TPS7A2033DQNR

Part: TPS7A20 from Texas Instruments

Type: Low-Dropout (LDO) Linear Regulator

Key Specs:

• Output current: 300mA
• Output voltage noise: 7μVRMS
• PSRR: 95dB at 1kHz
• Quiescent current (IQ): 6.5μA
• Input voltage range: 1.6V to 6.0V
• Output voltage range: 0.8V to 5.5V
• Output voltage tolerance: ±1.5% (max)
• Dropout voltage: 140mV (max) at 300mA (VOUT = 3.3V)

Features:

• No noise-bypass capacitor required
• Low inrush current
• Smart enable pulldown
• Stable with 1µF minimum ceramic output capacitor
• Ultra-small
• High PSRR
• Excellent load and line transient performance
• Precision reference circuit
• Internal soft-start
• Internally controlled pulldown resistor for EN pin

Applications:

• Smartphones and tablets
• IP network cameras
• Portable medical equipment
• Smart meters and field transmitters
• Motor drives
• Wearables

Package:

• X2SON (DQN): 1mm × 1mm
• DSBGA (YCK): 0.616mm × 0.616mm
• DSBGA (YCJ): 0.612mm × 0.612mm
• SOT23-5 (DBV): 2.9mm × 2.8mm

• Low output voltage noise: 7μVRMS

– No noise-bypass capacitor required

• High PSRR: 95dB at 1kHz

• Very low IQ: 6.5μA

• Input voltage range: 1.6V to 6.0V

• Output voltage range: 0.8V to 5.5V

• Output voltage tolerance: ±1.5% (max)

• Very low dropout:

– 140mV (max) at 300mA (VOUT = 3.3V)

– 145mV (max) at 300mA (VOUT = 3.3V, DBV)

• Low inrush current

• Smart enable pulldown

• Stable with 1µF minimum ceramic output capacitor

• Packages:

– 1mm × 1mm X2SON (DQN)

– 0.616mm × 0.616mm DSBGA (YCK)

– 0.612mm × 0.612mm DSBGA (YCJ)

– 2.9mm × 2.8mm SOT23-5 (DBV)

• Smartphones and tablets
• IP network cameras
• Portable medical equipment
• Smart meters and field transmitters
• Motor drives
• Wearables

Application Schematic

Figure 4-1. YCJ and YCK Packages, 4-Pin DSBGA (Top View)

Figure 4-2. YCJ and YCK Packages, 4-Pin DSBGA (Bottom View)

Pin Functions: DSBGA

| PIN | | I/O | DESCRIPTION | |--------------------------------------|------|--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------|---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------|--|--| | NO. | NAME | | A1
IN
I
device as possible. | | Input voltage supply. For best transient response and to minimize input impedance, use
the nominal value or larger capacitor from IN to ground as listed in the Recommended
Operating Conditions table. Place the input capacitor as close to the IN and GND pins of the | | A2 | OUT | O | Regulated output voltage. A low equivalent series resistance (ESR) capacitor is required
from OUT to ground for stability. For best transient response, use the nominal
recommended value or larger capacitor listed in the Recommended Operating Conditions
table. Place the output capacitor as close to the OUT and GND pins of the device as
possible. | | B1 | EN | I | Enable input. A low voltage (< VEN(LOW)) on this input turns the regulator off and discharges
the output pin to GND. A high voltage (> VEN(HI)) on this pin enables the regulator output.
This pin has an internal 500kΩ pulldown resistor to hold the regulator off by default. When
VEN > VEN(HI), the 500kΩ pulldown is disconnected to reduce input current. | | B2 | GND | — | Common ground. | Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 3

Figure 4-3. DQN Package, 4-Pin X2SON (Top View) Figure 4-4. DBV Package, 5-Pin SOT-23 (Top View)

