TPD2E2U06
TPD2E2U06-Q1 Automotive Dual-Channel High-Speed ESD Protection Device [SLLSEJ9E](https://www.ti.com/lit/pdf/SLLSEJ9) – DECEMBER 2014 – REVISED OCTOBER 2022
Manufacturer
unknown
Overview
Part: TPD2E2U06-Q1 from Texas Instruments
Type: Automotive Dual-Channel High-Speed ESD Protection Device
Key Specs:
- ESD Protection (IEC 61000-4-2): ±25-kV (contact), ±30-kV (air-gap)
- ESD Protection (ISO 10605): ±20-kV (contact), ±25-kV (air-gap)
- IO capacitance: 1.5-pF (typical)
- DC breakdown voltage: 6.5 V (minimum)
- Leakage current: 10-nA (maximum)
- Operating temperature range: –40°C to +125°C
- Peak pulse current (8/20 μs): 5.5 A (maximum)
- Peak pulse power (8/20 μs): 75 W (maximum)
Features:
- AEC-Q101 qualified
- IEC 61000-4-2 Level 4 ESD protection
- ISO 10605 (330 pF, 330 Ω) ESD protection
- Low ESD clamping voltage
- Small easy-to-route DBZ and DCK packages
Applications:
- Head units
- Rear seat entertainment
- Telematics
- Navigation modules
- Media interfaces
- USB 2.0
- Ethernet™
- Antenna
- LVDS
- I 2C
Package:
- DBZ (SOT23, 3): 2.92 mm × 1.30 mm
- DCK (SC70, 3): 2.00 mm × 1.25 mm
Features
- AEC-Q101 qualified
- IEC 61000-4-2 Level 4 ESD protection
- ±25-kV (contact discharge)
- ±30-kV (air-gap discharge)
- ISO 10605 (330 pF, 330 Ω) ESD protection
- ±20-kV (contact discharge)
- ±25-kV (air-gap discharge)
- IO capacitance 1.5-pF (typical)
- DC breakdown voltage 6.5 V (minimum)
- Ultra-low leakage current 10-nA (maximum)
- Low ESD clamping voltage
- Industrial temperature range: –40°C to +125°C
- Small easy-to-route DBZ and DCK packages
Applications
- End equipment:
- Interfaces:
3 Description
The TPD2E2U06-Q1 is a Transient Voltage Suppressor (TVS) Electrostatic Discharge (ESD) protection diode array with low capacitance. This dual-channel ESD protection diode is rated to dissipate ESD strikes above the maximum level specified in the IEC 61000-4-2 international standard. The 1.5-pF line capacitance of the TPD2E2U06-Q1 makes it ideal for protecting interfaces such as USB 2.0, Ethernet, LVDS, antenna, and I2C.
Package Information(1)
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| TPD2E2U06-Q1 | DBZ (SOT23, 3) | 2.92 mm × 1.30 mm |
| DCK (SC70, 3) | 2.00 mm × 1.25 mm |
(1) For all available packages, see the orderable addendum at the end of the data sheet.
Simplified Schematic
Table of Contents
| 1 Features1 | 7.4 Device Functional Modes9 |
|---|---|
| 2 Applications1 | 8 Application and Implementation10 |
| 3 Description1 | 8.1 Application Information 10 |
| 4 Revision History 2 | 8.2 Typical Application 10 |
| 5 Pin Configuration and Functions3 | 9 Power Supply Recommendations11 |
| 6 Specifications 4 | 10 Layout12 |
| 6.1 Absolute Maximum Ratings 4 | 10.1 Layout Guidelines 12 |
| 6.2 ESD Ratings—AEC Specification4 | 10.2 Layout Example 12 |
| 6.3 ESD Ratings—IEC Specification 4 | 11 Device and Documentation Support13 |
| 6.4 ESD Ratings—ISO Specification 4 | 11.1 Documentation Support 13 |
| 6.5 Recommended Operating Conditions4 | 11.2 Receiving Notification of Documentation Updates 13 |
| 6.6 Thermal Information5 | 11.3 Support Resources 13 |
| 6.7 Electrical Characteristics5 | 11.4 Trademarks 13 |
| 6.8 Typical Characteristics6 | 11.5 Electrostatic Discharge Caution 13 |
| 7 Detailed Description8 | 11.6 Glossary 13 |
| 7.1 Overview8 | 12 Mechanical, Packaging, and Orderable |
| 7.2 Functional Block Diagram8 | Information 13 |
| 7.3 Feature Description8 | |
| Changes from Revision D (May 2016) to Revision E (October 2022) | Page |
| ------------------------------------------------------------------------------------------------------ | ------ |
