Skip to main content

ADE9000ACPZ

The ADE9000ACPZ is an electronic component from Analog Devices. View the full ADE9000ACPZ datasheet below including absolute maximum ratings.

Manufacturer

Analog Devices

Overview

Part: ADE9000 — Analog Devices Type: High Performance, Multiphase Energy, and Power Quality Monitoring IC Description: A highly accurate, fully integrated, multiphase energy and power quality monitoring device with 7 high-performance ADCs, 101 dB SNR, and ±25 ppm/°C maximum channel drift, enabling Class 0.2 metrology over a 10000:1 dynamic range.

Operating Conditions:

  • Supply voltage: 2.97 V to 3.63 V
  • Operating temperature: -40°C to +85°C
  • CLKIN: 24.576 MHz crystal (XTAL)

Absolute Maximum Ratings:

  • Max operating voltage on analog input pins (VxP, VxN, IxP, IxN): ±0.6 V

Key Specs:

  • Total Active Energy Accuracy: 0.1% over 5000:1 dynamic range (10 sec accumulation)
  • SNR (PGA=1): 101 dB (8 kSPS, sinc4 + IIR LPF output, VIN = -0.5 dB from FS)
  • THD (PGA=1): -101 dB (8 kSPS, sinc4 + IIR LPF output, VIN = -0.5 dB from FS)
  • Channel Drift (PGA, ADC, Internal VREF): ±25 ppm/°C max (PGA = 1, 2, or 4, internal VREF)
  • Differential Input Voltage Range: ±1/Gain V (707 mV rms FS at gain = 1)
  • SPI Communication Speed: 20 MHz
  • Integrated Temperature Sensor Accuracy: ±3°C from -40°C to +85°C
  • Internal Voltage Reference: 1.250 V (TA = 25°C)

Features:

  • 7 high performance ADCs
  • Wide input voltage range: ±1 V, 707 mV rms FS at gain = 1
  • Power quality measurements (dip and swell monitors, line frequency, zero crossing, phase angle)
  • Supports CTs and Rogowski coil (di/dt) sensors with digital integrator
  • Flexible waveform buffer (resampling to 128 points per line cycle)
  • Advanced metrology feature set (active power, VAR, VA, energies, RMS, THD, power factor)
  • High speed communication port: 20 MHz serial port interface (SPI)
  • Integrated temperature sensor with 12-bit SAR ADC

Applications:

  • Energy and power monitoring
  • Power quality monitoring
  • Protective devices
  • Machine health
  • Smart power distribution units
  • Polyphase energy meters

Package:

Features

  • 7 high performance ADCs
  • 101 dB SNR
  • Wide input voltage range: ±1 V, 707 mV rms FS at gain = 1
  • Differential inputs
  • ±25 ppm/°C maximum channel drift (including ADC, internal VREF, PGA drift) enabling 10000:1 dynamic input range Class 0.2 metrology with standard external components
  • Power quality measurements
  • Enables implementation of IEC 61000-4-30 1
  • VRMS ½, IRMS ½ rms voltage refreshed each half cycle
  • 10 cycle rms/12 cycle rms
  • Dip and swell monitors
  • Line frequency-one per phase
  • Zero crossing, zero-crossing timeout
  • Phase angle measurements
  • Supports CTs and Rogowski coil (di/dt) sensors
  • Multiple range phase/gain compensation for CTs
  • Digital integrator for Rogowski coils
  • Flexible waveform buffer
  • Able to resample waveform to ensure 128 points per line cycle for ease of external harmonic analysis
  • Events, such as dip and swell, can trigger waveform storage
  • Simplifies data collection for IEC 61000-4-7 harmonic analysis
  • Advanced metrology feature set
  • Total and fundamental active power, volt amperes reactive (VAR), volt amperes (VA), watthour, VAR hour, and VA hour
  • Total and fundamental IRMS, VRMS
  • Total harmonic distortion
  • Power factor
  • Supports active energy standards: IEC 62053-21 and IEC 62053-22; EN50470-3; OIML R46; and ANSI C12.20
  • Supports reactive energy standards: IEC 62053-23, IEC 62053-24
  • High speed communication port: 20 MHz serial port interface (SPI)
  • Integrated temperature sensor with 12-bit successive approximation register (SAR) ADC
  • ±3°C accuracy from -40°C to +85°C

