ADF4351BCPZ-RL7

Wideband Synthesizer with Integrated VCO

Manufacturer

Analog Devices Inc.

Category

Integrated Circuits (ICs)

Overview

Part: ADF4351, Analog Devices

Type: Wideband Synthesizer with Integrated VCO

Key Specs:

  • Output frequency range: 35 MHz to 4400 MHz
  • Power supply: 3.0 V to 3.6 V
  • Integrated RMS Jitter: 0.27 ps
  • VCO fundamental output frequency: 2200 MHz to 4400 MHz
  • Maximum RF Output Power: 5 dBm
  • Minimum RF Output Power: -4 dBm
  • Operating temperature range: -40°C to +85°C

Features:

  • Fractional-N synthesizer and integer-N synthesizer
  • Low phase noise VCO
  • Programmable divide-by-1/-2/-4/-8/-16/-32/-64 output
  • Typical EVM at 2.1 GHz: 0.4%
  • Logic compatibility: 1.8 V
  • Programmable dual-modulus prescaler of 4/5 or 8/9
  • Programmable output power level
  • RF output mute function
  • 3-wire serial interface
  • Analog and digital lock detect
  • Switched bandwidth fast lock mode
  • Cycle slip reduction
  • Auxiliary RF output

Applications:

  • Wireless infrastructure (W-CDMA, TD-SCDMA, WiMAX, GSM, PCS, DCS, DECT)
  • Test equipment
  • Wireless LANs, CATV equipment
  • Clock generation

Package:

  • null

Features

Output frequency range: 35 MHz to 4400 MHz Fractional-N synthesizer and integer-N synthesizer Low phase noise VCO Programmable divide-by-1/-2/-4/-8/-16/-32/-64 output Typical jitter: 0.3 ps rms Typical EVM at 2.1 GHz: 0.4% Power supply: 3.0 V to 3.6 V Logic compatibility: 1.8 V Programmable dual-modulus prescaler of 4/5 or 8/9 Programmable output power level RF output mute function 3-wire serial interface Analog and digital lock detect Switched bandwidth fast lock mode Cycle slip reduction

Applications

Wireless infrastructure (W-CDMA, TD-SCDMA, WiMAX, GSM, PCS, DCS, DECT) Test equipment Wireless LANs, CATV equipment Clock generation

Pin Configuration

Table 5. Pin Function Descriptions

Pin No.MnemonicDescription
1CLKSerial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high
impedance CMOS input.
2DATASerial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a high
impedance CMOS input.
3LELoad Enable. When LE goes high, the data stored in the 32-bit shift register is loaded into the register that is
selected by the three control bits. This input is a high impedance CMOS input.
4CEChip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode.
A logic high on this pin powers up the device, depending on the status of the power-down bits.
5SWFast Lock Switch. A connection should be made from the loop filter to this pin when using the fast lock mode.
6VPCharge Pump Power Supply. VP must have the same value as AVDD. Place decoupling capacitors to the ground
plane as close to this pin as possible.
7CPOUTCharge Pump Output. When enabled, this output provides ±I CP to the external loop filter. The output of the
loop filter is connected to VTUNE to drive the internal VCO.
8CPGNDCharge Pump Ground. This output is the ground return pin for CPOUT.
9AGNDAnalog Ground. Ground return pin for AVDD.
10AVDDAnalog Power Supply. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the analog ground
plane as close to this pin as possible. AVDD must have the same value as DVDD.
11, 18, 21AGNDVCOVCO Analog Ground. Ground return pins for the VCO.
12RFOUTA+VCO Output. The output level is programmable. The VCO fundamental output or a divided-down version is
available.
13RFOUTA-Complementary VCO Output. The output level is programmable. The VCO fundamental output or a divided
down version is available.
14RFOUTB+Auxiliary VCO Output. The output level is programmable. The VCO fundamental output or a divided-down
version is available.
15RFOUTB-Complementary Auxiliary VCO Output. The output level is programmable. The VCO fundamental output or a
divided-down version is available.
16, 17VVCOPower Supply for the VCO. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the analog
ground plane as close to these pins as possible. VVCO must have the same value as AVDD.
19TEMPTemperature Compensation Output. Place decoupling capacitors to the ground plane as close to this pin as
possible.
20VTUNEControl Input to the VCO. This voltage determines the output frequency and is derived from filtering the CPOUT
output voltage.
Pin No.MnemonicDescription
22RSETConnecting a resistor between this pin and ground sets the charge pump output current. The nominal voltage
bias at the RSET pin is 0.55 V. The relationship between ICP and RSET is as follows:
ICP = 25.5/RSET
where:
RSET = 5.1 kΩ.
ICP = 5 mA.
23VCOMInternal Compensation Node. Biased at half the tuning range. Place decoupling capacitors to the ground plane
as close to this pin as possible.
24VREFReference Voltage. Place decoupling capacitors to the ground plane as close to this pin as possible.
25LDLock Detect Output Pin. A logic high output on this pin indicates PLL lock. A logic low output indicates loss
of PLL lock.
26PDBRFRF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable.
27DGNDDigital Ground. Ground return pin for DVDD.
28DVDDDigital Power Supply. DVDD must have the same value as AVDD. Place decoupling capacitors to the ground
plane as close to this pin as possible.
29REFINReference Input. This CMOS input has a nominal threshold of AVDD/2 and a dc equivalent input resistance of
100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.
30MUXOUTMultiplexer Output. The multiplexer output allows the lock detect value, the N divider value, or the R counter
value to be accessed externally.
31SDGNDDigital Σ-Δ Modulator Ground. Ground return pin for the Σ-Δ modulator.
32SDVDDPower Supply Pin for the Digital Σ-Δ Modulator. SDVDD must have the same value as AVDD. Place decoupling
capacitors to the ground plane as close to this pin as possible.
EPExposed PadExposed Pad. The LFCSP has an exposed pad that must be connected to GND.

Absolute Maximum Ratings

TA = 25°C, unless otherwise noted.

Table 3.

ParameterRating
AVDD to GND1-0.3 V to +3.9 V
AVDD to DVDD-0.3 V to +0.3 V
VVCO to GND1-0.3 V to +3.9 V
VVCO to AVDD-0.3 V to +0.3 V
Digital I/O Voltage to GND1-0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND1-0.3 V to VDD + 0.3 V
REFIN to GND1-0.3 V to VDD + 0.3 V
Operating Temperature Range-40°C to +85°C
Storage Temperature Range-65°C to +125°C
Maximum Junction Temperature150°C
Reflow Soldering
Peak Temperature260°C
Time at Peak Temperature40 sec

1 GND = AGND = DGND = CPGND = SDGND = AGNDVCO = 0 V.

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

This device is a high performance RF integrated circuit with an ESD rating of <1.5 kV and is ESD sensitive. Proper precautions should be taken for handling and assembly.

TRANSISTOR COUNT

The transistor count for the ADF4351 is 36,955 (CMOS) and 986 (bipolar).

THERMAL RESISTANCE

Thermal impedance (θJA) is specified for a device with the exposed pad soldered to GND.

Table 4. Thermal Resistance

Package TypeθJAUnit
32-Lead LFCSP (CP-32-7)27.3°C/W

ESD CAUTION

Thermal Information

Thermal impedance (θJA) is specified for a device with the exposed pad soldered to GND.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ADF4351Analog Devices Inc.
ADF4351BCPZAnalog Devices Inc.32-VFQFN Exposed Pad, CSP
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