Pin Functions: X2SON, SOT-23

| | PIN | |-------------|-------|--------|-----|----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------| | NAME | X2SON | SOT-23 | I/O | DESCRIPTION | | IN | 4 | 1 | I | Input voltage supply. For best transient response and to minimize input
impedance, use the nominal value or larger capacitor from IN to ground as listed
in the Recommended Operating Conditions table. Place the input capacitor as
close to the IN and GND pins of the device as possible. | | OUT | 1 | 5 | O | Regulated output voltage. A low equivalent series resistance (ESR) capacitor
is required from OUT to ground for stability. For best transient response, use
the nominal recommended value or larger capacitor listed in the Recommended
Operating Conditions table. Place the output capacitor as close to the OUT and
GND pins of the device as possible. An internal 150Ω (typical) pulldown resistor
prevents a charge from remaining on VOUT when the regulator is in shutdown
mode (VEN< VEN(LOW)). | | EN | 3 | 3 | I | Enable input. A low voltage (< VEN(LOW)) on this pin turns the regulator off and
discharges the output pin to GND. A high voltage (> VEN(HI)) on this pin enables
the regulator output. This pin has an internal 500kΩ pulldown resistor to hold the
regulator off by default. When VEN > VEN(HI), the 500kΩ pulldown is disconnected
to reduce input current. | | GND | 2 | 2 | — | Common ground. | | N/C | — | 4 | — | No internal electrical connection. | | Thermal Pad | 5 | — | — | Thermal pad for the X2SON package. Connect this pad to GND or leave floating.
Do not connect to any potential other than GND. Connect the thermal pad to a
large-area ground plane for best thermal performance. |

at operating temperature range ( $T_J = -40^{\circ}\text{C}$ to +125°C), $V_{IN} = V_{OUT(NOM)} + 0.3 \text{ V}$ or 1.6V, whichever is greater, $V_{EN} = 1.0 \text{ V}$ , $I_{OUT} = 1 \text{ mA}$ , $C_{IN} = 1 \text{ } \mu\text{F}$ , $C_{OUT} = 1 \text{ } \mu\text{F}$ (unless otherwise noted); all typical values are at $T_J = 25^{\circ}\text{C}$

	nA, $C_{IN}$ = 1 $\mu$ F, $C_{OUT}$ = 1 $\mu$ F PARAMETER		TEST CONDITIONS		TYP	MAX	UNIT
		$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}, V_{OUT} \ge 1.85 \text{ V (DQN, YCJ, Y}$		-1.5		1.5	%
A/	Output valtage talerance	$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}, V_{OUT} \ge 2.8 \text{ V (DBV package)}$		-1.5		1.5	70
ΔV OUT	Output voltage tolerance	$V_{IN} = (V_{OUT(NOM)} + 0.5 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}$ $V_{OUT} < 1.85 \text{ V (DQN, YCJ, YCJ)}$		-30		30	mV
		V IN = (V OUT(NOM) + 0.3 V) to I OUT = 1 mA to 300 mA, V OUT < 2.8 V (DBV package)		-40		40	IIIV
$\Delta V_{OUT}$	Line regulation	$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to}$ $I_{OUT} = 1 \text{ mA}$	6.0 V,		0.03		%/V
A) /	Load regulation	I OUT = 1 mA to 300 mA (DQI	I OUT = 1 mA to 300 mA (DQN, YCJ, YCK packages)		13		mV
$\Delta V_{OUT}$	Load regulation	I OUT = 1 mA to 300 mA (DBV	I OUT = 1 mA to 300 mA (DBV package)		19		IIIV
			T J = 25°C		6.5	8.5	μA
la		$V_{EN} = V_{IN} = 6 V,$ $I_{OUT} = 0 \text{ mA}$	$T_J = -40$ °C to 85°C			10
I GND	Quiescent ground current		$T_J = -40^{\circ}\text{C} \text{ to } 125^{\circ}\text{C}$			15
		$V_{EN} = V_{IN} = 6 \text{ V}, I_{OUT} = 300 \text{ r}$	V EN = V IN = 6 V, I OUT = 300 mA		2000
I SHDN	Shutdown ground current	V EN = 0 V (disabled), V IN = 6	.0 V, T J = 25°C		0.07	0.2	μΑ
I GND(DO)	I GND in dropout	V IN ≤ V OUT(NOM) , I OUT = 0 m	nA, V EN = V IN		6.5	15	μΑ
			$0.8 \text{ V} \le \text{V}_{\text{OUT}} < 1.0 \text{ V}^{(1)}$			690
			$1.0 \text{ V} \le \text{V}_{\text{OUT}} < 1.2 \text{ V}^{(1)}$			490	mV
			$1.2 \text{ V} \le \text{V}_{\text{OUT}} < 1.5 \text{ V}^{(1)}$			355
$V_{DO}$		$I_{OUT} = 300 \text{ mA},$ $V_{OUT} = 95% \text{ x } V_{OUT(NOM)},$	1.5 V ≤ V OUT < 2.5 V			200
	Dropout voltage	(DQN, YCJ, YCK packages unless otherwise noted)	1.5 V ≤ V OUT < 2.5 V (DBV)			205
			2.5 V ≤ V OUT < 5.5 V			140
			2.5 V ≤ V OUT < 5.5 V (DBV)			145

over operating free-air temperature range (unless otherwise noted)(1) (3)

