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2N7000BU

N-Channel Enhancement Mode MOSFET

The 2N7000BU is a n-channel enhancement mode mosfet from onsemi. View the full 2N7000BU datasheet below including key specifications, electrical characteristics, absolute maximum ratings.

2N7000BU shares its datasheet with 2N7000TA, whose page lists every part number it covers.

Official 2N7000BU datasheet (PDF) — the source this page was extracted from.

Manufacturer

onsemi

Category

N-Channel Enhancement Mode MOSFET

2N7000BU Key Specifications

ParameterValue
Case/PackageTO-92-3
China RoHSCompliant
Contact PlatingCopper, Silver, Tin
Continuous Drain Current (ID)200 mA
Continuous Drain Current200mA (Tc)
Current Rating200 mA
Drain to Source Breakdown Voltage60 V
Drain to Source Resistance5 Ω
Drain to Source Voltage (Vds)60 V
Drain-Source Voltage (Vdss)60 V
Drive Voltage (Max Rds On, Min Rds On)4.5V, 10V
Element ConfigurationSingle
Fall Time10 ns
FET TypeN-Channel
Gate to Source Voltage (Vgs)30 V
Height5.33 mm
Input Capacitance50 pF
Input Capacitance (Ciss)50 pF @ 25 V
Introduction Date2013-11-14
Lead FreeLead Free
Length5.2 mm
Lifecycle StatusProduction (Last Updated: 3 weeks ago)
Manufacturer Package IdentifierTO-92 3L
Max Operating Temperature150 °C
Max Power Dissipation400 mW
Min Breakdown Voltage60 V
Min Operating Temperature-55 °C
MountThrough Hole
Mounting TypeThrough Hole
Number of Elements1
Number of Pins3
Number of Terminals3
Operating Temperature-55°C ~ 150°C (TJ)
Package / CaseTO-226-3, TO-92-3 (TO-226AA) Formed Leads
PackagingAmmo Pack
Power Dissipation400 mW
Power Dissipation (Max)400mW (Ta)
Radiation HardeningNo
Rds(on)5Ohm @ 500mA, 10V Ω
Rds On Max5 Ω
REACH SVHCUnaffected
Resistance5 Ω
Rise Time10 ns
RoHSCompliant
Schedule B8541210080, 8541210080|8541210080|8541210080|8541210080|8541210080
Standard Pack Qty2000
Supplier Device PackageTO-92-3
Diode TechnologyMOSFET (Metal Oxide)
Threshold Voltage3.9 V
Turn-Off Delay Time10 ns
Turn-On Delay Time10 ns
Vgs (Max)±20V
Gate Threshold Voltage3V @ 1mA
Voltage Rating (DC)60 V
Width4.19 mm

2N7000BU Overview

Part: 2N7000BU / 2N7000TA — onsemi

Type: N-Channel Enhancement Mode Small-Signal MOSFET

Description: 60 V, 200 mA continuous (1 A pulsed) N-channel DMOS MOSFET with RDS(on) up to 5.0 Ω at VGS = 10 V, in a TO-92 package.

Operating Conditions:

  • Supply voltage: not applicable (discrete MOSFET; VGS ±30 V max)
  • Operating temperature: -55 to 150 °C (junction)
  • Suited for applications up to 400 mA DC, with pulsed currents up to 2 A (per description)

Absolute Maximum Ratings:

  • Drain-to-source voltage (VDSS): 60 V
  • Gate-to-source voltage (VGS): ±30 V
  • Continuous drain current: 200 mA (TC = 25 °C); 110 mA (TC = 100 °C)
  • Pulsed drain current (IDM): 1000 mA
  • Operating junction and storage temperature: -55 to 150 °C
  • Lead soldering temperature: 300 °C (1/8 inch from case, 5 s)

Key Specs:

