SX1308

General Description

Manufacturer

unknown

Overview

Part: SX1308

Type: LoRa Concentrator Digital Baseband Chip

Key Specs:

  • Sensitivity: Up to -139 dBm (with SX1257 or SX1255 Tx/Rx front-end)
  • CW Interferer Rejection: 70 dB at 1 MHz offset
  • CCR: Up to 9 dB
  • Demodulators: Emulates 49x LoRa and 1x (G)FSK demodulators

Features:

  • Able to operate with negative SNR
  • Dual digital Tx & Rx radio front-end interfaces
  • 10 programmable parallel demodulation paths
  • Dynamic data-rate adaptation (ADR)
  • True antenna diversity or simultaneous dual-band operation

Applications:

  • Smart Metering
  • Security Sensors Network
  • Agricultural Monitoring
  • Internet of Things (IoT)

Package:

  • 64-pin package with exposed ground paddle

Features

  • Up to -139 dBm sensitivity with SX1257 or SX1255 Tx/Rx front-end
  • 70 dB CW interferer rejection at 1 MHz offset
  • Able to operate with negative SNR
    • CCR up to 9 dB
  • Emulates 49x LoRa demodulators and 1x (G)FSK demodulator
  • Dual digital Tx & Rx radio front-end interfaces
  • 10 programmable parallel demodulation paths
  • Dynamic data-rate adaptation (ADR)
  • True antenna diversity or simultaneous dual-band operation

Applications

  • Smart Metering
  • Security Sensors Network
  • Agricultural Monitoring
  • Internet of Things (IoT)

Electrical Characteristics

The table below gives the specifications of the circuit within the Operating Conditions as indicated in 2.3 unless otherwise specified.

ParameterSymbolConditionsMinTypMaxUnit
Current Consumption
Current in idle modeIVDDCORE,IDLE1.8V supply current in Idle
mode1
1205000uA
IVDDIO,IDLE3.3V supply current in idle
mode
12uA
Current in medium activeIVDDCORE,MED1.8V supply current with 4
active paths
330600mA
IVDDIO,MED3.3V supply current with 4
active paths – no load
510mA
Current in full activeIVDDCORE,FULL1.8V supply current with 8
active paths
550800mA
IVDDIO,FULL3.3V supply current with 8
active paths – no load
510mA
IO Pins levels
Logic low input thresholdVIL"0" logic input0.4V
Logic high input thresholdVIH"1" logic inputVDDIO
– 0.4
V
Logic low output levelVOL"0" logic output, 2 mA sinkVSSVSS +
0.4
V
Logic high output levelVOH"1" logic output, 2 mA
source
VDDIO –
0.4
VDDIOV

Table 5: Electrical Specifications

Absolute Maximum Ratings

Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may affect device reliability. Operation outside the parameters specified in the Operating Conditions section is not implied.

ParameterSymbolConditionsValue
IO power supply to VSSVDDIO,ABSMAX-0.5 V to 4.0 V
Core power supply to VSSVDDCORE,ABSMAX-0.5 V to 2.0 V
Storage temperatureTJ,STORE-50 °C to 150 °C
Junction temperatureTJ,ABSMAX-40 °C to 125 °C
Pin voltage on IO and Clock pinsVDPIN,ABSMAX-0.3 V to VDDIO + 0.3 V
Peak reflow temperatureTPKG260 °C
LatchupILUPJESD78D, class I+/-100 mA
HumidityHR0 – 95 %
ESDHBMHuman Body Model2 kV
JESD22-A114 CLASS 2
CDMCharged Device Model300 V
JESD22-C101 CLASS III
Table 2: Absolute Maximum Ratings

2.2 Constraints on External

Circuit is expected to be used with the following external conditions.

ParameterSymbolConditionsMinTypMaxUnit
Radio ADC samples clock inputXTAL32FClock for data communication32MHz
frequencywith Tx†
ADC sample clock frequencyXTAL32T-10+10ppm
tolerance
High speed processing clockHSC_FClock for data processing130133150MHz
Load on IO pinsCLOP025pF
Notes:
† The data communication IOs are A_I_RX, A_Q_RX, B_X_RX, B_Q_RX and clock signal is CLK32M
Table 3: Externals

2.3 Operating Conditions

The circuit will operate full specs within the following operating conditions.

Parameter†SymbolConditionsMinTypMaxUnit
Digital IO supplyVDDIOOperating Conditions for3.03.6V
Electrical Specification
Digital core supplyVDDCOREOperating Conditions for1.751.85V
Electrical Specification
Ambient operating temperatureTAWith chip paddle soldered to070°C
PCB ground plan with
minimum 100 cm2 air
exposed area and heat sink
Table 4: Operating Conditions for Electrical Specifications

Thermal Information

Thermal impedance with natural convection is 16.4 °C/W. Thermal impedance with heat sink on package bottom is 0.18 °C/W.

The measurement was made with chip paddle soldered to PCB ground plane with minimum 100 cm2 air exposed area and heat sink per JESD51-7. The package is mounted on a 4-layer (2S2P) standard JEDEC board.

Data on this page is extracted from publicly available manufacturer datasheets using automated tools including AI. It may contain errors or omissions. Always verify specifications against the official manufacturer datasheet before making design or purchasing decisions. See our Terms of Service. Rights holders can submit a takedown request.

Get structured datasheet data via API

Get started free