		MIN	MAX	UNIT
	VIN	–0.3	6.5
Voltage	VOUT	–0.3	6.5 or VIN + 0.3 (2)	V
	VEN	–0.3	6.5
Current	Maximum output(4)	Internally limited		A
	Operating junction, TJ	–40	150	°C
Temperature	Storage, Tstg	–65	150	°C

• (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
• (2) The maximum value of VOUT is the lesser of 6.5 V or (VIN + 0.3 V).
• (3) All voltages are with respect to the GND pin.
• (4) Internal thermal shutdown circuitry protects the device from permanent damage.

over operating free-air temperature range (unless otherwise noted)(1)

		MIN	NOM MAX	UNIT
VIN	Input supply voltage	1.6	6.0	V
VEN	Enable input voltage	0	6.0	V
VOUT	Nominal output voltage range	0.8	5.5	V
IOUT	Output current	0	300	mA
CIN	Input capacitor(2)		1	µF
COUT	Output capacitor(3)	1	200	µF
ESR	Output capacitor effective series resistance		100	mΩ
TJ	Operating junction temperature	–40	125	°C

• (1) All voltages are with respect to GND.
• (2) An input capacitor is not required for LDO stability. However, an input capacitor with an effective value of 0.47 μF minimum is recommended to counteract the effect of source resistance and inductance, which may in some cases cause symptoms of systemlevel instability such as ringing or oscillation, especially in the presence of load transients.
• (3) Effective output capacitance of 0.47 μF minimum and 200 μF maximum is required for stability.

Copyright © 2024 Texas Instruments Incorporated Submit Document Feedback 5

5.4 Thermal Information

| | | | TPS7A20 | |-----------------------|----------------------------------------------|-----|-------------|----------------|----------------|----------------|------| | THERMAL METRIC(1) | | | BV
T-23) | DQN
(X2SON) | YCJ
(DSBGA) | YCK
(DSBGA) | UNIT | | | | 5 P | PINS | 4 PINS | 4 PINS | 4 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 18 | 37.1 | 166.1 | 199.6 | 201.4 | °C/W | | R _0JC(top) | Junction-to-case (top) thermal resistance | 85 | 5.5 | 103.6 | 2.8 | 2.8 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 54 | 4.4 | 110.6 | 67.5 | 69.3 | °C/W | | Ψ _JT | Junction-to-top characterization parameter | 27 | 7.1 | 3.0 | 1.4 | 1.4 | °C/W | | ΨЈB | Junction-to-board characterization parameter | 54 | 4.1 | 103.3 | 67.4 | 69.2 | °C/W | | $R_{\theta JC(bot)}$ | Junction-to-case (bottom) thermal resistance | N | I/A | 98.8 | N/A | N/A | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

5.5 Electrical Characteristics

at operating temperature range ( $T_J = -40^{\circ}\text{C}$ to +125°C), $V_{IN} = V_{OUT(NOM)} + 0.3 \text{ V}$ or 1.6V, whichever is greater, $V_{EN} = 1.0 \text{ V}$ , $I_{OUT} = 1 \text{ mA}$ , $C_{IN} = 1 \text{ } \mu\text{F}$ , $C_{OUT} = 1 \text{ } \mu\text{F}$ (unless otherwise noted); all typical values are at $T_J = 25^{\circ}\text{C}$

