TSL25913FN
Light-to-digital converterThe TSL25913FN is a light-to-digital converter from ams-OSRAM. View the full TSL25913FN datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
TSL25913FN shares its datasheet with TSL2591, whose page lists every part number it covers.
Official TSL25913FN datasheet (PDF) — the source this page was extracted from.
Manufacturer
ams-OSRAMCategory
Light-to-digital converter
TSL25913FN Key Specifications
| Parameter | Value |
|---|---|
| Supply Current (Active) | 275 μA (Typ, VDD=3V, TA=25°C, no I2C activity) |
| Supply Current (Sleep) | 2.3 μA (Typ, VDD=3V, TA=25°C) |
| I2C Clock frequency | 400 kHz (Max) |
| Dynamic Range | 600M:1 |
| Programmable Analog Gain | 1×, 25×, 428×, 9876× |
| ADC integration time step size | 101 ms (Typ, ATIME=000b) |
| Dark ADC count value | 25 counts (Max, Ee=0, ATIME=100ms) |
| INT, SDA output low voltage | 0.4 V (Max, 3mA sink current) |
TSL25913FN Overview
Part: ams TSL2591
Type: Light-to-digital converter
Description: A very-high sensitivity light-to-digital converter with dual photodiodes, a 600M:1 dynamic range, programmable analog gain and integration time, and an I2C Fast Mode compatible interface, capable of a 3.0 μA sleep state.
Operating Conditions:
- Supply voltage: 2.7–3.6 V
- Operating free-air temperature: -30 to 70 °C
- I2C clock frequency: 0–400 kHz
Absolute Maximum Ratings:
- Max supply voltage: 3.8 V
- Max output terminal current: 20 mA
- Max storage temperature: -40 to 85 °C
Key Specs:
- Supply Current (Active): 275 μA (Typ, VDD=3V, TA=25°C, no I2C activity)
- Supply Current (Sleep): 2.3 μA (Typ, VDD=3V, TA=25°C)
- I2C Clock frequency: 400 kHz (Max)
- Dynamic Range: 600M:1
- Programmable Analog Gain: 1×, 25×, 428×, 9876×
- ADC integration time step size: 101 ms (Typ, ATIME=000b)
- Dark ADC count value: 25 counts (Max, Ee=0, ATIME=100ms)
- INT, SDA output low voltage: 0.4 V (Max, 3mA sink current)
Features:
- Approximates Human Eye Response
- Dual Diode
- Programmable Analog Gain and Integration Time
- 600M:1 Dynamic Range
- Two Internal Interrupt Sources
- Programmable Upper and Lower Thresholds
- One Interrupt Includes Programmable Persistence Filter
- User Selectable Sleep Mode
- I2C Fast Mode Compatible Interface
- Data Rates up to 400 kbit/s
- Input Voltage Levels Compatible with 3.0V Bus
Applications:
- Approximates human eye response for illuminance (lux) derivation
- Suited for operation behind dark glass
Package:
- ODFN-6
TSL25913FN Pin Configuration
Package FN Dual Flat No-Lead (Top
View): Package drawing is not to scale.
Figure TSL2591 - 4: Pin Description
| Pin Number | Pin Name | Description |
|---|---|---|
| 1 | SCL | I 2 C serial clock input terminal |
| 2 | INT | Interrupt -opendrain output (active low). |
| 3 | GND | Power supply ground. All voltages are referenced to GND. |
| 4 | NC | No connect -donotconnect. |
| 5 | V DD | Supply voltage |
| 6 | SDA | I 2 C serial data I/O terminal |
Figure TSL2591 - 4: Pin Description
TSL25913FN Electrical Characteristics
Figure TSL2591 - 7:
Recommended Operating Conditions
| Symbol | Parameter | Min | Typ | Max | Units |
|---|---|---|---|---|---|
| V DD | Supply voltage | 2.7 | 3 | 3.6 | V |
| T A | Operating free-air temperature | -30 | 70 | °C |
Figure TSL2591 - 8:
Operating Characteristics, V DD =3V, T A =25°C (unless otherwise noted)
| Symbol | Parameter | Conditions | Min | Typ | Max | Units |
|---|---|---|---|---|---|---|
| I DD | Supply Current | Active Sleep state - no I 2 C activity | 275 2.3 | 325 4 | μ A | |
| V OL | INT, SDA output low voltage | 3mAsink current 6mAsink current | 0 0 | 0.4 0.6 | V | |
| I LEAK | Leakage current, SDA, SCL, INT pins | -5 | 5 | μ A | ||
| V IH | SCL, SDA input high voltage | 0.7 V DD | V | |||
| V IL | SCL, SDA input low voltage | 0.3 V DD | V |
All limits are guaranteed. The parameters with min and max values are guaranteed with production tests or SQC (Statistical Quality Control) methods.
