TCK107AG
Load Switch ICThe TCK107AG is a load switch ic from Toshiba. View the full TCK107AG datasheet below including key specifications, electrical characteristics, absolute maximum ratings.
Key Specifications
| Parameter | Value |
|---|---|
| Input Voltage Range | 1.1V to 5.5V |
Overview
Part: TCK106AG, TCK107AG, TCK108AG — TOSHIBA
Type: Load Switch IC
Description: 1.1–5.5 V input, 1.0 A load switch IC with slew rate control driver, featuring low ON resistance (34 mΩ typ. at 5.0 V, -0.5 A) and available in an ultra-small WCSP4D package.
Operating Conditions:
- Supply voltage: 1.1 to 5.5 V
- Operating temperature: -40 to 85 °C
- Max output current: 1.0 A
Absolute Maximum Ratings:
- Max supply voltage: 6.0 V (VIN, VCT)
- Max continuous current: 1.0 A
- Max junction temperature: 150 °C
- Max storage temperature: 150 °C
Key Specs:
- ON resistance: 34 mΩ typ. (VIN = 5.0 V, IOUT = -0.5 A)
- ON resistance: 42 mΩ typ. (VIN = 3.3 V, IOUT = -0.5 A)
- ON resistance: 71 mΩ typ. (VIN = 1.8 V, IOUT = -0.5 A)
- Quiescent current (ON state): 110 nA typ. (VIN = VCT = 5.5 V, IOUT = 0 mA)
- Standby current (OFF state): 65 nA typ. (VIN = 5.5 V, VCT = 0 V, VOUT = OPEN)
- VOUT rise time: 130 μs typ. (VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF)
- VOUT fall time (TCK107AG, TCK108AG): 25 μs typ. (VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF)
- Turn on delay: 100 μs typ. (VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF)
Features:
- Low ON resistance
- Low Quiescent current
- High output current: IOUT = 1.0 A
- Wide input voltage operation: VIN = 1.1 to 5.5 V
- Built-in Slew rate control driver
- Built-in Auto-discharge (TCK107AG and TCK108AG)
- Active High and Pull down connection between CONTROL and GND (TCK106AG and TCK107AG)
- Active Low (TCK108AG)
- Ultra small package : WCSP4D
Applications:
- Portable applications
- Cellular phone
Package:
- WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm)
Pin Configuration
Index
Start of commercial production 2015-06
Weight: 0.79 mg (typ.)
Electrical Characteristics
| Characteristics | Symbol | Test Condition | Test Condition | Min | Typ. | Max | Unit |
|---|---|---|---|---|---|---|---|
| Quiescent current (ON state) | IQ | VIN = VCT = 5.5 V, I OUT = 0 mA | TCK106AG TCK107AG | - | 110 | 230 | nA |
| Quiescent current (ON state) | VIN = 5.5 V, VCT = 0 V, I OUT = 0 mA | TCK108AG | - | 110 | 230 | nA | |
| Standby current (OFF state) | I Q(OFF) | VIN = 5.5 V, VCT = 0 V, VOUT = OPEN (Note 4) | TCK106AG TCK107AG | - | 65 | 150 | nA |
| Standby current (OFF state) | VIN = VCT = 5.5 V, VOUT = OPEN (Note 4) | TCK108AG | - | 65 | 150 | nA | |
| Switch leakage current( OFF state) | I SD(OFF) | VIN = 5.5 V, VCT = 0 V, VOUT = GND | TCK106AG TCK107AG | - | 14 | 1000 | nA |
| Switch leakage current( OFF state) | VIN = VCT = 5.5 V, VOUT = GND | TCK108AG | - | 14 | 1000 | nA | |
| On resistance | RON | VIN = 5.0 V, I OUT = -0.5 A | VIN = 5.0 V, I OUT = -0.5 A | - | 34 | 55 | m Ω |
| On resistance | VIN = 3.3 V, I OUT = -0.5 A | VIN = 3.3 V, I OUT = -0.5 A | - | 42 | 68 | m Ω | |
| On resistance | VIN = 1.8 V, I OUT = -0.5 A | VIN = 1.8 V, I OUT = -0.5 A | - | 71 | 105 | m Ω | |
| On resistance | VIN = 1.2 V, I OUT = -0.2 A | VIN = 1.2 V, I OUT = -0.2 A | - | 139 | 220 | m Ω | |
| On resistance | VIN = 1.1 V, I OUT = -0.2 A | VIN = 1.1 V, I OUT = -0.2 A | - | 176 | - | m Ω | |
| Discharge on resistance | RSD | - ( TCK107AG and TCK108AG) | - ( TCK107AG and TCK108AG) | - | 100 | - | Ω |
Note 4: Except ISD(OFF) OFF-state switch current
Absolute Maximum Ratings
| Characteristics | Symbol | Rating | Rating | Rating | Unit |
|---|---|---|---|---|---|
| Input voltage | VIN | -0.3 to 6.0 | -0.3 to 6.0 | -0.3 to 6.0 | V |
| Control voltage | VCT | -0.3 to 6.0 | -0.3 to 6.0 | -0.3 to 6.0 | V |
| Output voltage | VOUT | -0.3 to VIN +0.3 | -0.3 to VIN +0.3 | (Note 1) | V |
| Output current | I OUT | DC | 1.0 | A | |
| Power dissipation | PD | 800 | 800 | (Note 2) | mW |
| Operating temperature range | T opr | - 40 to 85 | - 40 to 85 | ° C | |
| Junction temeperature | Tj | 150 | 150 | ° C | |
| Storage temperature | T stg | - 55 to 150 | - 55 to 150 | ° C |
Note : Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ('Handling Precautions'/'Derating Concept and Methods') and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Note 1 : VIN +0.3 ≤ 6.0 V
Note 2: Rating at mounting on a board
(Glass epoxy board dimension: 40 mm x 40 mm, both sides of board Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50% Through hole: diameter 0.5 mm x 28)
Typical Application
The figure below shows configuration example for TCK106AG, TCK107AG and TCK108AG.
Package Information
WCSP4D
Unit: mm
Weight : 0.79 mg ( typ.)
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