1 For IEC 61000-4-30 Class S implementation, refer to the ADE9430 IC data sheet.

Applications

  • Energy and power monitoring
  • Power quality monitoring
  • Protective devices
  • Machine health
  • Smart power distribution units
  • Polyphase energy meters

Pin Configuration

Figure 3. Pin Configuration

Table 5. Pin Function Descriptions

Pin No.MnemonicDescription
1PULL_HIGHPull High. Tie this pin to VDD.
2DGNDDigital Ground. This pin provides the ground reference for the digital circuitry in the ADE9000. Because the digital return currents in the ADE9000 are small, it is acceptable to connect this pin to the analog ground plane of the whole system. Connect all grounds (GND, AGND, DGND, and REFGND) together at one point.
3DVDDOUT1.8 V Output of the Digital Low Dropout Regulator (LDO). Decouple this pin with a 0.1 μF ceramic capacitor in parallel with a 4.7 μF ceramic capacitor.
4PM0Power Mode Pin 0. PM0, combined with PM1, defines the power mode. For normal operation, ground PM0 and PM1.
5PM1Power Mode Pin 1. PM1 combined with PM0, defines the power mode. For normal operation, ground PM0 and PM1.
6RESETReset Input, Active Low. This pin must stay low for at least 1 μs to trigger a hardware reset.
7, 8IAP, IANAnalog Inputs, Channel IA. The IAP (positive) and IAN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
9, 10IBP, IBNAnalog Inputs, Channel IB. The IBP (positive) and IBN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
11, 12ICP, ICNAnalog Inputs, Channel IC. The ICP (positive) and ICN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
13, 14INP, INNAnalog Inputs, Channel IN. The INP (positive) and INN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
15REFGNDGround Reference, Internal Voltage Reference. Connect all grounds (GND, AGND, DGND, and REFGND) together at one point.
16REFVoltage Reference. The REF pin provides access to the on-chip voltage reference. The on-chip reference has a nominal value of 1.25 V. An external reference source of 1.2 V to 1.25 V can also be connected at this pin. In either case, decouple REF to REFGND with 0.1 μF ceramic capacitor in parallel with a 4.7 μF ceramic capacitor. After reset, the on-chip reference is enabled. To use the internal voltage reference with external circuits, a buffer is required.
17NC1No Connection. It is recommended to tie this pin to ground.
18NC2No Connection. It is recommended to tie this pin to ground.
19, 20VAN, VAPAnalog Inputs, Channel VA. The VAP (positive) and VAN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
21, 22VBN, VBPAnalog Inputs, Channel VB. The VBP (positive) and VBN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
23, 24VCN, VCPAnalog Inputs, Channel VC. The VCP (positive) and VCN (negative) inputs are fully differential voltage inputs with a maximum differential level of ±1 V. This channel also has an internal PGA of 1, 2, or 4.
25AVDDOUT1.9 V Output of the Analog Low Dropout Regulator (LDO). Decouple AVDDOUT with a 0.1 μF ceramic capacitor in parallel with a 4.7 μF ceramic capacitor. Do not connect external active circuitry to this pin.
26AGNDAnalog Ground Reference. Connect all grounds (GND, AGND, DGND, and REFGND) together at one point.

Absolute Maximum Ratings

TA = 25°C, unless otherwise noted.

