BSC012N06NSATMA1

Part: BSC012N06NS, Infineon Technologies AG

Type: OptiMOS™5 Power Transistor, MOSFET

Key Specs:

• VDS: 60 V
• RDS(on),max: 1.2 mΩ
• ID: 306 A
• Qoss: 122 nC
• QG(0V..10V): 115 nC

Features:

• Optimized for synchronous rectification
• 100% avalanche tested
• Superior thermal resistance
• N-channel
• 175°C rated
• Pb-free lead plating; RoHS compliant
• Halogen-free according to IEC61249-2-21
• Higher solder joint reliability due to enlarged source interconnection

Applications:

• Industrial Applications

Package:

• TSON-8-3: dimensions in mm/inches (no specific values provided)

• •-Optimizedforsynchronousrectification
• •-100%avalanchetested
• •-Superiorthermalresistance
• •-N-channel
• •-175°Crated
• •-Pb-freeleadplating;-RoHScompliant
• •-Halogen-freeaccordingto-IEC61249-2-21
• •-Highersolderjointreliabilityduetoenlargedsourceinterconnection

Productvalidation

Fullyqualifiedaccordingto-JEDECfor-Industrial-Applications

Table-1-----Key-Performance-Parameters

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
QG(0V..10V)	115	nC

Type / Ordering Code	Package	Marking	Related Links
BSC012N06NS	TSON-8-3	012N06N	-

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
Qg(0V..10V)	115	nC

1-----Maximumratings

at-TA=25-°C,unlessotherwisespecified

Table-2-----Maximumratings

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
Qg(0V..10V)	115	nC

2-----Thermalcharacteristics

at-Tj=25-°C,unlessotherwisespecified

Table-3-----Thermalcharacteristics

Parameter	Symbol	Values
		Min.
Thermal resistance, junction - case, bottom	RthJC	-
Thermal resistance, junction - case, top	RthJC	-
Device on PCB, 6 cm2 cooling area2)	RthJA	-

¹⁾ Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual environmental conditions.

²⁾ Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm² (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air.

³⁾ See Diagram 3 for more detailed information

⁴⁾ See Diagram 13 for more detailed information

3-----Electricalcharacteristics

at-Tj=25-°C,unlessotherwisespecified

Table-4-----Staticcharacteristics

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
Qg(0V..10V)	115	nC

Table-5-----Dynamiccharacteristics

Parameter	Symbol	Values
		Min.
Input capacitance1)	Ciss	-
Output capacitance1)	Coss	-
Reverse transfer capacitance1)	Crss	-
Turn-on delay time	td(on)	-
Rise time	tr	-
Turn-off delay time	td(off)	-
Fall time	tf	-

Table-6-----Gatechargecharacteristics2)

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
QG(0V..10V)	115	nC

¹⁾ Defined by design. Not subject to production test

²⁾ See ″Gate charge waveforms″ for parameter definition

Table-7-----Reversediode

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
Qg(0V..10V)	115	nC

¹⁾ Defined by design. Not subject to production test

4-----Electricalcharacteristicsdiagrams

on-state-

resistance

Diagram-

9:-

Drain-source-

5-----Package-Outlines

Parameter	Value	Unit
VDS	60	V
RDS(on),max	1.2	mΩ
ID	306	A
Qoss	122	nC
QG(0V..10V)	115	nC

Type / Ordering Code	Package	Marking	Related Links
BSC012N06NS	TSON-8-3	012N06N	-

Figure-1-----Outline-TSON-8-3,dimensionsinmm/inches

Revision-History

BSC012N06NS

Revision:-2020-02-28,-Rev.-2.3

• Previous Revision
• Revision Date Subjects (major changes since last revision)
• 2.0 2018-03-08 Release of final version
• 2.1 2018-12-11 Rev. 2.0
• 2.2 2020-02-06 Update current rating
• 2.3 2020-02-28 Update footnotes

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Parameter	Symbol	Values
		Min.
Thermal resistance, junction - case, bottom	RthJC	-
Thermal resistance, junction - case, top	RthJC	-
Device on PCB, 6 cm2 cooling area2)	RthJA	-

¹⁾ Rating refers to the product only with datasheet specified absolute maximum values, maintaining case temperature at 25°C. For higher case temperature please refer to Diagram 2. De-rating will be required based on the actual environmental conditions.

²⁾ Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm² (one layer, 70 μm thick) copper area for drain connection. PCB is vertical in still air.

³⁾ See Diagram 3 for more detailed information

⁴⁾ See Diagram 13 for more detailed information