	nA, $C_{IN}$ = 1 $\mu$ F, $C_{OUT}$ = 1 $\mu$ F PARAMETER		TEST CONDITIONS		TYP	MAX	UNIT
		$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}, V_{OUT} \ge 1.85 \text{ V (DQN, YCJ, Y}$		-1.5		1.5	%
A/	Output valtage talerance	$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}, V_{OUT} \ge 2.8 \text{ V (DBV package)}$		-1.5		1.5	70
ΔV OUT	Output voltage tolerance	$V_{IN} = (V_{OUT(NOM)} + 0.5 \text{ V}) \text{ to } I_{OUT} = 1 \text{ mA to } 300 \text{ mA}$ $V_{OUT} < 1.85 \text{ V (DQN, YCJ, YCJ)}$		-30		30	mV
		V IN = (V OUT(NOM) + 0.3 V) to I OUT = 1 mA to 300 mA, V OUT < 2.8 V (DBV package)		-40		40	IIIV
$\Delta V_{OUT}$	Line regulation	$V_{IN} = (V_{OUT(NOM)} + 0.3 \text{ V}) \text{ to}$ $I_{OUT} = 1 \text{ mA}$	6.0 V,		0.03		%/V
A) /	Load regulation	I OUT = 1 mA to 300 mA (DQI	I OUT = 1 mA to 300 mA (DQN, YCJ, YCK packages)		13		mV
$\Delta V_{OUT}$	Load regulation	I OUT = 1 mA to 300 mA (DBV	I OUT = 1 mA to 300 mA (DBV package)		19		IIIV
			T J = 25°C		6.5	8.5	μA
la		$V_{EN} = V_{IN} = 6 V,$ $I_{OUT} = 0 \text{ mA}$	$T_J = -40$ °C to 85°C			10
I GND	Quiescent ground current		$T_J = -40^{\circ}\text{C} \text{ to } 125^{\circ}\text{C}$			15
		$V_{EN} = V_{IN} = 6 \text{ V}, I_{OUT} = 300 \text{ r}$	V EN = V IN = 6 V, I OUT = 300 mA		2000
I SHDN	Shutdown ground current	V EN = 0 V (disabled), V IN = 6	.0 V, T J = 25°C		0.07	0.2	μΑ
I GND(DO)	I GND in dropout	V IN ≤ V OUT(NOM) , I OUT = 0 m	nA, V EN = V IN		6.5	15	μΑ
			$0.8 \text{ V} \le \text{V}_{\text{OUT}} < 1.0 \text{ V}^{(1)}$			690
			$1.0 \text{ V} \le \text{V}_{\text{OUT}} < 1.2 \text{ V}^{(1)}$			490	mV
			$1.2 \text{ V} \le \text{V}_{\text{OUT}} < 1.5 \text{ V}^{(1)}$			355
$V_{DO}$		$I_{OUT} = 300 \text{ mA},$ $V_{OUT} = 95% \text{ x } V_{OUT(NOM)},$	1.5 V ≤ V OUT < 2.5 V			200
	Dropout voltage	(DQN, YCJ, YCK packages unless otherwise noted)	1.5 V ≤ V OUT < 2.5 V (DBV)			205
			2.5 V ≤ V OUT < 5.5 V			140
			2.5 V ≤ V OUT < 5.5 V (DBV)			145

| | | | TPS7A20 | |-----------------------|----------------------------------------------|-----|-------------|----------------|----------------|----------------|------| | THERMAL METRIC(1) | | | BV
T-23) | DQN
(X2SON) | YCJ
(DSBGA) | YCK
(DSBGA) | UNIT | | | | 5 P | PINS | 4 PINS | 4 PINS | 4 PINS | | $R_{\theta JA}$ | Junction-to-ambient thermal resistance | 18 | 37.1 | 166.1 | 199.6 | 201.4 | °C/W | | R _0JC(top) | Junction-to-case (top) thermal resistance | 85 | 5.5 | 103.6 | 2.8 | 2.8 | °C/W | | $R_{\theta JB}$ | Junction-to-board thermal resistance | 54 | 4.4 | 110.6 | 67.5 | 69.3 | °C/W | | Ψ _JT | Junction-to-top characterization parameter | 27 | 7.1 | 3.0 | 1.4 | 1.4 | °C/W | | ΨЈB | Junction-to-board characterization parameter | 54 | 4.1 | 103.3 | 67.4 | 69.2 | °C/W | | $R_{\theta JC(bot)}$ | Junction-to-case (bottom) thermal resistance | N | I/A | 98.8 | N/A | N/A | °C/W |

⁽¹⁾ For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.