| • Updated the numbering format for tables, figures, and cross-references throughout the document1 | |
| • Updated the Surge Curve (tp = 8/20 μs) IO to GND figure | 6 |
| Changes from Revision C (March 2016) to Revision D (May 2016) | Page |
| • Updated Features, Applications, and Description 1 | |
| • Updated the ESD Ratings—AEC Specification table | 1 |
| Changes from Revision B (December 2014) to Revision C (March 2016) | Page |
| • Added DCK package1 | |
| • Added DCK thermal data in the Thermal Information table1 | |
| Changes from Revision A (December 2014) to Revision B (December 2014) | Page |
| • Added temperature specification to VBR TEST CONDITIONS | 5 |
| Changes from Revision * (December 2014) to Revision A (December 2014) | Page |
| • Initial release of full document1 | |
| Product Folder Links: TPD2E2U06-Q1 |
Pin Configuration
Figure 5-1. DBZ Package, 3-Pin SOT23 (Top View)
Figure 5-2. DCK Package, 3-Pin SC70 (Top View)
Table 5-1. Pin Functions
| PIN | TYPE(1) | |
|---|---|---|
| NAME | NO. | |
| IO1 | 1 | I/O |
| IO2 | 2 | I/O |
| GND | 3 | G |
(1) I = input, O = output, G = ground
Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VRWM | Reverse stand-off voltage | IIO < 10 μA | 5.5 | V | ||
| IPP = 1 A, TLP(1) (3) | 9.7 | |||||
| VCLAMP IO to GND | IPP = 5 A, TLP(1) (3) | 12.4 | V | |||
| IPP = 1 A, TLP(1) (3) | 1.9 | |||||
| VCLAMP | GND to IO | IPP = 5 A, TLP(1) (3) | 4 | V | ||
| IO to GND(2) (3) | 0.6 | |||||
| RDYN | Dynamic resistance | GND to IO(2) (3) | 0.4 | Ω | ||
| CL | Line capacitance | f = 1 MHz, VBIAS = 2.5 V(3) | 1.5 | 1.9 | pF | |
| CCROSS | Channel-to-channel input capacitance | Pin 3 = 0 V, f = 1 MHz, VBIAS = 2.5 V, between channel pins(3) | 0.02 | 0.03 | pF | |
| ∆CL | Variation of channel input capacitance | Pin 3 = 0 V, f = 1 MHz, VBIAS = 2.5 V, Pin 1 to GND – Pin 2 to GND(3) | 0.03 | 0.1 | pF | |
| VBR | Break-down voltage | IIO = 1 mA(3) | 6.5 | 8.5 | V | |
| ILEAK | Leakage current | VIO = 2.5 V | 1 | 10 | nA |
(1) Transmission Line Pulse with 10-ns rise time, 100-ns width.
(2) Extraction of RDYN Using least squares fit of TLP characteristics between I = 20 A and I = 30 A.
(3) Measured at 25°C.
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| IPP | Peak pulse current (tp = 8/20 μs) | 5.5(2) | A | |
| PPP | Peak pulse power (tp = 8/20 μs) | 75(2) | W | |
| TJ | Junction temperature | –40 | 125 | °C |
| Tstg | Storage temperature | –65 | 150 | °C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VIO | Input pin voltage | 0 | 5.5 | V |
| TA | Operating free air temperature | –40 | 125 | °C |
Product Folder Links: TPD2E2U06-Q1
(2) Measured at 25°C.
6.6 Thermal Information
| TPD2E2U06-Q1 | ||
|---|---|---|
| THERMAL METRIC(1) | DBZ (SOT23) | |
| 3 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 439.5 |
| RθJC(top) | Junction-to-case (top) thermal resistance | 194.9 |
| RθJB | Junction-to-board thermal resistance | 173.9 |
| ψJT | Junction-to-top characterization parameter | 53.7 |
| ψJB | Junction-to-board characterization parameter | 172 |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
Thermal Information
| TPD2E2U06-Q1 | ||
|---|---|---|
| THERMAL METRIC(1) | DBZ (SOT23) | |
| 3 PINS | ||
| RθJA | Junction-to-ambient thermal resistance | 439.5 |
| RθJC(top) | Junction-to-case (top) thermal resistance | 194.9 |
| RθJB | Junction-to-board thermal resistance | 173.9 |
| ψJT | Junction-to-top characterization parameter | 53.7 |
| ψJB | Junction-to-board characterization parameter | 172 |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
Get structured datasheet data via API
Get started free