SY6970
Synchronous Buck ChargerThe SY6970 is a synchronous buck charger from Silergy Corp.. View the full SY6970 datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Silergy Corp.
Category
Synchronous Buck Charger
Overview
Part: SY6970QCC — Silergy Corp.
Type: Fully-integrated switching battery charger with system power path management
Description: 5A, single-cell Li-Ion/Li-polymer switching battery charger with I2C control, USB detection, OTG, and power path management, supporting 3.9V-14V input and up to 2.4A OTG current.
Operating Conditions:
- Supply voltage: 3.9V–14V
- Operating temperature: -40°C to +100°C
- Junction temperature: -40°C to 125°C
- Charge voltage: 3.84–4.608V
Absolute Maximum Ratings:
- Max supply voltage (BUS, PMID, LX): +18V
- Max continuous current (BATFET Discharge): 9A
- Max junction temperature: +150°C
- Max storage temperature: -65°C to +150°C
Key Specs:
- BUS Operating Range: 3.9V to 14V
- Input Current Limit Range: 100mA to 3250mA
- Battery Discharge Over-current Threshold: 9A
- Junction Temperature Regulation Accuracy: 120°C (TREG bits=11)
- Charge Voltage Regulation: ±0.5%
- Charge Current Regulation: ±7%
- OTG Output Regulation in Boost Mode: ±1%
- Battery Discharge Current (High-Z Mode, BATFET enabled): 32 μA (Typ, TJ=-40°C to 85°C)
Features:
- High Efficiency 5A 1.5MHz Buck Mode Charger
- Support 3.9V-14V Input Voltage Range
- Programmable IDPM/VDPM to Support the USB and Adapter
- Support USB SDP/DCP/CDP and Non-Standard Adapter Detection
- 3.84-4.608V Adjustable Charge Voltage
- Support Narrow VDC Power Path Management
- JEITA Compliance
- Maximum 2.4A 500KHz/1.5MHz Boost OTG Current
- Battery Monitor for Voltage, Temperature and Charge Current Measurements
- Full BATFET Control to Support Shipping Mode, Wake Up, and System Reset
- Up to 9A Battery Discharge Current
- Safety features: Battery Temperature Sensing, Charging Safety Timer, Thermal Regulation and Shutdown, Input/System Over-voltage Protection, MOSFET Over-current Protection
- Low Battery Leakage Current and Support Shipping Mode
- 4mm x 4mm QFN-24 Package
Applications:
- Smart Phone
- Tablet PC
- Power Bank
- Portable Internet Devices
Package:
- QFN4x4-24
Features
- High Efficiency 5A 1.5MHz Buck Mode Charger
- -Support 3.9V-14V Input Voltage Range
- -Programmable IDPM/VDPM to Support the USB and Adapter
- -Support USB SDP/DCP/CDP and NonStandard Adapter Detection
- -3.84-4.608V Adjustable Charge Voltage
- -Support Narrow VDC Power Path Management
- -JEITA Compliance
- -±0.5% Charge Voltage Regulation
- -±7% Charge Current Regulation
- -Accelerate Charge Time by Battery Path Impedance Compensation.
- -Charge Status Outputs for LED or Host Processor
- Maximum 2.4A 500KHz/1.5MHz Boost OTG Current
- -4.55-5.51V Adjustable OTG Output Voltage
- -Selectable OTG Output Current Limit
- -Up to 2.4A OTG Current Limit on BUS
- -± 1% Output Regulation in Boost Mode
- Battery Monitor for Voltage, Temperature and Charge Current Measurements
- Full BATFET Control to Support Shipping Mode, Wake Up, and System Reset
- Up to 9A Battery Discharge Current
- Safety
- -Battery Temperature Sensing for Charge and Boost Mode
- -Battery Charging Safety Timer
- -Thermal Regulation and Thermal Shutdown
- -Input/System Over-voltage Protection
- -MOSFET Over-current Protection
- Low Battery Leakage Current and Support Shipping Mode
- 4mm x 4mm QFN-24 Package
Applications
- Smart Phone
- Tablet PC
- Power Bank
- Portable Internet Devices
Pin Configuration
| Pin Name | Pin Number | Pin Description |
|---|---|---|
| BUS | 1 | Charger power input pin. Connect a 1μF ceramic capacitor from BUS to PGND as close as possible to the IC. |
| DP | 2 | USB identification port. USB detection strategy is compliant with BC1.2. SDP, CDP, DCP and adapter port can be identified according to the detection results thru DP/DM pins. |
