TUSB8041RGCR
USB 3.0 HubThe TUSB8041RGCR is a usb 3.0 hub from Texas Instruments. View the full TUSB8041RGCR datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Manufacturer
Texas Instruments
Category
USB 3.0 Hub
Package
VQFN-64 (RGC)
Key Specifications
| Parameter | Value |
|---|---|
| USB Ports | 4 (1 upstream, 4 downstream) |
| USB Standard | USB 3.0 (backward compatible with USB 2.0, high-speed, full-speed, low-speed) |
| Package Dimensions | 9.00 mm x 9.00 mm |
| Clock Input Frequency | 24 MHz |
| Configuration Interfaces | OTP ROM, Serial EEPROM, I2C/SMBus Slave |
| Operating Temperature Range (Commercial) | 0°C to 70°C |
| Operating Temperature Range (Industrial) | -40°C to 85°C |
Overview
Part: TUSB8041
Type: Four-Port USB 3.0 Hub
Description: The TUSB8041 is a four-port USB 3.0 hub that provides simultaneous SuperSpeed USB and high-speed/full-speed connections on the upstream port, and SuperSpeed USB, high-speed, full-speed, or low-speed connections on the downstream ports, supporting per port or ganged power switching, over-current protection, and battery charging applications.
Operating Conditions:
- Operating temperature: 0°C to 70°C (commercial), -40°C to 85°C (industrial)
- Clock input: 24-MHz Crystal or Oscillator
Features:
- Four Port USB 3.0 Hub
- USB 2.0 Hub Features: Multi Transaction Translator (MTT) Hub with four Transaction Translators and four Asynchronous Endpoint Buffers Per Transaction Translator
- Supports Battery Charging: CDP Mode, DCP Mode (complies with Chinese Telecommunications Industry Standard YD/T 1591-2009), D+/D- Divider Mode
- Supports Operation as a USB 3.0 or USB 2.0 Compound Device
- Per Port or Ganged Power Switching and OverCurrent Notification Inputs
- OTP ROM, Serial EEPROM or I2C/SMBus Slave Interface for Custom Configurations (VID, PID, Port Customizations, Manufacturer and Product Strings, Serial Number)
- Provides 128-Bit Universally Unique Identifier (UUID)
- Supports On-Board and In-System OTP/EEPROM Programming Via the USB 2.0 Upstream Port
- Single Clock Input, 24-MHz Crystal or Oscillator
- No Special Driver Requirements
Applications:
- Computer Systems
- Docking Stations
- Monitors
- Set-Top Boxes
Package:
- VQFN (64) - 9.00 mm × 9.00 mm
Features
- 1 · Four Port USB 3.0 Hub
- USB 2.0 Hub Features
- -Multi Transaction Translator (MTT) Hub: Four Transaction Translators
- -Four Asynchronous Endpoint Buffers Per Transaction Translator
- Supports Battery Charging
- -CDP Mode (Upstream Port Connected)
- -DCP Mode (Upstream Port Unconnected)
- -DCP Mode Complies with Chinese Telecommunications Industry Standard YD/T 1591-2009
- -D+/D- Divider Mode
- Supports Operation as a USB 3.0 or USB 2.0 Compound Device
- Per Port or Ganged Power Switching and OverCurrent Notification Inputs
- OTP ROM, Serial EEPROM or I 2 C/SMBus Slave Interface for Custom Configurations:
- -VID and PID
- -Port Customizations
- -Manufacturer and Product Strings (not by OTP ROM)
- -Serial Number (not by OTP ROM)
- Application Feature Selection Using Pin Selection or EEPROM/ or I 2 C/SMBus Slave Interface
- Provides 128-Bit Universally Unique Identifier (UUID)
- Supports On-Board and In-System OTP/EEPROM Programming Via the USB 2.0 Upstream Port
Applications
- Computer Systems
- Docking Stations
- Monitors
- Set-Top Boxes
Pin Configuration
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
| PARAMETER | PARAMETER | OPERATION | TEST CONDITIONS | MIN | MAX | UNIT |
|---|---|---|---|---|---|---|
| V IH | High-level input voltage (1) | VDD33 | 2 | VDD33 | V | |
| V IL | Low-level input voltage (1) | VDD33 | JTAG pins only | 0 0 | 0.8 0.55 | V |
| V I | Input voltage | 0 | VDD33 | V | ||
