SX1308IMLTRT

LoRa Concentrator Digital Baseband Chip

The SX1308IMLTRT is a lora concentrator digital baseband chip from Semtech. View the full SX1308IMLTRT datasheet below including electrical characteristics, absolute maximum ratings.

SX1308IMLTRT shares its datasheet with SX1308, whose page lists every part number it covers.

Official SX1308IMLTRT datasheet (PDF) — the source this page was extracted from.

Manufacturer

Semtech

SX1308IMLTRT Overview

Part: SX1308

Type: LoRa Digital Baseband Chip / Concentrator

Description: The SX1308 is a digital baseband chip and LoRa concentrator, designed for multi-channel, high-performance reception of LoRa packets with up to -139 dBm sensitivity and 70 dB CW interferer rejection. It emulates 49x LoRa demodulators and 1x (G)FSK demodulator.

Operating Conditions:

IO supply voltage (VDDIO): 1.62 V to 3.6 V
Core supply voltage (VDDCORE): 1.14 V to 1.98 V
Operating temperature: -40

SX1308IMLTRT Features

Up to -139 dBm sensitivity with SX1257 or SX1255 Tx/Rx front-end
70 dB CW interferer rejection at 1 MHz offset
Able to operate with negative SNR
CCR up to 9 dB
Emulates 49x LoRa demodulators and 1x (G)FSK demodulator
Dual digital Tx & Rx radio front-end interfaces
10 programmable parallel demodulation paths
Dynamic data-rate adaptation (ADR)
True antenna diversity or simultaneous dual-band operation

SX1308IMLTRT Applications

Smart Metering
Security Sensors Network
Agricultural Monitoring
Internet of Things (IoT)

SX1308IMLTRT Pin Configuration

1.1 Pins Placement and Circuit Marking

Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)

Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)

The ground paddle must be connected to ground potential through a large conductive plane that also serves for temperature dissipation.

Figure 1: Top View of SX1308 Package with 64 Pins & Exposed Ground Paddle (Package Bottom)

Datasheet

SX1308IMLTRT Electrical Characteristics

The table below gives the specifications of the circuit within the Operating Conditions as indicated in 2.3 unless otherwise specified.

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Current Consumption
Current in idle mode	I VDDCORE,IDLE	1.8V supply current in Idle mode 1		120	5000	μA
Current in idle mode	I VDDIO,IDLE	3.3V supply current in idle mode		1	2	μA
Current in medium active	I VDDCORE,MED	1.8V supply current with 4 active paths		330	600	mA
Current in medium active	I VDDIO,MED	3.3V supply current with 4 active paths - no load		5	10	mA
Current in full active	I VDDCORE,FULL	1.8V supply current with 8 active paths		550	800	mA
Current in full active	I VDDIO,FULL	3.3V supply current with 8 active paths - no load		5	10	mA
IO Pins levels
Logic low input threshold	VIL	'0' logic input	0.4			V
Logic high input threshold	VIH	'1' logic input			V DDIO - 0.4	V
Logic low output level	VOL	'0' logic output,2mA sink	VSS		VSS + 0.4	V
Logic high output level	VOH	'1' logic output,2mA source	V DDIO - 0.4		V DDIO	V

Table 5: Electrical Specifications

SX1308IMLTRT Absolute Maximum Ratings

Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Operation outside the parameters specified in the Operating Conditions section is not implied.

Table 2: Absolute Maximum Ratings

Parameter	Symbol	Conditions	Value
IO power supply to VSS	V DDIO,ABSMAX		-0.5 V to 4.0 V
Core power supply to VSS	V DDCORE,ABSMAX		-0.5 V to 2.0 V
Storage temperature	T J,STORE		-50 °C to 150 °C
Junction temperature	T J,ABSMAX		-40 °C to 125 °C
Pin voltage on IO and Clock pins	V DPIN,ABSMAX		-0.3 V to VDDIO + 0.3 V
Peak reflow temperature	T PKG		260 °C
Latchup	I LUP	JESD78D, class I	+/-100mA
Humidity	H R		0 - 95%
ESD	HBM	Human Body Model JESD22-A114 CLASS 2	2 kV
	CDM	Charged Device Model JESD22-C101 CLASS III	300 V

SX1308IMLTRT Thermal Information

Thermal impedance with natural convection is 16.4 °C/W. Thermal impedance with heat sink on package bottom is 0.18 °C/W.

The measurement was made with chip paddle soldered to PCB ground plane with minimum 100 cm² air exposed area and heat sink per JESD51-7. The package is mounted on a 4-layer (2S2P) standard JEDEC board.

Datasheet

SX1308IMLTRT Package Information

Figure 18: Package Dimensions

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All RF / Wireless datasheets All Semtech datasheets (15)

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