Table 3.Rating
VDD to GND-0.3 V to +3.96 V
Analog Input Voltage to GND, IAP, IAN, IBP, IBN, ICP, ICN, INP, INN, VAP, VAN, VBP, VBN, VCP, VCN-2 V to +2 V
Reference Input Voltage to REFGND-0.3 V to +2 V
Digital Input Voltage to GND-0.3 V to VDD + 0.3 V
Digital Output Voltage to GND-0.3 V to VDD + 0.3 V
Operating Temperature
Industrial Range-40°C to +85°C
Storage Temperature Range-65°C to +150°C
Junction Temperature125°C
Lead Temperature (Soldering, 10 sec) 1260°C
ESD
Human Body Model 24 kV
Machine Model 3300 V
Field Induced Charged Device Model (FICDM) 41.25 kV

1 Analog Devices recommends that reflow profiles used in soldering RoHS compliant devices conform to J-STD-020D.1 from JEDEC. Refer to JEDEC for the latest revision of this standard.

2 Applicable standard: ANSI/ESDA/JEDEC JS-001-2014.

3 Applicable standard: JESD22-A115-A (ESD machine model standard of JEDEC).

4 Applicable standard: JESD22-C101F (ESD FICDM standard of JEDEC).

Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.

Thermal Information

Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required.

θ JA and θ JC are specified for the worst case conditions, that is, a device soldered in a circuit board for surface-mount packages.

Typical Application

Figure 1. Typical Applications Circuit

VDD = 2.97 V to 3.63 V, GND = AGND = DGND = 0 V, on-chip reference, CLKIN = 24.576 MHz crystal (XTAL), T MIN to T MAX = -40°C to +85°C, TA = 25°C (typical), unless otherwise noted.

Table 1.

  • Parameter Min Typ Max Unit Test Conditions/Comments
  • ACCURACY (MEASUREMENT ERROR PER PHASE)
  • Total Active Energy 0.1 % Over a dynamic range of 5000 to 1, 10 sec accumulation
  • 0.2 % Over a dynamic range of 10,000 to 1, 20 sec accumulation
  • 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, high-pass filter (HPF) corner = 4.98 Hz
  • 0.2 % Over a dynamic range of 5000 to 1, 10 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Total Reactive Energy 0.1 % Over a dynamic range of 5000 to 1, 10 sec accumulation
  • 0.2 % Over a dynamic range of 10,000 to 1, 20 sec accumulation
  • 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.2 % Over a dynamic range of 5000 to 1, 10 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Total Apparent Energy 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation
  • 0.5 % Over a dynamic range of 5000 to 1, 10 sec accumulation
  • 0.1 % Over a dynamic range of 500 to 1, 1 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.5 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Fundamental Active Energy 0.1 % Over a dynamic range of 5000 to 1, 2 sec accumulation
  • 0.2 % Over a dynamic range of 10,000 to 1, 10 sec accumulation
  • 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.2 % Over a dynamic range of 5000 to 1, 10 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Fundamental Reactive Energy 0.1 % Over a dynamic range of 5000 to 1, 2 sec accumulation
  • 0.2 % Over a dynamic range of 10,000 to 1, 10 sec accumulation

Table 1. (Continued)