Figure TSL2591 - 9:
ALS Characteristics, V DD =3V, T A =25°C, AGAIN = Max, AEN=1, (unless otherwise noted) (Notes 1, 2, 3),
| Parameter | Conditions | Channel | Min | Typ | Max | Units |
|---|---|---|---|---|---|---|
| Dark ADC count value | E e = 0, ATIME=000b (100ms) | CH0 CH1 | 0 0 | 25 25 | counts | |
| ADC integration time step size | ATIME = 000b (100ms) | 95 | 101 | 108 | ms | |
| ADC number of integration steps (Note 4) | 1 | 6 | steps | |||
| ADC counts per step | ATIME = 000b (100ms) | 0 | 37888 | counts | ||
| ADC count value | ATIME = 101b (600ms) | 0 | 65535 | counts | ||
| ADC count value | White light (Note 2) E e = 4.98 μW/cm 2 ATIME = 000b (100 ms) | CH0 CH1 | 25500 | 30000 4996 | 34500 | counts |
| ADC count value | λ p = 850 nm(Note 3) E e = 5.62 μW/cm 2 , ATIME = 000b (100 ms) | CH0 CH1 | 25500 | 30000 19522 | 34500 | counts |
| ADC count value ratio: CH1/CH0 | White light (Note 2) | 0.116 | 0.166 | 0.216 | ||
| ADC count value ratio: CH1/CH0 | λ p = 850 nm(Note 3) | 0.456 | 0.652 | 0.848 | ||
| R e Irradiance responsivity | White light (Note 2) ATIME = 000b (100 ms) | CH0 CH1 | 6024 1003 | counts/ (μW/cm 2 ) | ||
| R e Irradiance responsivity | λ p = 850 nm(Note 3) ATIME = 000b (100 ms) | CH0 CH1 | 5338 3474 | counts/ (μW/cm 2 ) | ||
| Noise (Note 4) | White light (Note 2) E e = 4.98 μW/cm 2 ATIME = 000b (100 ms) | CH0 | 1 | 2 | 1standard deviation | |
| Gain scaling, relative to 1×gain setting | AGAIN = Low AGAIN = Med AGAIN = High AGAIN = Max | 1 25 428 9876 | × |
- Optical measurements are made using small-angle incident radiation from light-emitting diode optical sources. Visible white LEDs and infrared 850 nm LEDs are used for final product testing for compatibility with high-volume production
- The white LED irradiance is supplied by a white light-emitting diode with a nominal color temperature of 4000 K.
- The 850 nm irradiance is supplied by a GaAs light-emitting diode with the following typical characteristics: peak wavelength λ p = 850 nm and spectral halfwidth Δλ½ = 42 nm.
- Parameter ensured by design and is not 100% tested.
TSL25913FN Absolute Maximum Ratings
Figure TSL2591 - 6:
Absolute Maximum Ratings
| Parameter | Min | Max | Units | Comments |
|---|---|---|---|---|
| Supply voltage, V DD | 3.8 | V | All voltages are with respect toGND | |
| Input terminal voltage | -0.5 | 3.8 | V | |
| Output terminal voltage | -0.5 | 3.8 | V | |
| Output terminal current | -1 | 20 | mA | |
| Storage temperature range, T stg | -40 | 85 | °C | |
| ESD tolerance, human body model | 2000 | V |
TSL25913FN Typical Application
Figure TSL2591 - 17:
Typical Application Hardware Circuit
The I 2 C signals and the Interrupt are open-drain outputs and require pull-up resistors. The pull-up resistor (RP) value is a function of the I 2 C bus speed, the I 2 C bus voltage, and the capacitive load. The ams EVM running at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (RPI) can be used for the interrupt line.
Figure TSL2591 - 17 shows a typical hardware application circuit. A 1-μF low-ESR decoupling capacitor should be placed as close as possible to the V DD pin. V BUS in this figure refers to the I 2 C bus voltage, which is equal to V DD .
TSL25913FN Package Information
Figure TSL2591 - 19: FN Package - Dual Flat No-Lead Packaging Configuration
- All linear dimensions are in micrometers.
- The die is centered within the package within a tolerence of ±75 μ m.
- Package top surface is molded with an electrically non-conductive clear plastic compound having an index of refraction of 1.55.
- Contact finish is copper alloy A194 with pre-plated NIPdAu lead finish.
- This package contains no lead (Pb).
- This drawing is subject to change without notice.
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