| DM | 3 | USB identification port. USB detection strategy is compliant with BC1.2. SDP, CDP, DCP and adapter port can be identified according to the detection results thru DP/DM pins. |
| STAT | 4 | Open drain charge status indication pin. Pull up to a logic rail via 10kΩ resistor. STAT pin low indicates charge in progress; high indicates charge done or charge disabled. When any charge fault occurs, STAT pin blinks at 1Hz. The stat pin function can be disabled by setting STAT_DIS bit. |
| SCL | 5 | I 2 C Interface clock pin. Pull up to a logic rail via 10kΩ resistor. |
| SDA | 6 | I 2 C Interface data pin. Pull up to a logic rail via 10kΩ resistor. |
| INT | 7 | Open-drain Interrupt Output. Pull up to a logic rail via 10kΩ resistor. The INT pin generates active low, 256us pulse to notify the host about charge status and charge fault. |
| OTG | 8 | Boost mode active high enable pin. Boost mode is enabled when REG03[5]=1 and OTG pin is high. |
| /CE | 9 | Charge mode active low enable pin. Battery charging is enabled when REG03[4]=1 and /CE pin =Low. /CE pin must be pulled high or low. |
| ILIM | 10 | ILIM pin sets the maximum input current limit. A resistor is connected from ILIM pin to ground to set the maximum limit as I INMAX = K ILIM /R ILIM . The actual input current limit is the lower one set by ILIM and by I 2 C REG00[5:0]. The ILIM pin function can be disabled by setting EN_ILIM bit to 0 |
| NTC | 11 | Connect a resistor divider from REGN to NTC to GND to achieve battery |
© 2019 Silergy Corp. All Rights Reserved.
| thermal protection. Charge or discharge suspends when NTC pin is out of range. Recommend 103AT-2 thermistor. | ||
|---|---|---|
| /QON | 12 | BATFET enables control in shipping mode and BATFET reset function. When BATFET is in shipping mode, logic high to low transition on this pin with minimum of T QON_1 low level turns on BATFET to exit shipping mode. This pin is internally pulled up to maintain default high logic. When BUS is not plugged-in, a logic low of T QON_RST (typical 10s) resets system power by turning BATFET off for T BATFET_RST (typical 3s) and then re- enable BATFET. |
| BAT | 13,14 | Battery voltage sense pin. Used as battery constant voltage control and battery voltage protections. Connect at least 10μF ceramic capacitor to the BAT pin. |
| SYS | 15,16 | System connection point. The internal BATFET is connected between BAT and SYS. When the battery falls below the minimum system voltages, switch-mode converter will keep SYS above the minimum system voltage. |
| PGND | 17,18 | Power ground connection. On PCB layout, connect this pin directly to ground connection of input and output capacitors. |
| LX | 19,20 | Switching node pin. Connect this pin to external inductor. |
| BST | 21 | HSFET driver positive supply. Connect a 47nF bootstrap capacitor between LX and BST. |
| REGN | 22 | LSFET driver positive supply. Connect a 4.7μF ceramic capacitor between REGN and analog GND. The capacitor should be placed closely to the IC. REGN also serves as bias rail of NTC pin. |
| PMID | 23 | Connect this pin to the drain of the reverse blocking MOSFET and the drain of HSFET. Connect a 6.8μ F capacitor between PMID and PGND. The capacitor should be placed closely to the IC. |
| DSEL | 24 | Open-drain DP/DM multiplexer selection control. Pull up to a logic rail via 10kΩ resistor. During input source type detection, the pin outputs low to indicate DP/DM detection is in progress. When detection is done, the pin keeps low if HVDCP is detected. The pin returns to float and pulls high by resistor when other input source type is detected. |
| Exposed pad | - | Exposed pad beneath the IC for heat dissipation. Always solder exposed pad to the board, and have vias on the power pad plane star-connecting to PGND and ground plane for high-current power converter. |
© 2019 Silergy Corp. All Rights Reserved.
Electrical Characteristics
(VBUS_UVLOZ<VBUSVBAT+VSLEEP, TA=25° C for typical values unless other noted.)
