nRF52832
Bluetooth Low Energy SoCThe nRF52832 is a bluetooth low energy soc from Manufacturer not specified. View the full nRF52832 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
Manufacturer not specified
Category
Bluetooth Low Energy SoC
Package
QFN48, WLCSP
Key Specifications
| Parameter | Value |
|---|---|
| ADC | 12-bit, 200 ksps, 8 configurable channels |
| CPU | ARM Cortex-M4 32-bit with FPU, 64 MHz |
| GPIO Pins | 32 |
| RAM Memory | 64 kB / 32 kB |
| Flash Memory | 512 kB / 256 kB |
| RF Frequency | 2.4 GHz |
| TX Power Range | -20 dBm to +4 dBm |
| Peak RX Current | 5.4 mA |
| Supply Voltage Range | 1.7 V to 3.6 V |
| Peak TX Current (0 DBm) | 5.3 mA |
| Communication Interfaces | 3x SPI master/slave, 2x I2C master/slave, UART (CTS/RTS), I2S, NFC-A tag |
| Package Dimensions QFN48 | 6 x 6 mm |
| Package Dimensions WLCSP | 3.0 x 3.2 mm |
| Bluetooth Low Energy Data Rates | 1 Mbps, 2 Mbps |
| Bluetooth Low Energy Sensitivity | -96 dBm |
| OFF Mode Current (No RAM Retention) | 0.3 μA at 3 V |
| OFF Mode Current (Full 64 KB RAM Retention) | 0.7 μA at 3 V |
| ON Mode Current (No RAM Retention, Wake On RTC) | 1.9 μA at 3 V |
Overview
Part: nRF52832 — Nordic Semiconductor
Type: Bluetooth Low Energy SoC
Description: 32-bit ARM Cortex-M4F MCU at 64 MHz with up to 512 kB Flash, 64 kB RAM, and an integrated 2.4 GHz Bluetooth Low Energy transceiver with -96 dBm sensitivity and +4 dBm TX power.
Operating Conditions:
- Supply voltage: 1.7 V-3.6 V
- Max CPU clock: 64 MHz
- Max ADC sample rate: 200 ksps
Key Specs:
- CPU: ARM Cortex-M4 32-bit processor with FPU, 64 MHz
- Flash memory: Up to 512 kB
- RAM: Up to 64 kB
- Bluetooth low energy sensitivity: -96 dBm
- Bluetooth low energy TX power: -20 to +4 dBm in 4 dB steps
- Peak TX current: 5.3 mA (0 dBm)
- Peak RX current: 5.4 mA
- OFF mode current: 0.3 μA at 3 V
- ADC: 12-bit, 200 ksps
Features:
- 2.4 GHz transceiver
- Flexible power management with LDO and DC/DC regulator system
- Type 2 near field communication (NFC-A) tag
- 32 general purpose I/O pins
- 3x 4-channel pulse width modulator (PWM) units
- Digital microphone interface (PDM)
- Up to 3x SPI master/slave with EasyDMA
- Up to 2x I2C compatible 2-Wire master/slave
- I2S with EasyDMA
- UART (CTS/RTS) with EasyDMA
- AES HW encryption with EasyDMA
Applications:
- Internet of Things (IoT)
- Home automation
- Sensor networks
- Health/fitness sensor and monitor devices
- Medical devices
- Beacons
- Remote controls
- Computer peripherals and I/O devices
Package:
- QFN48 package, 6 × 6 mm
- WLCSP package, 3.0 × 3.2 mm
Features
The TRIGOVRFLW task sets the COUNTER value to 0xFFFFF0 to allow SW test of the overflow condition. OVRFLW occurs when COUNTER overflows from 0xFFFFFF to 0.
Important: The OVRFLW event is disabled by default.
Pin Configuration
Here we cover the pin assignments for each variant of the chip.
Electrical Characteristics
| Symbol | Description | Min. | Typ. | Max. | Units |
|---|---|---|---|---|---|
| f SPIM | Bit rates for SPIM 25 | 8 26 | Mbps | ||
| I SPIM,2Mbps | Run current for SPIM, 2 Mbps | 50 | μA | ||
| I SPIM,8Mbps | Run current for SPIM, 8 Mbps | 50 | μA | ||
| I SPIM,IDLE | Idle current for SPIM (STARTed, no CSN activity) | 1 | μA | ||
| t SPIM,START | Time from START task to transmission started | .. | .. | .. | μs |
Absolute Maximum Ratings
Maximum ratings are the extreme limits to which the chip can be exposed for a limited amount of time without permanently damaging it. Exposure to absolute maximum ratings for prolonged periods of time may affect the reliability of the device.
Table 8: Absolute maximum ratings
| Min. | Max. | Unit | |
|---|---|---|---|
| Supply voltages | |||
| VDD | -0.3 | +3.9 | V |
| VSS | 0 | V | |
| I/O pin voltage | |||
| V I/O , VDD ≤3.6 V | -0.3 | VDD + 0.3 V | V |
| V I/O , VDD >3.6 V | -0.3 | 3.9 V | V |
| NFC antenna pin current | |||
| I NFC1/2 | 80 | mA | |
| Radio | |||
| RF input level | 10 | dBm | |
| Environmental QFN48, 6×6 mmpackage | |||
| Storage temperature | -40 | +125 | °C |
| MSL (moisture sensitivity level) | 2 | ||
| ESD HBM (human body model) | 4 | kV | |
| ESD CDM (charged device model) | 1000 | V | |
| Environmental WLCSP, 3.0×3.2 mmpackage | |||
| Storage temperature | -40 | +125 | °C |
| MSL | 1 | ||
| ESD HBM | 2 | kV | |
| ESD CDM | 500 | V | |
| Flash memory | |||
| Endurance | 10 000 | Write/erase cycles | |
| Retention | 10 years at 40°C |
Recommended Operating Conditions
The operating conditions are the physical parameters that the chip can operate within.
Table 9: Recommended operating conditions
| Symbol | Parameter | Notes | Min. | Nom. | Max. | Units |
|---|---|---|---|---|---|---|
| VDD | Supply voltage, independent of DCDC enable | 1.7 | 3 | 3.6 | V | |
| t R_VDD | Supply rise time (0 V to 1.7 V) | 60 | ms | |||
| TA | Operating temperature | -40 | 25 | 85 | °C |
Important: The on-chip power-on reset circuitry may not function properly for rise times longer than the specified maximum.
Ordering Information
| MPN | Package | Temperature Range | Packing |
|---|---|---|---|
| null | QFN48 | null | null |
| null | WLCSP | null | null |
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| NRF52832-CIAA | Nordic Semiconductor ASA | — |
| NRF52832-QFAA | Manufacturer not specified | — |
| NRF52832-QFAB | Manufacturer not specified | — |
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