SX1308IMLTRT
LoRa Concentrator Digital Baseband ChipThe SX1308IMLTRT is a lora concentrator digital baseband chip from Semtech. View the full SX1308IMLTRT datasheet below including electrical characteristics, absolute maximum ratings.
Manufacturer
Semtech
Category
RF / WirelessOverview
Part: SX1308
Type: LoRa Digital Baseband Chip / Concentrator
Description: The SX1308 is a digital baseband chip and LoRa concentrator, designed for multi-channel, high-performance reception of LoRa packets with up to -139 dBm sensitivity and 70 dB CW interferer rejection. It emulates 49x LoRa demodulators and 1x (G)FSK demodulator.
Operating Conditions:
- IO supply voltage (VDDIO): 1.62 V to 3.6 V
- Core supply voltage (VDDCORE): 1.14 V to 1.98 V
- Operating temperature: -40
Features
- Up to -139 dBm sensitivity with SX1257 or SX1255 Tx/Rx front-end
- 70 dB CW interferer rejection at 1 MHz offset
- Able to operate with negative SNR
- CCR up to 9 dB
- Emulates 49x LoRa demodulators and 1x (G)FSK demodulator
- Dual digital Tx & Rx radio front-end interfaces
- 10 programmable parallel demodulation paths
- Dynamic data-rate adaptation (ADR)
- True antenna diversity or simultaneous dual-band operation
Applications
- Smart Metering
- Security Sensors Network
- Agricultural Monitoring
- Internet of Things (IoT)
Pin Configuration
- 1.1 Pins Placement and Circuit Marking
Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)
Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)
The ground paddle must be connected to ground potential through a large conductive plane that also serves for temperature dissipation.
Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)
Datasheet
Electrical Characteristics
The table below gives the specifications of the circuit within the Operating Conditions as indicated in 2.3 unless otherwise specified.
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Current Consumption | ||||||
| Current in idle mode | I VDDCORE,IDLE | 1.8V supply current in Idle mode 1 | 120 | 5000 | μA | |
| Current in idle mode | I VDDIO,IDLE | 3.3V supply current in idle mode | 1 | 2 | μA | |
| Current in medium active | I VDDCORE,MED | 1.8V supply current with 4 active paths | 330 | 600 | mA | |
| Current in medium active | I VDDIO,MED | 3.3V supply current with 4 active paths - no load | 5 | 10 | mA | |
| Current in full active | I VDDCORE,FULL | 1.8V supply current with 8 active paths | 550 | 800 | mA | |
| Current in full active | I VDDIO,FULL | 3.3V supply current with 8 active paths - no load | 5 | 10 | mA | |
| IO Pins levels | ||||||
| Logic low input threshold | VIL | '0' logic input | 0.4 | V | ||
| Logic high input threshold | VIH | '1' logic input | V DDIO - 0.4 | V | ||
| Logic low output level | VOL | '0' logic output,2mA sink | VSS | VSS + 0.4 | V | |
| Logic high output level | VOH | '1' logic output,2mA source | V DDIO - 0.4 | V DDIO | V |
Table 5: Electrical Specifications
Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Operation outside the parameters specified in the Operating Conditions section is not implied.
Table 2: Absolute Maximum Ratings
| Parameter | Symbol | Conditions | Value |
|---|---|---|---|
| IO power supply to VSS | V DDIO,ABSMAX | -0.5 V to 4.0 V | |
| Core power supply to VSS | V DDCORE,ABSMAX | -0.5 V to 2.0 V | |
| Storage temperature | T J,STORE | -50 °C to 150 °C | |
| Junction temperature | T J,ABSMAX | -40 °C to 125 °C | |
| Pin voltage on IO and Clock pins | V DPIN,ABSMAX | -0.3 V to VDDIO + 0.3 V | |
| Peak reflow temperature | T PKG | 260 °C | |
| Latchup | I LUP | JESD78D, class I | +/-100mA |
| Humidity | H R | 0 - 95% | |
| ESD | HBM | Human Body Model JESD22-A114 CLASS 2 | 2 kV |
| CDM | Charged Device Model JESD22-C101 CLASS III | 300 V |
Thermal Information
Thermal impedance with natural convection is 16.4 °C/W. Thermal impedance with heat sink on package bottom is 0.18 °C/W.
The measurement was made with chip paddle soldered to PCB ground plane with minimum 100 cm² air exposed area and heat sink per JESD51-7. The package is mounted on a 4-layer (2S2P) standard JEDEC board.
Datasheet
Package Information
Figure 18: Package Dimensions
Related Variants
The following components are covered by the same datasheet.
| Part Number | Manufacturer | Package |
|---|---|---|
| SX1308 | Semtech | — |
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