL (4) | Integral nonlinearity | ±2 | LSB |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)(2)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply voltage (VDDS, VDDS2, and VDDS3) | Supply voltage (VDDS, VDDS2, and VDDS3) | -0.3 | 4.1 | V |
| Voltage on any digital pin (3)(4) | Voltage on any digital pin (3)(4) | -0.3 | VDDSn + 0.3, max 4.1 | V |
| Voltage on crystal oscillator pins X32K_Q1, X32K_Q2, X24M_N, and X24M_P | Voltage on crystal oscillator pins X32K_Q1, X32K_Q2, X24M_N, and X24M_P | -0.3 | VDDR + 0.3, max 2.25 | V |
| Voltage on ADC | Voltage scaling enabled | -0.3 | VDDS | |
| Voltage on ADC | Voltage scaling disabled, internal reference | -0.3 | 1.49 | V |
| Voltage on ADC | Voltage scaling disabled, VDDS as reference | -0.3 | VDDS / 2.9 | |
| Input RF level | Input RF level | 10 | dBm | |
| Storage temperature (T stg ) | Storage temperature (T stg ) | -40 | 150 | °C |
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| Ambient temperature | Ambient temperature | Ambient temperature | -40 | 85 | °C |
| Operating supply voltage (VDDS) | Operating supply | 1.8 | 3.8 | V | |
| voltages (VDDS2 and VDDS3) | VDDS < 2.7 V | 1.8 | 3.8 | V | |
| Operating supply voltages (VDDS2 and VDDS3) | VDDS ≥ 2.7 V | 1.9 | 3.8 | V | |
| Rising supply voltage slew rate | Rising supply voltage slew rate | Rising supply voltage slew rate | 0 | 100 | mV/μs |
| Falling supply voltage slew rate | Falling supply voltage slew rate | Falling supply voltage slew rate | 0 | 20 | mV/μs |
| Falling supply voltage slew rate, with low-power flash setting (1) | Falling supply voltage slew rate, with low-power flash setting (1) | Falling supply voltage slew rate, with low-power flash setting (1) | 3 | mV/μs | |
| Positive temperature gradient in standby (2) | No limitation for negative temperature gradient, or outside standby mode | No limitation for negative temperature gradient, or outside standby mode | 5 | °C/s |
Thermal Information
| CC1310 | CC1310 | CC1310 | ||
|---|---|---|---|---|
| THERMAL METRIC (1) | THERMAL METRIC (1) | RSM (VQFN) | RHB (VQFN) | RGZ (VQFN) |
| 32 PINS | 32 PINS | 48 PINS | ||
| R θ JA | Junction-to-ambient thermal resistance | 36.9 | 32.8 | 29.6 |
| R θ JC(top) | Junction-to-case (top) thermal resistance | 30.3 | 24.0 | 15.7 |
| R θ JB | Junction-to-board thermal resistance | 7.6 | 6.8 | 6.2 |
| ψ JT | Junction-to-top characterization parameter | 0.4 | 0.3 | 0.3 |
| ψ JB | Junction-to-board characterization parameter | 7.4 | 6.8 | 6.2 |
| R θ JC(bot) | Junction-to-case (bottom) thermal resistance | 2.1 | 1.9 | 1.9 |
Typical Application
Few external components are required for the operation of the CC1310 device. Figure 7-1 shows a typical application circuit.
The board layout greatly influences the RF performance of the CC1310 device.
On the Texas Instruments CC1310EM-7XD-7793 reference design, the optimal differential impedance seen from the RF pins into the balun and filter and antenna is 44 + j15.
Figure 7-1 does not show decoupling capacitors for power pins. For a complete reference design, see the product folder on www.ti.com.
Figure 7-1. CC1310 Application Circuits
Package Information
PLASTIC QUAD FLATPACK - NO LEAD
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| CC1310 | Texas Instruments | — |
| CC1310F128RGZ | Texas Instruments | VQFN48 (7 mm × 7 mm) |
| CC1310F128RGZR | Texas Instruments | VQFN48 (7.00 mm × 7.00 mm) |
| CC1310F128RGZT | Texas Instruments | — |
| CC1310F128RHBR | Texas Instruments | — |
| CC1310F128RHBT | Texas Instruments | — |
| CC1310F128RSM | Texas Instruments | VQFN32 (4 mm × 4 mm) |
| CC1310F128RSMR | Texas Instruments | — |
| CC1310F128RSMT | Texas Instruments | — |
| CC1310F32RGZ | Texas Instruments | VQFN48 (7 mm × 7 mm) |
| CC1310F32RHB | Texas Instruments | VQFN32 (5 mm × 5 mm) |
| CC1310F32RSM | Texas Instruments | VQFN32 (4 mm × 4 mm) |
| CC1310F64RGZ | Texas Instruments | VQFN48 (7 mm × 7 mm) |
| CC1310F64RHB | Texas Instruments | VQFN32 (5 mm × 5 mm) |
| CC1310F64RSM | Texas Instruments | VQFN32 (4 mm × 4 mm) |
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