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CC1310F128RGZ

Ultra-Low-Power Sub-1 GHz Wireless MCU

The CC1310F128RGZ is a ultra-low-power sub-1 ghz wireless mcu from Texas Instruments. View the full CC1310F128RGZ datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

Official CC1310F128RGZ datasheet (PDF) — the source this page was extracted from.

Manufacturer

Texas Instruments

Package

VQFN-48 7x7mm

CC1310F128RGZ Key Specifications

ParameterValue
ADC12-bit, 200 ksamples/s, 8-channel
CPUArm Cortex-M3 up to 48 MHz
SRAM20KB ultra-low-leakage + 8KB cache/GP RAM
GPIOs30
SecurityAES-128, TRNG
RX Current5.4 mA
Flash Memory128KB
Supply Voltage1.8V to 3.8V
Frequency Bands315/433/470/500/779/868/915/920 MHz ISM/SRD
Standby Current0.7 μA
Max Output Power+15 dBm
Shutdown Current185 nA
Active MCU Current2.5 mA (51 μA/MHz)
Package Dimensions7.00 mm × 7.00 mm
Receiver Sensitivity-124 dBm (long-range mode), -110 dBm at 50 kbps
TX Current At +10 DBm13.4 mA
Sensor Controller SRAM2KB
Communication InterfacesUART, 2x SSI (SPI), I2C, I2S

CC1310F128RGZ Overview

Part: CC1310F128RGZR — Texas Instruments

Type: Sub-1 GHz Wireless MCU (Arm Cortex-M3 with integrated RF transceiver)

Description: SimpleLink ultra-low-power Sub-1 GHz wireless MCU with a 48 MHz Arm Cortex-M3, 128 KB flash, 20 KB ultra-low-leakage SRAM, 1.8–3.8 V supply, and RF output up to +15 dBm in a 7 mm × 7 mm VQFN48 package.

Operating Conditions:

  • Supply voltage (VDDS): 1.8–3.8 V
  • Ambient temperature: -40 to 85 °C
  • Max clock speed: 48 MHz
  • VDDS2/VDDS3: 1.8–3.8 V when VDDS < 2.7 V; 1.9–3.8 V when VDDS ≥ 2.7 V

Absolute Maximum Ratings:

  • Max supply voltage (VDDS, VDDS2, VDDS3): 4.1 V
  • Voltage on any digital pin: VDDSn + 0.3 V, max 4.1 V
  • Voltage on crystal oscillator pins: VDDR + 0.3 V, max 2.25 V
  • Input RF level: 10 dBm
  • Storage temperature: -40 to 150 °C

Key Specs:

  • RX current: 5.4 mA
  • TX current at +10 dBm: 13.4 mA
  • Active-mode MCU at 48 MHz running CoreMark: 2.5 mA (51 μA/MHz)
  • Standby current: 0.7 μA (RTC running, RAM and CPU retention)
  • Shutdown current: 185 nA (wakeup on external events)
  • Receiver sensitivity: -124 dBm in long-range mode, -110 dBm at 50 kbps
  • Selectivity (±100 kHz): 56 dB; blocking (±10 MHz): 90 dB
  • Programmable output power: up to +15 dBm
  • ADC: 12-bit, 200 ksamples/s, 8-channel analog MUX
  • CoreMark score: 142

Features:

  • Arm Cortex-M3 main CPU with 8 KB cache SRAM (or general-purpose RAM)
  • Autonomous 16-bit ultra-low-power sensor controller with 2 KB SRAM
  • Radio Controller (Cortex-M0) handling RF protocol commands
  • On-chip DC/DC converter
  • Any digital peripheral pin can be routed to any GPIO (30 GPIOs in RGZ)
  • Four general-purpose timer modules (eight 16-bit or four 32-bit)
  • UART, 2× SSI (SPI, MICROWIRE, TI), I2C, I2S
  • Continuous-time comparator, ultra-low-power clocked comparator, programmable current source
  • AES-128 security module and true random number generator
  • Capacitive sensing support for eight buttons
  • Integrated temperature sensor
  • cJTAG and JTAG debugging; over-the-air update support
  • Supports Wireless M-Bus (EN 13757-4) and IEEE 802.15.4g PHY
  • Works with the SimpleLink CC1190 range extender

Applications:

  • 315/433/470/500/779/868/915/920 MHz ISM and SRD systems
  • Home and building automation
  • Wireless alarm and security systems
  • Industrial monitoring and control
  • Smart grid and automatic meter reading
  • Wireless healthcare
  • Wireless sensor networks and active RFID
  • Electronic shelf labels
  • Energy-harvesting and long-range sensor applications
  • Heat-cost allocators

Package:

  • RGZ VQFN-48, 7.00 mm × 7.00 mm (30 GPIOs)

