TPS6284X

TPS62840 1.8-V to 6.5-V, 750-mA, 60-nA IQ Step-Down Converter

Manufacturer

Texas Instruments

Overview

Part: TPS62840 from Texas Instruments

Type: Step-Down Converter

Key Specs:

  • Operating quiescent current: 60 nA
  • Input voltage range: 1.8 V to 6.5 V
  • Output current: up to 750 mA
  • 100% duty-cycle mode IQ: 120 nA
  • Shutdown current: 25 nA
  • Efficiency: 80% at 1 μA I_OUT (3.6 V_IN to 1.8 V_OUT)
  • Switching frequency: 1.8 MHz

Features:

  • 60-nA operating quiescent current
  • 100% duty-cycle mode with 120-nA IQ
  • Input voltage range VIN from 1.8 V to 6.5 V
  • Output current up to 750 mA
  • RF friendly DCS-Control™
  • 80% efficiency at 1 μA IOUT (3.6 VIN to 1.8 VOUT)
  • 16 selectable output voltages via VSET pin
  • Auto transition PFM/PWM or forced-PWM mode
  • Selectable forced PWM and STOP modes
  • Output discharge function
  • 25-nA shutdown current
  • SON-8, WCSP-6 and thermally enhanced HVSSOP-8 packages

Applications:

  • Smart meters, smart thermostats
  • Asset tracking devices
  • Wearable electronics
  • Medical sensor patches and patient monitors
  • Industrial IoT (smart sensors) / NB-IoT
  • Test and measurement
  • ATEX / intrinsic safety

Package:

  • 8 pin DLC (SON): 1.5 mm x 2 mm
  • 6 pin YBG (WCSP): 0.97 mm x 1.47 mm
  • 8 pin DGR (HVSSOP): 3 mm x 5 mm

Features

  • 60-nA operating quiescent current
  • 100% duty-cycle mode with 120-nA IO
  • Input voltage range VIN from 1.8 V to 6.5 V
  • Output current up to 750 mA
  • RF friendly DCS-Control™
  • 80% efficiency at 1 μ A IOUT (3.6 VIN to 1.8 VOUT)
  • 16 selectable output voltages via VSET pin
  • Auto transition PFM/PWM or forced-PWM mode
  • Selectable forced PWM and STOP modes
  • Output discharge function
  • 25-nA shutdown current
  • SON-8, WCSP-6 and thermally enhanced HVSSOP-8 packages

Applications

  • Smart meters, smart thermostats
  • Asset tracking devices
  • Wearable electronics
  • Medical sensor patches and patient monitors
  • Industrial IoT (smart sensors) / NB-IoT
  • Test and measurement
  • ATEX / intrinsic safety

3 Description

The TPS62840 is a high-efficiency step-down converter with ultra-low operating quiescent current of typically 60 nA. The device contains special circuitry to achieve just 120 nA IQ in 100% mode to further extend battery life near the end of discharge.

The device uses DCS-Control to cleanly power radios and operates with a typical switching frequency of 1.8 MHz. In Power-Save Mode, the device extends the light load efficiency down to a load current range of 1 μA and below.

16 predefined output voltages can be selected by connecting a resistor to pin VSET, making the device flexible for various applications with a minimum amount of external components.

The STOP pin of the device immediately eliminates any switching noise in order to take a noise-free measurement in test and measurement systems.

The TPS62840 provides an output current of up to 750 mA. With an input voltage of 1.8 V to 6.5 V, the device supports multiple power sources such as 2S to 4S Alkaline, 1S to 2S Li-MnO2, or 1S Li-Ion/Li-SOCl2.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
8 pin DLC (SON)1.5 mm x 2 mm
TPS6284x6 pin YBG (WCSP)0.97 mm x 1.47 mm
11 0020 IX8 pin DGR
(HVSSOP)		3 mm x 5 mm

(1) For all available packages, see the orderable addendum at the end of the datasheet.

Pin Configuration

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Pin Functions

PIN
NAMEDLC
(SON-8)		DGR
(HVSSOP-8)
VIN26
SW72
GND18
VSET54
VOS81
EN45
STOP6n/a
MODE33
NCn/a7
EPn/a9

(1) For more information about the PowerPAD, see the PowerPAD™ Thermally Enhanced Package application report.

Electrical Characteristics

VIN = 3.6 V, TJ = –40°C to 125°C, STOP = GND, MODE = GND, typical values are at TJ = 25°C (unless otherwise noted)

PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY
IQ_NO_LOADNo load
operating input current		EN = VIN, IOUT = 0μA, VOUT = 1.8V
device switching		60nA
IQ_NO_LOADNo load
operating input current		EN = VIN, IOUT = 0μA, VOUT = 1.2V
device switching		80nA
IQ_NO_LOADNo load
operating input current
(PWM Mode)		EN = VIN, IOUT = 0μA, VOUT = 1.8V, MODE = VIN
device switching		3mA
IQ_VINOperating quiescent current into pin VINEN = VIN, IOUT = 0μA, VOUT = 1.55V or VOUT =
1.8V
device not switching, TJ = 25°C
(DLC package option)		36100nA
IQ_VOSOperating quiescent current into pin VOSEN = VIN, IOUT = 0μA, VOUT = 1.55V or VOUT =
1.8V
device not switching, TJ = 25°C
(DLC package option)		56120nA
IQ_VINOperating quiescent current into pin VINEN = VIN, IOUT = 0μA, VOUT = 1.55V or VOUT =
1.8V
device not switching, TJ = -40°C to 85°C		36360nA
IQ_VOSOperating quiescent current into pin VOSEN = VIN, IOUT = 0μA, VOUT = 1.55V or VOUT =
1.8V
device not switching, TJ = -40°C to 85°C		56170nA
EN = VIN, VOUT = 3.3V
device not switching		70nA
IQ_VOSOperating quiescent current into VOS pinEN = VIN, VOUT < 1.5 V
device not switching		5nA
EN, STOP = VIN, 3V < VOUT < 3.3V
TJ = -40°C to 85°C		5100nA
IQ_100%_MODEOperating quiescent current 100% ModeVIN = VOUT = 3.3V, TJ = -40°C to 85°C120nA
IQ_VIN_STOPOperating quiescent current into pin VINSTOP = High, VOUT = 1.8V, TJ = -40°C to 85°C70175μA
ISDShutdown currentEN = GND, shutdown current into VIN
VSET = GND, TJ = -40°C to 85°C		25300nA
VTH_UVLO+Rising VIN1.721.8V
VTH_UVLO–Undervoltage lockout thresholdFalling VIN1.451.75V
EN, MODE, STOP INPUTS
VIH_THHigh level input voltage1.1V
VIL_THLow level input voltage0.4V
IINInput bias currentMODE input, TJ = -40°C to 85°C125nA
RPDInternal pull-down resistanceEN, STOP inputs200450kΩ

Absolute Maximum Ratings

MINMAXUNIT
VIN–0.37V
SW (DC)–0.3VIN + 0.3V
SW (AC), less than 10ns(3)–2.08.5V
Pin voltage(2)EN, MODE, STOP–0.36.5V
VSET–0.3VIN + 0.3 < 3.6V
VOS–0.33.7V
Operating junction temperature, TJ–40150°C
Storage temperature, Tstg–65150°C
  • (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
  • (2) All voltage values are with respect to network ground terminal GND.
  • (3) While switching.

7.2 ESD Ratings

VALUEUNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)±2000
V(ESD)Electrostatic dischargeCharged device model (CDM), per JEDEC specification JESD22-C101, all
pins(2)		±500V
  • (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
  • (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

Recommended Operating Conditions

MINNOMMAXUNIT
VINSupply voltage VIN1.86.5V
LEffective inductance1.512.22.9μH
COUTEffective output capacitance31040μF
CINEffective input capacitance14.7μF
CVSETExternal parasitic capacitance at VSET pin100pF
Nominal resistance range for external voltage selection resistor (E96 resistor series)0.909267kΩ
RSETExternal voltage selection resistor tolerance1%
External voltage selection resistor temperature coefficient±200ppm/°C
TJOperating junction temperature range-40125°C

7.4 Thermal Information

THERMAL METRIC(1)8 Pins DLC
Package		6 Pins YBG
Package		8 Pins DGR
Package		DGR EVMUNIT
JEDEC PCB 51-7JEDEC PCB 51-5TPS62841-2EVM123
RθJAJunction-to-ambient thermal resistance105.6133.454.446.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance75.70.458.1N/A°C/W
RθJBJunction-to-board thermal resistance31.939.425.9N/A°C/W
ψJTJunction-to-top characterization parameter2.30.11.20.9°C/W
ψJBJunction-to-board characterization parameter31.539.425.917.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/a11.7N/A°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Thermal Information

THERMAL METRIC(1)8 Pins DLC
Package		6 Pins YBG
Package		8 Pins DGR
Package		DGR EVMUNIT
JEDEC PCB 51-7JEDEC PCB 51-5TPS62841-2EVM123
RθJAJunction-to-ambient thermal resistance105.6133.454.446.9°C/W
RθJC(top)Junction-to-case (top) thermal resistance75.70.458.1N/A°C/W
RθJBJunction-to-board thermal resistance31.939.425.9N/A°C/W
ψJTJunction-to-top characterization parameter2.30.11.20.9°C/W
ψJBJunction-to-board characterization parameter31.539.425.917.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistancen/an/a11.7N/A°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

Related Variants

The following components are covered by the same datasheet.

Part NumberManufacturerPackage
TPS62840Texas Instruments—
TPS62840DLCTexas Instruments—
TPS62840DLCRTexas Instruments—
TPS62840DLCR.ATexas Instruments—
TPS62840DLCR.BTexas Instruments—
TPS62840YBGTexas Instruments—
TPS62840YBGRTexas Instruments
TPS62840YBGR.ATexas Instruments—
TPS62841Texas Instruments—
TPS62842Texas Instruments—
TPS62849Texas Instruments—
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