  • BVDSS: 60 V min (VGS = 0 V, ID = 250 μA)
  • VGS(th): 0.3 to 3.9 V (VDS = VGS, ID = 250 μA); 0.4 to 3.0 V (ID = 1 mA)
  • RDS(on): 5.0 Ω max (VGS = 10 V, ID = 0.5 A)
  • Forward transconductance gfs: 0.1 S min, 0.3 S typ (VDS = 15 V, ID = 0.5 A)
  • IGSS: ±100 nA max (VGS = ±15 V)
  • IDSS: 1 μA max (VDS = 60 V)
  • Ciss / Coss / Crss: 30 / 12 / 3.0 pF typ (VDS = 25 V, f = 1 MHz)
  • Switching times (VDD = 30 V, ID = 0.5 A, RG = 15 Ω): td(on), tr, td(off), tf each 10 ns max
  • Power dissipation: 400 mW; RθJA 312.5 °C/W (FR-4 PCB)

Features:

  • Improved inductive ruggedness
  • Fast switching times
  • Lower input capacitance
  • Improved high-temperature reliability
  • Extended safe operating area
  • Pb-free device

Applications:

  • Small servo motor control
  • Power MOSFET gate drivers
  • Low-voltage, low-current switching applications

Package:

  • TO-92 3 (2N7000BU, 10000 per bulk bag)
  • TO-92 3 (2N7000TA, 2000 per fan-fold)

2N7000BU Features

  • Improved Inductive Ruggedness
  • Fast Switching Times
  • Lower Input Capacitance
  • Improved High -Temperature Reliability
  • Extended Safe Operating Area
  • This is a Pb -Free Device

2N7000BU Electrical Characteristics

(Values are at T A = 25 ° C unless otherwise noted.)

SymbolParameterConditionsMinTypMaxUnit
B VDSSDrain - Source Breakdown VoltageV GS = 0 V, I D = 250 m A60--V
V GS(th)Gate Threshold VoltageV DS = V GS , I D = 250 m A0.3-3.9V
V GS(th)V DS = V GS , I D = 1 mA0.4-3.0
I GSSGate - Source Leakage , ForwardV GS = 15 V--100nA
I GSSGate - Source Leakage , ReverseV GS = - 15 V--- 100
I DSSDrain - to - Source Leakage CurrentV DS = 60 V--1mA
I DSSV DS = 45 V, T C = 125 ° C--1000
R DS(ON)Static Drain - Source On - State Resistance (Note 3)V GS = 10 V, I D = 0.5 A--5.0W
g fsForward Transconductance (Note 3)V DS = 15 V, I D = 0.5 A0.10.3-S
C issInput CapacitanceV GS = 0 V, V DS = 25 V, f = 1 MHz-30-pF
C ossOutput Capacitance-12-pF
C rssReverse Transfer Capacitance-3.0-pF
t d(on)Turn - On DelayV DD = 30 V, I D = 0.5 A, R G = 15 W (Note 3), (Note 4)--10ns
t rRise Time--10ns
t d(off)Turn - Off Delay--10ns
t fFall Time--10ns

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Pulse test: pulse width = 250 μ s, duty cycle ≤ 2%

  2. Essentially independent of operating temperature.

2N7000BU Absolute Maximum Ratings

SymbolParameterValueUnit
V DSSDrain - to - Source Voltage60V
I DContinuous Drain Current (T C = 25 ° C)200mA
I DContinuous Drain Current (T C = 100 ° C)110mA
I DMDrain Current Pulsed (Note 1)1000mA
V GSGate - to - Source Voltage± 30V
T J , T STGOperating Junction and Storage Temperature Range- 55 to 150° C
T LMaximum Lead Temperature for Soldering Purposes, 1/8 - inch from Case for 5 Seconds300° C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

  1. Repetitive rating: pulse width limited by maximum junction temperature.

2N7000BU Thermal Information

(Values are at T A = 25 ° C unless otherwise noted.)

SymbolParameterValueUnit
P DTotal Power Dissipation (T C = 25 ° C)400mW
Linear Derating Factor3.2mW/ ° C
R q JAThermal Resistance, Junction - to - Ambient312.5° C/W
  1. Device mounted on FR -4 PCB, board size = 101.5 mm x 114.5 mm.

Variants on the same datasheet

These parts have exact links to the same datasheet. They are candidates to compare, not verified drop-in replacements; check package, pinout and electrical limits.

Part NumberManufacturerPackage
2N7000onsemiTO-92
2N7000TAonsemiTO-226-3, TO-92-3 (TO-226AA) Formed Leads

More datasheets

All onsemi datasheets (357)

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

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