CC1310F128RGZ Features

1

  • Microcontroller
  • -Powerful Arm ® Cortex ® -M3 Processor
  • -EEMBC CoreMark ® Score: 142
  • -EEMBC ULPBench™ Score: 158
  • -Clock Speed up to 48-MHz
  • -32KB, 64KB, and 128KB of In-System Programmable Flash
  • -8KB of SRAM for Cache (or as General-Purpose RAM)
  • -20KB of Ultra-Low-Leakage SRAM
  • -2-Pin cJTAG and JTAG Debugging
  • -Supports Over-the-Air (OTA) Update
  • Ultra-Low-Power Sensor Controller
  • -Can Run Autonomously From the Rest of the System
  • -16-Bit Architecture
  • -2KB of Ultra-Low-Leakage SRAM for Code and Data
  • Efficient Code-Size Architecture, Placing Parts of TI-RTOS, Drivers, and Bootloader in ROM
  • RoHS-Compliant Package
  • -7-mm × 7-mm RGZ VQFN48 (30 GPIOs)
  • -5-mm × 5-mm RHB VQFN32 (15 GPIOs)
  • -4-mm × 4-mm RSM VQFN32 (10 GPIOs)
  • Peripherals
  • -All Digital Peripheral Pins Can Be Routed to Any GPIO
  • -Four General-Purpose Timer Modules (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
  • -12-Bit ADC, 200 ksamples/s, 8-Channel Analog MUX
  • -Continuous Time Comparator
  • -Ultra-Low-Power Clocked Comparator
  • -Programmable Current Source
  • UART
  • -2× SSI (SPI, MICROWIRE, TI)
  • -I 2 C, I2S
  • -Real-Time Clock (RTC)
  • -AES-128 Security Module
  • -True Random Number Generator (TRNG)
  • -Support for Eight Capacitive Sensing Buttons
  • -Integrated Temperature Sensor

SPACER

SPACER

SPACER

Technical

Documents SPACER

  • External System
  • -On-Chip Internal DC/DC Converter
  • -Seamless Integration With the SimpleLink™ CC1190 Range Extender
  • Low Power
  • -Wide Supply Voltage Range: 1.8 to 3.8 V
  • -RX: 5.4 mA
  • -TX at +10 dBm: 13.4 mA
  • -Active-Mode MCU 48 MHz Running Coremark: 2.5 mA (51 μA/MHz)
  • -Active-Mode MCU: 48.5 CoreMark/mA
  • -Active-Mode Sensor Controller at 24 MHz: 0.4 mA + 8.2 μA/MHz
  • -Sensor Controller, One Wakeup Every Second Performing One 12-Bit ADC Sampling: 0.95 μA
  • -Standby: 0.7 μA (RTC Running and RAM and CPU Retention)
  • -Shutdown: 185 nA (Wakeup on External Events)
  • RF Section
  • -Excellent Receiver Sensitivity -124 dBm Using Long-Range Mode, -110 dBm at 50 kbps
  • -Excellent Selectivity (±100 kHz): 56 dB
  • -Excellent Blocking Performance (±10 MHz): 90 dB
  • -Programmable Output Power up to +15 dBm
  • -Single-Ended or Differential RF Interface
  • -Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
  • -ETSI EN 300 220, EN 303 204 (Europe)
  • -FCC CFR47 Part 15 (US)
  • -ARIB STD-T108 (Japan)
  • -Wireless M-Bus (EN 13757-4) and IEEE ® 802.15.4g PHY
  • Tools and Development Environment
  • -Full-Feature and Low-Cost Development Kits
  • -Multiple Reference Designs for Different RF Configurations
  • -Packet Sniffer PC Software
  • -Sensor Controller Studio
  • -SmartRF™ Studio
  • -SmartRF Flash Programmer 2
  • -IAR Embedded Workbench ® for Arm
  • -Code Composer Studio™ (CCS) IDE
  • -CCS UniFlash

CC1310F128RGZ Applications

  • 315-, 433-, 470-, 500-, 779-, 868-, 915-, 920-MHz ISM and SRD Systems
  • Low-Power Wireless Systems With 50-kHz to 5-MHz Channel Spacing
  • Home and Building Automation
  • Wireless Alarm and Security Systems
  • Industrial Monitoring and Control
  • Smart Grid and Automatic Meter Reading
  • Wireless Healthcare Applications

CC1310F128RGZ Electrical Characteristics

Tc = 25°C, VDDS = 3.0 V, DC/DC disabled. Input voltage scaling enabled, unless otherwise noted. (1)

