TPD2E2U06
ESD Protection DeviceThe TPD2E2U06 is a esd protection device from Texas Instruments. View the full TPD2E2U06 datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Official TPD2E2U06 datasheet (PDF) — the source this page was extracted from.
Manufacturer
Texas InstrumentsCategory
DiodesTPD2E2U06 Key Specifications
| Parameter | Value |
|---|---|
| Qualification | AEC-Q101 |
| Package Options | DBZ (SOT-23-3, 2.92 mm × 1.30 mm), DCK (SC70-3, 2.00 mm × 1.25 mm) |
| Number Of Channels | 2 |
| IO Capacitance (Typical) | 1.5 pF |
| Leakage Current (Maximum) | 10 nA |
| Operating Temperature Range | -40°C to +125°C |
| DC Breakdown Voltage (Minimum) | 6.5 V |
| ESD Protection (IEC 61000-4-2 Air-Gap) | ±30 kV |
| ESD Protection (IEC 61000-4-2 Contact) | ±25 kV |
| ESD Protection (ISO 10605, 330 PF/330 Ω Air-Gap) | ±25 kV |
| ESD Protection (ISO 10605, 330 PF/330 Ω Contact) | ±20 kV |
TPD2E2U06 Overview
Part: TPD2E2U06-Q1 — Texas Instruments
Type: Automotive Dual-Channel TVS ESD Protection Diode Array
Description: Dual-channel, low-capacitance (1.5 pF typ) automotive ESD protection diode array with 5.5 V reverse stand-off voltage, ±25 kV contact / ±30 kV air-gap IEC 61000-4-2 protection, and AEC-Q101 qualification.
Operating Conditions:
- Supply voltage: not applicable (passive protection device)
- Input pin voltage (V_IO): 0–5.5 V
- Operating temperature: -40 to 125 °C
Absolute Maximum Ratings:
- Peak pulse current (tp = 8/20 μs): 5.5 A
- Peak pulse power (tp = 8/20 μs): 75 W
- Junction temperature: -40 to 125 °C
- Storage temperature: -65 to 150 °C
Key Specs:
- Reverse stand-off voltage (V_RWM): 5.5 V max at I_IO < 10 μA
- Breakdown voltage (V_BR): 6.5 V min, 8.5 V max at I_IO = 1 mA
- Line capacitance (C_L): 1.5 pF typ, 1.9 pF max (f = 1 MHz, V_BIAS = 2.5 V)
- Channel-to-channel capacitance: 0.02 pF typ, 0.03 pF max
- Leakage current: 1 nA typ, 10 nA max at V_IO = 2.5 V
- Clamping voltage IO to GND (TLP): 9.7 V typ at 1 A; 12.4 V typ at 5 A
- Dynamic resistance: 0.6 Ω typ (IO to GND), 0.4 Ω typ (GND to IO)
- ESD ratings: HBM ±10 kV, CDM ±1 kV (AEC); ISO 10605 (330 pF, 330 Ω) ±20 kV contact / ±25 kV air
Features:
- AEC-Q101 qualified
- IEC 61000-4-2 Level 4: ±25 kV contact, ±30 kV air-gap
- ISO 10605 ESD protection: ±20 kV contact, ±25 kV air-gap
- Supports data rates in excess of 1.5 Gbps
- Low ESD clamping voltage
- Small, easy-to-route flow-through DBZ and DCK packages
Applications:
- Head units
- Rear seat entertainment
- Telematics
- Navigation modules
- Media interfaces
- USB 2.0, Ethernet, antenna, LVDS and I²C interfaces
Package:
- DBZ (SOT23, 3 pins), 2.92 mm × 1.30 mm
- DCK (SC70, 3 pins), 2.00 mm × 1.25 mm
TPD2E2U06 Features
- AEC-Q101 qualified
- IEC 61000-4-2 Level 4 ESD protection
- -±25-kV (contact discharge)
- -±30-kV (air-gap discharge)
- ISO 10605 (330 pF, 330 Ω) ESD protection
- -±20-kV (contact discharge)
- -±25-kV (air-gap discharge)
- IO capacitance 1.5-pF (typical)
- DC breakdown voltage 6.5 V (minimum)
- Ultra-low leakage current 10-nA (maximum)
- Low ESD clamping voltage
- Industrial temperature range: -40°C to +125°C
- Small easy-to-route DBZ and DCK packages
TPD2E2U06 Applications
- End equipment:
- -Head units
- -Rear seat entertainment
- -Telematics
- -Navigation modules
- -Media interfaces
- Interfaces:
- -USB 2.0
- -Ethernet ™
- -Antenna
- -LVDS
- -I 2 C
TPD2E2U06 Pin Configuration
Figure 5-1. DBZ Package, 3-Pin SOT23 (Top View)
Figure 5-2. DCK Package, 3-Pin SC70 (Top View)
Table 5-1. Pin Functions
| PIN - NAME | PIN - NO. | TYPE (1) | DESCRIPTION |
|---|---|---|---|