  • Parameter Min Typ Max Unit Test Conditions/Comments
  • 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.2 % Over a dynamic range of 5000 to 1, 10 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Fundamental Apparent Energy 0.1 % Over a dynamic range of 5000 to 1, 2 sec accumulation
  • 0.5 % Over a dynamic range of 10,000 to 1, 10 sec accumulation
  • 0.1 % Over a dynamic range of 1000 to 1, 2 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.5 % Over a dynamic range of 5000 to 1, 10 sec accumulation, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • IRMS, VRMS 0.1 % Over a dynamic range of 1000 to 1
  • 0.5 % Over a dynamic range of 5000 to 1
  • 0.1 % Over a dynamic range of 500 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.5 % Over a dynamic range of 1000 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Fundamental IRMS, VRMS 0.1 % Over a dynamic range of 1000 to 1
  • 0.5 % Over a dynamic range of 5000 to 1
  • 0.1 % Over a dynamic range of 500 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.5 % Over a dynamic range of 2000 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Active Power, VAR, VA 0.2 % Over a dynamic range of 1000 to 1
  • 0.4 % Over a dynamic range of, 3000 to 1
  • 0.2 % Over a dynamic range of 500 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • 0.5 % Over a dynamic range of 1000 to 1, PGA = 4, integrator on, HPF corner = 4.98 Hz
  • Power Factor (PF) Error ±0.001 % Over a dynamic range of 5000 to 1
  • 128-Point per Line Cycle Resampled Data 0.1 % An FFT is performed to receive the magnitude response; this error is the worst case error in the magnitude caused by resampling algorithm distortion; input signal is 50 Hz fundamental and ninth harmonic both at half of full scale (FS)
  • -72 dB Amplitude of highest spur; input signal is 50 Hz fundamental and ninth harmonic both at half of FS
  • 1.25 % An FFT is performed to receive the magnitude response; this error is the worst case error in the magnitude caused by resampling algorithm distortion; input signal is 50 Hz fundamental and 31 st harmonic, both at half of FS
  • -38 dB Amplitude of highest spur; input signal is

Table 1. (Continued)