| Parameter | Symbol | Test Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| QUIESCENT CURRENTS | QUIESCENT CURRENTS | QUIESCENT CURRENTS | QUIESCENT CURRENTS | QUIESCENT CURRENTS | QUIESCENT CURRENTS | QUIESCENT CURRENTS |
| Battery Discharge Current (BAT) | I BAT | V BUS <V BUS_UVLOZ , V BAT =4.2 V, leakage between BAT and BUS | 5 | μA | ||
| Battery Discharge Current (BAT) | High-Z Mode, no BUS, battery monitor disabled, BATFET disabled, T J <85° C | 12 | μA | |||
| Battery Discharge Current (BAT) | High-Z Mode, no BUS, battery monitor disabled, BATFT enabled, T J =-40° C to 85° C | 32 | μA | |||
| Input Supply Current in High-Z Mode | I BUS_HIZ | V BUS =5V, battery monitor disabled, no battery, High-Z mode enabled | 15 | μA | ||
| Input Supply Current in High-Z Mode | V BUS =12V, battery monitor disabled, no battery, High-Z mode enabled | 25 | μA | |||
| Input Supply Current (BUS) | I BUS | V BUS >V BUS_UVLOZ , V BUS >V BAT , converter not switching | 1.5 | 3 | mA | |
| Input Supply Current (BUS) | I BUS | V BUS >V BUS_UVLOZ , V BUS >V BAT, converter switching, V BAT =3.2V, I SYS =0A | 3 | mA | ||
| Input Supply Current (BUS) | V BUS >V BUS_UVLOZ , V BUS >V BAT , converter switching, charge disabled,V BAT =3.8V, I SYS =0A | 3 | mA | |||
| Battery Discharge Current in Boost Mode | I OTGBOOST | V BAT =4.2V, Boost mode, I BUS =0A, converter switching | 3.5 | mA | ||
| BUS/BATPOWERUP | BUS/BATPOWERUP | BUS/BATPOWERUP | BUS/BATPOWERUP | BUS/BATPOWERUP | BUS/BATPOWERUP | BUS/BATPOWERUP |
| BUS Operating Range | V BUS_OP | 3.9 | 14 | V | ||
| BUS for Active IC and I 2 C, No Battery | V BUS_UVLOZ | V BUS rising | 3.6 | V | ||
| Sleep Mode Falling Threshold | V SLEEP | V BUS falling,V BUS -V BAT | 65 | mV | ||
| Sleep Mode Rising Threshold | V SLEEPZ | V BUS rising,V BUS -V BAT | 250 | mV | ||
| BUS Over-voltage Rising Threshold | V ACOV | V BUS rising | 14.3 | V | ||
| BUS Over-voltage Recovery Threshold | V ACOV_RC | V BUS falling | 300 | mV | ||
| Battery Depletion Threshold | V BAT_DPL | V BAT falling V rising | 2.3 2.5 | V | ||
| Battery Depletion Recovery Threshold | V BAT_DPLZ | BAT | V |
© 2019 Silergy Corp. All Rights Reserved.
© 2019 Silergy Corp. All Rights Reserved.
Absolute Maximum Ratings
- Others ------------------------------------------------------------------------------------------------------------ -0.3V to +6V
- Package Thermal Resistance (Notes 2) QFN4x4-24 θ JA ----------------------------------------------------------------------------------------- 33.3° C/W QFN4x4-24 θ JC ----------------------------------------------------------------------------------------- 29.7° C/W
- Junction Temperature Range ----------------------------------------------------------------------------- -40° C to C Operating Temperature Range --------------------------------------------------------------------------- -40° C to +100°
- +150° C
- Storage Temperature -------------------------------------------------------------------------------------- -65° C to +150°
- C Lead Temperature (Soldering, 10s) -------------------------------------------------------------------------------- +300° C
- ESD Susceptibility HBM(Human Body Mode) ---------------------------------------------------------------------------------------------
- 2kV MM(Machine Mode) --------------------------------------------------------------------------------------------------- 200V
- Recommended Operating Conditions (Note 3)
- BUS, PMID, LX ------------------------------------------------------------------------------------------------- 0V to +16V Others ------------------------------------------------------------------------------------------------------------- 0V to
- +5.5V
- Junction Temperature Range ------------------------------------------------------------------------------ -40° C to 125° C
- Temperature Range ------------------------------------------------------------------------------- -40° C to 85° C
- Ambient
© 2019 Silergy Corp. All Rights Reserved.
Thermal Information
The SY6970 monitors the internal junction temperature TJ to avoid overheat the chip and limits the IC surface temperature. When the internal junction temperature exceeds the preset limit (TREG bits), the device will lower down the charge current. The wide thermal regulation range from 60° C to 120° C allows the user to optimize the system thermal performance.
During thermal regulation, the actual charging current is usually below the programmed battery charging current. Therefore, termination is disabled, the safety timer runs at half the clock rate, and the status register THERM_STAT goes high.
Additionally, the device has thermal shutdown to turn off the converter and BATFET. The fault register CHRG_FAULT is 10 and an INT is asserted to the host. The BATFET and converter are enabled to recover when the IC temperature is below TTSD_HYS.
Typical Application
© 2019 Silergy Corp. All Rights Reserved.
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| SY6970QCC | Silergy Corp. | QFN4x4-24 |
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