| IO1 | 1 | I/O | The IO1 and IO2 pins are an ESD protected channel. Connect these pins to the data line as close to the connector as possible. |
| IO2 | 2 | I/O | The IO1 and IO2 pins are an ESD protected channel. Connect these pins to the data line as close to the connector as possible. |
| GND | 3 | G | The GND (ground) pin is connected to ground. |
- (1) I = input, O = output, G = ground
TPD2E2U06 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
| PARAMETER | PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|---|
| V RWM | Reverse stand-off voltage | I IO < 10 μA | 5.5 | V | ||
| V CLAMP | IO to GND | I PP = 1 A, TLP (1) (3) | 9.7 | V | ||
| V CLAMP | IO to GND | I PP = 5 A, TLP (1) (3) | 12.4 | V | ||
| V CLAMP | GND to IO | I PP = 1 A, TLP (1) (3) | 1.9 | V | ||
| V CLAMP | GND to IO | I PP = 5 A, TLP (1) (3) | 4 | V | ||
| R DYN | Dynamic resistance | IO to GND (2) (3) | 0.6 | Ω | ||
| R DYN | Dynamic resistance | GND to IO (2) (3) | 0.4 | Ω | ||
| C L | Line capacitance | f = 1 MHz, V BIAS = 2.5 V (3) | 1.5 | 1.9 | pF | |
| C CROSS | Channel-to-channel input capacitance | Pin 3 = 0 V, f = 1 MHz, V BIAS = 2.5 V, between channel pins (3) | 0.02 | 0.03 | pF | |
| ∆ CL | Variation of channel input capacitance | Pin 3 = 0 V, f = 1 MHz, V BIAS = 2.5 V, Pin 1 to GND - Pin 2 to GND (3) | 0.03 | 0.1 | pF | |
| V BR | Break-down voltage | I IO = 1 mA (3) | 6.5 | 8.5 | V | |
| I LEAK | Leakage current | V IO = 2.5 V | 1 | 10 | nA |
TPD2E2U06 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| I PP | Peak pulse current (t p = 8/20 μs) | 5.5 (2) | A | |
| P PP | Peak pulse power (t p = 8/20 μs) | 75 (2) | W | |
| T J | Junction temperature | -40 | 125 | °C |
| T stg | Storage temperature | -65 | 150 | °C |
TPD2E2U06 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| V IO | Input pin voltage | 0 | 5.5 | V |
| T A | Operating free air temperature | -40 | 125 | °C |
TPD2E2U06 Thermal Information
| THERMAL METRIC (1) | TPD2E2U06-Q1 - DBZ (SOT23) - 3 PINS | TPD2E2U06-Q1 - DCK (SC70) - 3 PINS | UNIT | |
|---|---|---|---|---|
| R θJA | Junction-to-ambient thermal resistance | 439.5 | 308.3 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 194.9 | 170.7 | °C/W |
| R θJB | Junction-to-board thermal resistance | 173.9 | 89.2 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 53.7 | 34.2 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 172 | 88.6 | °C/W |
| R θJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |
TPD2E2U06 Typical Application
The TPD2E2U06-Q1 device is a diode type TVS which is typically used to provide a path to ground for dissipating ESD events on hi-speed signal lines between a human interface connector and a system. As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to the protected IC. The low RDYN of the triggered TVS holds this voltage, VCLAMP, to a safe level for the protected IC.
TPD2E2U06 Package Information
| PART NUMBER | PACKAGE | BODY SIZE (NOM) |
|---|---|---|
| TPD2E2U06-Q1 | DBZ (SOT23, 3) | 2.92 mm × 1.30 mm |
| TPD2E2U06-Q1 | DCK (SC70, 3) | 2.00 mm × 1.25 mm |
- (1) For all available packages, see the orderable addendum at the end of the data sheet.
Copyright © 2016, Texas Instruments Incorporated
More part numbers on this datasheet
Their pages show this same datasheet. Some are linked through their part family rather than checked part by part, so confirm the exact part in the ordering information.
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All Diodes datasheetsAll Texas Instruments datasheets (2,442)
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