ParameterMinTypMaxUnitTest Conditions/Comments
50 Hz fundamental and 31 st harmonic, both at half of FS
VRMS½, IRMS½ RMS Voltage0.25%Data sourced before HPF, no dc offset at
Refreshed Each Half-Cycle 1inputs, over a dynamic range of 100 to 1
10 Cycle/12 Cycle IRMS, VRMS 10.2%Data sourced before HPF, no dc offset at inputs, over a dynamic range of 100 to 1
Line Period Measurement0.001HzResolution at 50 Hz
Current to Current, Voltage to Voltage, and Voltage to Current Angle Measurement0.018DegreesResolution at 50 Hz
ADC
PGA Gain Settings (PGA_GAIN)1, 2, or 4V/VPGA gain setting is referred to as PGA_GAIN
Differential Input Voltage Range (VxP to VxN, IxP to IxN)-1/Gain+1/GainV707 mV rms, when V REF = 1.25 V, this voltage corresponds to 53 million codes
Maximum Operating Voltage on Analog Input Pins (VxP, VxN, IxP, and IxN)-0.6+0.6VVoltage on the pin with respect to ground
Signal-to-Noise Ratio (SNR) 2
PGA = 196dB32 kSPS, sinc4 output, V IN = -0.5 dB from FS
101dB8 kSPS, sinc4 + infinite impulse response (IIR), low-pass filter (LPF) output, V IN = -0.5 dB from FS
PGA = 493dB32 kSPS, sinc4 output
96dB8 kSPS, sinc4 + IIR LPF output
Total Harmonic Distortion (THD) 2 PGA = 1-101-95dB32 kSPS, sinc4 output, V IN = -0.5 dB from FS
-101-95dB8 kSPS, sinc4 + IIR LPF output, V = -0.5 dB from FS
PGA = 4-107-99dBIN 32 kSPS, sinc4 output
-107-99dB8 kSPS, sinc4 + IIR LPF output
Signal-to-Noise and Distortion Ratio (SINAD) 2
PGA = 195dB32 kSPS, sinc4 output, V IN = -0.5 dB from FS
98dB8 kSPS, sinc4 + IIR LPF output, V IN = -0.5 dB from FS
PGA = 493dB32 kSPS, sinc4 output
Spurious-Free Dynamic Range (SFDR) 2
PGA = 1100dB32 kSPS, sinc4 output, V IN = -0.5 dB from FS
100dB8 kSPS, sinc4 + IIR LPF output, V = -0.5 dB from FS
Sinc4 Outputs
1.344kHz32 kSPS, sinc4 output
Sinc4 + IIR LPF Outputs1.344kHz8 kSPS output
Output Bandwidth (-3 dB) 2
Sinc4 Outputs7.2kHz32 kSPS, sinc4 output
Sinc4 + IIR LPF Outputs3.2kHz8 kSPS output
Crosstalk 2-120dBAt 50 Hz or 60 Hz, see the Terminology section
AC Power Supply Rejection Ratio-120dBAt 50 Hz, see the Terminology section
(AC PSRR) 2
ParameterMinTypMaxUnitTest Conditions/Comments
Common-Mode Rejection Ratio (AC CMRR) 2115dBAt 100 Hz and 120 Hz
Gain Error±0.3±1%typSee the Terminology section
Gain Drift 2±3ppm/°CSee the Terminology section
Offset±0.040±3.8mVSee the Terminology section
Offset Drift 20±2μV/°CSee the Terminology section
Channel Drift (PGA, ADC, Internal±7±25ppm/°CPGA = 1, internal V REF
Voltage Reference)
±7±25ppm/°CPGA = 2, internal V REF
±7±25ppm/°CPGA = 4, internal V REF
Differential Input Impedance (DC)165185PGA = 1, see the Terminology section
8090PGA = 2
4045PGA = 4
INTERNAL VOLTAGE REFERENCENominal = 1.25 V ± 1 mV
Voltage Reference1.250VT A = 25°C, REF pin
Temperature Coefficient 2±5±20ppm/°CT A = -40°C to +85°C, tested during device
Input Impedance
Input Voltage (REF)1.2 or
1.25
VREFGND must be tied to GND, AGND, and DGND, a 1.25 V external reference is preferred; the FS values mentioned in this data sheet are for a
7.5voltage reference of 1.25 V
TEMPERATURE SENSOR
Temperature Accuracy±2°C-10°C to +40°C
±3°C-40°C to +85°C
Temperature Readout Step Size0.3°C
CRYSTAL OSCILLATORAll specifications use CLKIN = 24.576 MHz ± 30 ppm
Input Clock Frequency24.3324.57624.822MHz
Internal Capacitance on CLKIN, CLKOUT4pF
Internal Feedback Resistance Between CLKIN and2.45
CLKOUT
Transconductance (g m )58mA/V
EXTERNAL CLOCK INPUT Input Clock Frequency Duty Cycle 224.330 45:5524.576 50:5024.822 55:45MHz %±1%
CLKIN Logic Input Voltage3.3 V tolerant
High, V INH1.2VV DD = 2.97 V to 3.63
0.5VV V DD = 2.97 V to 3.63 V
Low, V INL
LOGIC INPUTS (PM0, PM1, RESET, MOSI,
SCLK, and SS) Input Voltage
V INH2.40.8V
V INL Input Current, I IN15V μAV IN = 0 V
Internal Capacitance, C IN10pF
LOGIC OUTPUTS
ParameterMinTypMaxUnitTest Conditions/Comments
MISO, IRQ0, and IRQ1
Output Voltage
High, V OH2.4VI SOURCE = 4 mA
Low, V OL0.8VI SINK = 4 mA
Internal Capacitance, C IN10pF
C1, CF2, CF3, and CF4
Output Voltage
V OH2.4VI SOURCE = 7 mA
V OL0.8VI SINK = 8 mA
C IN10pF
LOW DROPOUT REGULATORS (LDOs)
AVDD1.9V
DVDD1.7V
POWER SUPPLY
V DD2.973.33.63VPower-on reset level is 2.4 V to 2.6 V
Supply Current (V DD )
Power Save Mode 0 (PSM0)1517mANormal mode
14.516.5mANormal mode, six ADCs enabled
Power Save Mode 3 (PSM3)90300nAIdle, V DD = 3.3 V, AV DD = 0 V, DV DD = 0 V

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
ADE9000Analog DevicesCP-40-71
ADE9000ACPZ-RLAnalog DevicesCP-40-7
Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free