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2N7002

N-channel Trench MOSFET

The 2N7002 is a n-channel trench mosfet from Shenzhen Slkormicro Semicon Co., Ltd.. View the full 2N7002 datasheet below including key specifications, pinout.

Manufacturer

Shenzhen Slkormicro Semicon Co., Ltd.

Category

MOSFETs

Package

TO-236AB, SOT23

Key Specifications

ParameterValue
Continuous Drain Current600mA (Ta)
Drain-Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)5V, 10V
Drive Voltage (Max Rds On, Min Rds On)5V, 10V
Drive Voltage (Max Rds On, Min Rds On)5V, 10V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
FET TypeN-Channel
Gate Charge (Qg)4 nC @ 10 V
Input Capacitance (Ciss)474 pF @ 15 V
Mounting TypeSurface Mount
Operating Temperature-55°C ~ 150°C (TJ)
Package / CaseTO-236-3, SC-59, SOT-23-3
Power Dissipation (Max)1.3W (Ta)
Rds(on)3Ohm @ 600mA, 10V Ω
Supplier Device PackageSOT-23
Supplier Device PackageSOT-23
Supplier Device PackageSOT-23
Supplier Device PackageSOT-23
Diode TechnologyMOSFET (Metal Oxide)
Vgs (Max)±20V
Gate Threshold Voltage1V @ 250µA

Overview

Part: 2N7002 — Nexperia

Type: N-channel Enhancement Mode Field-Effect Transistor (FET)

Description: 60 V, 300 mA N-channel enhancement mode Field-Effect Transistor (FET) using Trench MOSFET technology, suitable for logic level gate drive sources and very fast switching.

Operating Conditions:

  • Drain-source voltage: up to 60 V
  • Gate-source voltage: -30 to 30 V
  • Operating temperature: -65 to 150 °C (junction)
  • Max continuous drain current (Tsp = 100 °C): 190 mA

Absolute Maximum Ratings:

  • Max drain-source voltage: 60 V
  • Max continuous drain current: 300 mA (VGS = 10 V; Tsp = 25 °C)
  • Max junction/storage temperature: 150 °C

Key Specs:

  • Drain-source breakdown voltage V(BR)DSS: 60 V (min, ID = 10 μA; VGS = 0 V; Tj = 25 °C)
  • Gate-source threshold voltage VGSth: 1 V (min) to 2.5 V (max) (ID = 0.25 mA; VDS = VGS; Tj = 25 °C)
  • Drain-source on-state resistance RDSon: 2.8 Ω (typ), 5 Ω (max) (VGS = 10 V; ID = 500 mA; Tj = 25 °C)
  • Drain leakage current IDSS: 0.01 μA (typ), 1 μA (max) (VDS = 48 V; VGS = 0 V; Tj = 25 °C)
  • Input capacitance Ciss: 31 pF (typ), 50 pF (max) (VDS = 10 V; f = 1 MHz; VGS = 0 V; Tj = 25 °C)
  • Turn-on time ton: 2.5 ns (typ), 10 ns (max) (VGS = 10 V; VDS = 50 V; RL = 250 Ω)
  • Turn-off time toff: 11 ns (typ), 15 ns (max) (VGS = 10 V; VDS = 50 V; RL = 250 Ω)
  • Total power dissipation Ptot: 0.83 W (Tsp = 25 °C)

Features:

  • Suitable for logic level gate drive sources
  • Very fast switching
  • Surface-mounted package
  • Trench MOSFET technology

Applications:

  • Logic level translators
  • High-speed line drivers

Package:

  • TO-236AB (plastic surface-mounted package; 3 leads)

Features

  • Suitable for logic level gate drive sources
  • Very fast switching

Pin Configuration

PinNameTypeDescription
1GIGate
2SPSource
3DPDrain

Thermal Information

Table 6. Thermal characteristics

SymbolParameterConditionsMinTypMaxUnit
R th(j-a)thermal resistance from junction to ambientMounted on a printed-circuit board; minimum footprint ; vertical in still air--350K/W
R th(j-sp)thermal resistance from junction to solder pointsee Figure 4--150K/W

Table 6. Thermal characteristics

Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration

Package Information

UNITAA 1 max.b pcDEee 1H EL pQvw
mm1.1 0.90.10.48 0.380.15 0.093.0 2.81.4 1.21.90.952.5 2.10.45 0.150.55 0.450.20.1
OUTLINE VERSIONREFERENCESREFERENCESREFERENCESEUROPEANISSUE DATE
OUTLINE VERSIONIECJEDECJEITAPROJECTION
SOT23TO-236AB04-11-04 06-03-16

Fig 13. Package outline SOT23 (TO-236AB)

Fig 13. Package outline SOT23 (TO-236AB)

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
2N7002TDiodes IncorporatedSOT-523
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