| V O | Output voltage (2) | 0 | VDD33 | V | ||
| t t | Input transition time (t rise and t fall ) | 0 | 25 | ns | ||
| V hys | Input hysteresis (3) | 0.13 x VDD33 | V | |||
| V OH | High-level output voltage | VDD33 | I OH = -4 mA | 2.4 | V | |
| V OL | Low-level output voltage | VDD33 | I OL = 4 mA | 0.4 | V | |
| I OZ | High-impedance, output current (2) | VDD33 | V I = 0 to VDD33 | ±20 | μA | |
| I OZP | High-impedance, output current with internal pullup or pulldown resistor (4) | VDD33 | V I = 0 to VDD33 | ±250 | μA | |
| I I | Input current (5) | VDD33 | V I = 0 to VDD33 | ±15 | μA |
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Supply Voltage Range | V DD Steady-state supply voltage | -0.3 | 1.4 | V |
| Supply Voltage Range | V DD33 Steady-state supply voltage | -0.3 | 3.8 | V |
| Voltage | USB_SSRXP_UP, USB_SSRXN_UP, USB_SSRXP_DN[4:1], USB_SSRXN_DP[4:1] and USB_VBUS terminals | -0.3 | 1.4 | V |
| Voltage | XI terminals | -0.3 | 2.45 | V |
| Voltage | All other terminals | -0.3 | 3.8 | V |
| Storage temperature, T stg | Storage temperature, T stg | -65 | 150 | °C |
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| VDD (1) | 1.1V supply voltage | 0.99 | 1.1 | 1.26 | V |
| VDD33 | 3.3V supply voltage | 3 | 3.3 | 3.6 | V |
| USB_VBUS | Voltage at USB_VBUS PAD | 0 | 1.155 | V | |
| T A | Operating free-air temperature | 0 | 70 | °C | |
| -40 | 85 | °C | |||
| T J | Operating junction temperature | -40 | 105 | °C |
Thermal Information
| THERMAL METRIC (1) | TUSB8041 RGC | UNIT | |
|---|---|---|---|
| 64 PINS | |||
| R θ JA | Junction-to-ambient thermal resistance (2) | 26 | °C/W |
| R θ JCtop | Junction-to-case (top) thermal resistance (3) | 11.5 | °C/W |
| R θ JB | Junction-to-board thermal resistance (4) | 5.3 | °C/W |
| ψ JT | Junction-to-top characterization parameter (5) | 0.2 | °C/W |
| ψ JB | Junction-to-board characterization parameter (6) | 5.2 | °C/W |
| R θ JCbot | Junction-to-case (bottom) thermal resistance (7) | 1.0 | °C/W |
- (3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
- (4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.
- (5) The junction-to-top characterization parameter, ψ JT , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining R θ JA , using a procedure described in JESD51-2a (sections 6 and 7).
- (6) The junction-to-board characterization parameter, ψ JB , estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining R θ JA , using a procedure described in JESD51-2a (sections 6 and 7).
- (7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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Typical Application
The TUSB8041 is a four-port USB 3.0 compliant hub. It provides simultaneous SuperSpeed USB and highspeed/full-speed connections on the upstream port and provides SuperSpeed USB, high-speed, full-speed, or low speed connections on the downstream port. The TUSB8041 can be used in any application that needs additional USB compliant ports. For example, a specific notebook may only have two downstream USB ports. By using the TUSB8041, the notebook can increase the downstream port count to five.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| TUSB8041 | Texas Instruments | VQFN-64 (RGC) |
| TUSB8041-Q1 | Texas Instruments | — |
| TUSB8041I | Texas Instruments | — |
| TUSB8041IRGCR | Texas Instruments | — |
| TUSB8041IRGCR.A | Texas Instruments | — |
| TUSB8041IRGCT | Texas Instruments | — |
| TUSB8041IRGCT.A | Texas Instruments | — |
| TUSB8041RGCR.A | Texas Instruments | — |
| TUSB8041RGCT | Texas Instruments | — |
| TUSB8041RGCT.A | Texas Instruments | — |
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