PARAMETERPARAMETERTEST CONDITIONSMIN TYPMAXUNIT
Input voltage range0V DDSV
Resolution12Bits
Sample rate200ksamples/s
OffsetInternal 4.3-V equivalent reference (2)2.1LSB
Gain errorInternal 4.3-V equivalent reference (2)-0.14LSB
DNL (3)Differential nonlinearity>-1LSB
INL (4)Integral nonlinearity±2LSB

CC1310F128RGZ Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)

MINMAXUNIT
Supply voltage (VDDS, VDDS2, and VDDS3)Supply voltage (VDDS, VDDS2, and VDDS3)-0.34.1V
Voltage on any digital pin (3)(4)Voltage on any digital pin (3)(4)-0.3VDDSn + 0.3, max 4.1V
Voltage on crystal oscillator pins X32K_Q1, X32K_Q2, X24M_N, and X24M_PVoltage on crystal oscillator pins X32K_Q1, X32K_Q2, X24M_N, and X24M_P-0.3VDDR + 0.3, max 2.25V
Voltage on ADCVoltage scaling enabled-0.3VDDS
Voltage on ADCVoltage scaling disabled, internal reference-0.31.49V
Voltage on ADCVoltage scaling disabled, VDDS as reference-0.3VDDS / 2.9
Input RF levelInput RF level10dBm
Storage temperature (T stg )Storage temperature (T stg )-40150°C

over operating free-air temperature range (unless otherwise noted)

MINMAXUNIT
Ambient temperatureAmbient temperatureAmbient temperature-4085°C
Operating supply voltage (VDDS)Operating supply1.83.8V
voltages (VDDS2 and VDDS3)VDDS < 2.7 V1.83.8V
Operating supply voltages (VDDS2 and VDDS3)VDDS ≥ 2.7 V1.93.8V
Rising supply voltage slew rateRising supply voltage slew rateRising supply voltage slew rate0100mV/μs
Falling supply voltage slew rateFalling supply voltage slew rateFalling supply voltage slew rate020mV/μs
Falling supply voltage slew rate, with low-power flash setting (1)Falling supply voltage slew rate, with low-power flash setting (1)Falling supply voltage slew rate, with low-power flash setting (1)3mV/μs
Positive temperature gradient in standby (2)No limitation for negative temperature gradient, or outside standby modeNo limitation for negative temperature gradient, or outside standby mode5°C/s

CC1310F128RGZ Thermal Information

THERMAL METRIC (1)THERMAL METRIC (1)CC1310 - RSM (VQFN) - 32 PINSCC1310 - RHB (VQFN) - 32 PINSCC1310 - RGZ (VQFN) - 48 PINSUNIT (2)
R θ JAJunction-to-ambient thermal resistance36.932.829.6°C/W
R θ JC(top)Junction-to-case (top) thermal resistance30.324.015.7°C/W
R θ JBJunction-to-board thermal resistance7.66.86.2°C/W
ψ JTJunction-to-top characterization parameter0.40.30.3°C/W
ψ JBJunction-to-board characterization parameter7.46.86.2°C/W
R θ JC(bot)Junction-to-case (bottom) thermal resistance2.11.91.9°C/W

CC1310F128RGZ Typical Application

Few external components are required for the operation of the CC1310 device. Figure 7-1 shows a typical application circuit.

The board layout greatly influences the RF performance of the CC1310 device.

On the Texas Instruments CC1310EM-7XD-7793 reference design, the optimal differential impedance seen from the RF pins into the balun and filter and antenna is 44 + j15.

Figure 7-1 does not show decoupling capacitors for power pins. For a complete reference design, see the product folder on www.ti.com.

Figure 7-1. CC1310 Application Circuits

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
CC1310Texas Instruments—
CC1310F128RGZRTexas InstrumentsVQFN48 (7.00 mm × 7.00 mm)
CC1310F128RGZTTexas InstrumentsVQFN-48 7x7mm
CC1310F128RHBTexas InstrumentsVQFN32 (5 mm × 5 mm)
CC1310F128RHBRTexas Instruments32-VFQFN Exposed Pad
CC1310F128RHBTTexas InstrumentsVQFN-32
CC1310F128RSMTexas InstrumentsVQFN32 (4 mm × 4 mm)
CC1310F128RSMRTexas InstrumentsVQFN-32 4x4mm
CC1310F128RSMTTexas InstrumentsVQFN-32 4x4mm
CC1310F32RGZTexas InstrumentsVQFN48 (7 mm × 7 mm)
CC1310F32RHBTexas InstrumentsVQFN32 (5 mm × 5 mm)
CC1310F32RSMTexas InstrumentsVQFN32 (4 mm × 4 mm)
CC1310F64RGZTexas InstrumentsVQFN48 (7 mm × 7 mm)
CC1310F64RHBTexas InstrumentsVQFN32 (5 mm × 5 mm)
CC1310F64RSMTexas InstrumentsVQFN32 (4 mm × 4 mm)

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