Part: TPA2016D2 — Texas Instruments

Type: Stereo Class-D Audio Amplifier

Description: A stereo, filter-free Class-D audio power amplifier with a 2.5 V to 5.5 V supply range, capable of driving 2.8 W/Ch into 4 Ω at 5 V or 1.7 W/Ch into 8 Ω at 5 V, featuring programmable Dynamic Range Compression (DRC) and Automatic Gain Control (AGC) via I2C.

Operating Conditions:

• Supply voltage: 2.5 V to 5.5 V
• Operating temperature: -40 to 85 °C
• Minimum load resistance: 3.2 Ω

Absolute Maximum Ratings:

• Max supply voltage: 6 V
• Max junction temperature: 150 °C
• Max storage temperature: 150 °C

Key Specs:

• Supply current (I_DD): 3.7 mA (Typ, VDD = 3.6 V)
• Shutdown quiescent current (I_SDZ): 0.2 μA (Typ, VDD = 3.6 V)
• Class D Switching Frequency (f_SW): 300 kHz (Typ)
• Start-up time (t_START): 5 ms (Typ)
• Output offset voltage (V_oo): 2 mV (Typ, VDD = 3.6 V)
• Power supply rejection ratio (PSRR): -80 dB (Typ, VDD = 2.5 V to 4.7 V)
• Maximum output power (Po max): 2.8 W (Typ, THD+N = 10%, VDD = 5 V, RL = 4 Ω)
• Efficiency (η): 90% (Typ, THD+N = 1%, VDD = 3.6 V, RL = 8 Ω, PO = 0.63W)

Features:

• Filter-Free Class-D Architecture
• Power Supply Range: 2.5 V to 5.5 V
• Flexible Operation With or Without I2C
• Programmable DRC and AGC Parameters
• Digital I2C Volume Control
• Selectable Gain from -28 dB to 30 dB in 1-dB Steps
• Low Supply Current: 3.5 mA
• Low Shutdown Current: 0.2 μA
• High PSRR: 80 dB
• Fast Start-Up Time: 5 ms
• Short-Circuit and Thermal Protection

Applications:

• Wireless or Cellular Handsets and PDAs
• Portable Navigation Devices
• Portable DVD Players
• Notebook PCs
• Portable Radios
• Portable Games
• Educational Toys
• USB Speakers

Package:

• DSBGA (16) - 2.20 mm × 2.20 mm
• QFN (20) - 4.00 mm × 4.00 mm

• 1 · Filter-Free Class-D Architecture
• 1.7 W/Ch Into 8 Ω at 5 V (10% THD+N)
• 750 mW/Ch Into 8 Ω at 3.6 V (10% THD+N)
• 2.8 W/Ch Into 4 Ω at 5 V (10% THD+N)
• 1.5 W/Ch Into 4 Ω at 3.6 V (10% THD+N)
• Power Supply Range: 2.5 V to 5.5 V
• Flexible Operation With or Without I 2 C
• Programmable DRC and AGC Parameters
• Digital I 2 C Volume Control
• Selectable Gain from -28 dB to 30 dB in 1-dB Steps (When Compression is Used)
• Selectable Attack, Release, and Hold Times
• 4 Selectable Compression Ratios
• Low Supply Current: 3.5 mA
• Low Shutdown Current: 0.2 μ A
• High PSRR: 80 dB
• Fast Start-Up Time: 5 ms
• AGC Enable or Disable Function
• Limiter Enable or Disable Function
• Short-Circuit and Thermal Protection
• Space-Saving Package
• -2.2 mm × 2.2 mm Nano-Free™ DSBGA (YZH)

• Wireless or Cellular Handsets and PDAs
• Portable Navigation Devices
• Portable DVD Players
• Notebook PCs
• Portable Radios
• Portable Games
• Educational Toys
• USB Speakers

1

TPA2016D2 Pinout

Package: DSBGA (16) 2.20 mm × 2.20 mm

Notes

• Pin numbering follows the DSBGA grid layout: columns 1–4 (left to right), rows A–D (top to bottom)
• AVDD and AGND are analog supply pins; PVDDR, PVDDL, and PGND are power supply decoupling/ground pins
• SCL and SDA are I²C interface pins for device control and configuration
• SDZ is an active-low shutdown pin
• All input and output pins are differential pairs for stereo audio processing

at TA = 25°C, VDD = 3.6 V, SDZ = 1.3 V, and RL = 8 Ω + 33 μ H (unless otherwise noted).

over operating free-air temperature range (unless otherwise noted). (1)

Copyright © 2016, Texas Instruments Incorporated

• (1) Circuit traces from NSMD defined PWB lands should be 75 μ m to 100 μ m wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
• (2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.
• (3) Recommend solder paste is Type 3 or Type 4.
• (4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
• (5) Solder mask thickness should be less than 20 μ m on top of the copper circuit pattern
• (6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control.
• (7) Trace routing away from DSBGA device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces.

Figure 45. Land Pattern Dimensions