TJA1051T/3,118

Part: NXP Semiconductors TJA1051

Type: High-speed CAN transceiver

Key Specs:

• Supply voltage (VCC): 4.5 V to 5.5 V
• Data rates: up to 5 Mbit/s
• ESD voltage (CANH and CANL): -8 kV to +8 kV
• Virtual junction temperature (Tvj): -40 °C to +150 °C
• Supply current (ICC, Normal mode, bus recessive): 2.5 mA (min), 5 mA (typ), 10 mA (max)
• Supply current (ICC, Normal mode, bus dominant): 20 mA (min), 50 mA (typ), 70 mA (max)
• VIO supply voltage: 2.8 V to 5.5 V

Features:

• Ideal passive behavior to the CAN bus when the supply voltage is off
• TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with supply voltages from 3 V to 5 V
• ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
• Suitable for 12 V and 24 V systems
• Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
• EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very low-current Off mode
• Functional behavior predictable under all supply conditions
• Transceiver disengages from the bus when not powered up (zero load)
• High ElectroStatic Discharge (ESD) handling capability on the bus pins
• Bus pins protected against transients in automotive environments
• Transmit Data (TXD) dominant time-out function
• Undervoltage detection on pins VCC and VIO
• Thermally protected
• AEC-Q100 qualified

Applications:

• High-speed CAN applications in the automotive industry
• All types of HS-CAN networks (in nodes that do not require a standby mode with wake-up capability via the bus)

Package:

• SO8: plastic small outline package; 8 leads; body width 3.9 mm
• HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 × 3 × 0.85 mm

2.1 General

• ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
• Timing guaranteed for data rates up to 5 Mbit/s in the CAN FD fast phase
• Suitable for 12 V and 24 V systems
• Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
• VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V microcontrollers (available in SO8 and very small HVSON8 packages respectively)
• EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very low-current Off mode
• Available in SO8 package or leadless HVSON8 package (3.0 mm 3.0 mm) with improved Automated Optical Inspection (AOI) capability
• Dark green product (halogen free and Restriction of Hazardous Substances (RoHS) compliant)
• AEC-Q100 qualified

2.2 Low-power management

• Functional behavior predictable under all supply conditions
• Transceiver disengages from the bus when not powered up (zero load)

2.3 Protection

• High ElectroStatic Discharge (ESD) handling capability on the bus pins
• Bus pins protected against transients in automotive environments
• Transmit Data (TXD) dominant time-out function
• Undervoltage detection on pins VCC and VIO
• Thermally protected

3. Quick reference data

Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk.

Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published athttp://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

Table 3. Pin description

[1] HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is recommended that the exposed center pad also be soldered to board ground.

Table 6. Thermal characteristics

According to IEC 60747-1.